GIGABYTE has a little surprise as it just listed a new B850 motherboard on its website, named B850M Force. This standard microATX form-factor AM5 motherboard marks the return of GIGABYTE's SOC Force series (i.e., GA-Z170X-SOC Force or GA-Z97X-SOC Force) that "eons ago" delighted Intel users with its striking orange aesthetics. Going from the cold, full white designs of its B850 Ice motherboards such as B850 Aorus Stealth Ice or B850M Eagle Ice series launched in January, this newly launched Force motherboard series packs a complete set of features tailored for a variety of users as well as retro enthusiasts from the Intel Z97 and Z170 times a decade ago.

The GIGABYTE B850 Force microATX motherboard is built around AMD's B850 chipset and supports the full range of AMD Ryzen processors for the AM5 socket, including the latest 9000 series CPUs. The board has an 8+2+2 phase digital VRM with heatsinks and supports up to 128 GB of DDR5 memory across two DIMM slots, with speeds up to overclocked 9600 MT/s (including AMD EXPO and XMP profiles). Storage connectivity consists of three M.2 slots supporting different PCIe configurations alongside four SATA 6 Gb/s connectors. Expansion capabilities include a PCIe x16 slot that supports PCIe 5.0 and an additional PCIe x4 slot from the chipset. Connectivity features include integrated Wi-Fi 6E with Bluetooth 5.3 (for the Wi-Fi 6E model), a 2.5 Gigabit Ethernet controller, and multiple USB ports including USB 3.2 Gen 2 and USB-C connections. Alongside its orange appearance, the motherboard has another surprise: a PS/2 port for those who are truly into the retro theme. Display outputs consist of HDMI 2.1 supporting 4K at 60 Hz and DisplayPort 1.4 capable of 4K at 144 Hz (depending on the iGPU capabilities of the installed processor).

GIGABYTE at the 2025 Computex showed off the AI TOP Atom, a custom-design NVIDIA DGX Spark box. NVIDIA earlier today announced that it had opened up the DGX Spark compact AI supercomputer for custom designs, and the AI TOP Atom is one of many such custom designs. The box combines an NVIDIA GB10 "Grace Blackwell" GPU+CPU combo, with 128 GB of unified LPDDR5X memory, NVLink chip-to-chip interconnect for full memory/cache coherence, and a high bandwidth ConnectX-7 InfiniBand NIC letting you stack up additional DGX Spark boxes. The box offers up to 1,000 AI TOPS of compute power and is able to accelerate 70B and 200B parameter models. It's designed for AI-native localized software development.

Lenovo has announced the ThinkStation PGX, a compact, personal AI developer workstation. The ThinkStation PGX is ideal for AI researchers and developers, data scientists, practitioners, students, and application engineers who need a purpose-built, compact, and powerful AI desktop solution that works immediately out of the box. Built on the NVIDIA GB10 Grace Blackwell Superchip providing up to 1 PetaFlop (1000 TOPS) of AI performance, the ThinkStation PGX can tackle large generative AI models of up to 200 billion parameters. With 128 GB of coherent unified system memory, developers can experiment, fine-tune, or inference the latest generation of reasoning AI models. To double down on computing power, developers can connect two ThinkStation PGX systems together to work with even larger AI models up to 405 billion parameters.

The ThinkStation PGX comes preconfigured with the NVIDIA DGX OS, and the NVIDIA AI software stack, along with familiar tools and frameworks like PyTorch and Jupyter. Developers can instantly prototype, fine-tune, and inference large AI models from the desktop and seamlessly deploy to the data center or cloud. "By collaborating with NVIDIA to deliver a high-performance, yet compact device, Lenovo is empowering AI developers, researchers, data scientists, and students to accelerate their workloads and adoption of breakthrough innovation in generative AI."—Rob Herman, Vice President, Worldwide Workstation and Client AI Business at Lenovo.

MSI IPC, a global leader in industrial computing and AI-driven solutions, is set to unveil its latest innovations at COMPUTEX 2025, held from May 20 to 23 at the Taipei Nangang Exhibition Center. Visitors can explore MSI IPC's cutting-edge technologies at Booth J0506, Hall 1, 1F.

Introducing the EdgeXpert MS-C931: A Desktop AI Supercomputer
MSI IPC will unveil the EdgeXpert MS-C931, a desktop AI supercomputer built on the NVIDIA DGX Spark platform. Powered by the NVIDIA GB10 Grace Blackwell Superchip, the EdgeXpert MS-C931 delivers 1,000 AI TOPS FP4 performance, equipped with high-speed ConnectX 7 networking, 128 GB unified memory, and support for large language models. Designed for AI developers and researchers, it is ideal for applications in education, finance, and healthcare industries.

They say that the most difficult part of transportation planning is last-mile delivery. A network of warehouses and trucks can bring products within a mile of almost all customers, but logistical challenges and costs add up quickly in the process of delivering those goods to the right doors at the right time. There's a similar pattern in the AI space. Massive data center installations have empowered astonishing cloud-based AI services, but many researchers, developers, and data scientists need the power of an AI supercomputer to travel that last mile. They need machines that offer the convenience and space-saving design of a desktop PC, but go well above and beyond the capabilities of consumer-grade hardware, especially when it comes to available GPU memory.

Enter a new class of AI desktop supercomputers, powered by ASUS and NVIDIA. The upcoming ASUS AI supercomputer lineup, spearheaded by the ASUS ExpertCenter Pro ET900N G3 desktop PC and ASUS Ascent GX10 mini-PC, wield the latest NVIDIA Grace Blackwell superchips to deliver astounding performance in AI workflows. For those who need local, private supercomputing resources, but for whom a data center or rack server installation isn't feasible, these systems provide a transformative opportunity to seize the capabilities of AI.

As a global leader in digital drawing devices and solutions, Huion today announces the Kamvas Slate 11 and Kamvas Slate 13, siblings of the Kamvas Slate 10 Android tablet. This announcement demonstrates Huion's commitment to exploring new fields and expanding its product lineup.

Highlights preview
Kamvas Slate 11 & 13 are aimed at artists and note-takers who demand standalone creative equipment with high clarity, entertainment, and portability. For larger canvas lovers, Kamvas Slate 13 features a 12.7-inch 4:3 QHD (2176 x 1600) screen, offering more room for drawing. For users who prefer great portability, Kamvas Slate 11 has a 10.95-inch FHD+ (1920 x 1200) screen, making it easy to carry around for on-the-go use.

Huawei announced its CloudMatrix 384 system super node, which the company touts as its own domestic alternative to NVIDIA's GB200 NVL72 system, with more overall system performance but worse per-chip performance and higher power consumption. While NVIDIA's GB200 NVL72 uses 36 Grace CPUs paired with 72 "Blackwell" GB200 GPUs, the Huawei CloudMatrix 384 system employs 384 Huawei Ascend 910C accelerators to beat NVIDIA's GB200 NVL72 system. It takes roughly five times more Ascend 910C accelerators to deliver nearly twice the GB200 NVL system performance, which is not good on per-accelerator bias, but excellent on per-system level of deployment. SemiAnalysis argues that Huawei is a generation behind in chip performance but ahead of NVIDIA in scale-up system design and deployment.

When you look at individual chips, NVIDIA's GB200 NVL72 clearly outshines Huawei's Ascend 910C, delivering over three times the BF16 performance (2,500 TeraFLOPS vs. 780 TeraFLOPS), more on‑chip memory (192 GB vs. 128 GB), and faster bandwidth (8 TB/s vs. 3.2 TB/s). In other words, NVIDIA has the raw power and efficiency advantage at the chip level. But flip the switch to the system level, and Huawei's CloudMatrix CM384 takes the lead. It cranks out 1.7× the overall PetaFLOPS, packs in 3.6× more total HBM capacity, and supports over five times the number of GPUs and the associated bandwidth of NVIDIA's NVL72 cluster. However, that scalability does come with a trade‑off, as Huawei's setup draws nearly four times more total power. A single GB200 NVL72 draws 145 kW of power, while a single Huawei CloudMatrix 384 draws ~560 kW. So, NVIDIA is your go-to if you need peak efficiency in a single GPU. If you're building a massive AI supercluster where total throughput and interconnect speed matter most, Huawei's solution actually makes a lot of sense. Thanks to its all-to-all topology, Huawei has delivered an AI training and inference system worth purchasing. When SMIC, the maker of Huawei's chips, gets to a more advanced manufacturing node, the efficiency of these systems will also increase.

PNY today introduced the PRO Elite High Endurance microSD Flash Memory Cards, engineered for demanding recording in surveillance systems, dash cams, body cams, and other video monitoring devices. Built to deliver continuous recording capabilities and long-lasting performance under extreme conditions, these microSD cards are ideal for users who demand reliability, speed, and security. Available now for purchase through pny.com or amazon.com, with other retailer availability coming soon.

Designed for Continuous Video Recording
With storage options ranging from 64 GB - 512 GB, PRO Elite High Endurance microSD cards are optimized for continuous video capture - supporting up to 137,600 hours (over 15 years of recording & re-recording) of Full HD footage. A step above standard microSD cards, PRO Elite High Endurance cards are equipped with high endurance technology to adapt and better withstand the wear-and-tear of frequent writing and rewriting, ensuring that critical video footage or data is always saved and accessible. Increased durability makes these microSDs the ultimate storage solution for any video surveillance system, from security cameras, to dashcams, body cameras, doorbell cameras and more!

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce a new high-speed memory overclock DDR5 specification with an ultra-high kit capacity - DDR5-8000 CL44 with 128 GB (64 GB x2) kit capacity. This is the world's first DDR5 memory kit with 64 GB high-capacity modules to reach the extreme overclock level of DDR5-8000, setting a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

New Era of Overclocking High-Capacity DDR5 64 GB Modules
Engineered for high-capacity overclocked performance, the DDR5-8000 128 GB (64 GB x2) combines ultra-high memory speed with massive memory kit capacity, surpassing the previous module capacity maximum at 48 GB per module. At last, power users and content creators who seek overclock performance memory for capacity-hungry applications will have the ideal DDR5 memory solution. Refer to the validation screenshot below to see DDR5-8000 CL44-58-58 128 GB (64 GB x2) tested on the ASUS ROG CROSSHAIR X870E APEX motherboard with the AMD Ryzen 9 9950X desktop processor.

Over the past weekend, GMKtec's Weibo channel announced that pre-orders for its recently unveiled EVO-X2 mini PC model will start on April 7 (through JD.com), for customers located in China. Almost two weeks ago, the manufacturer boasted about its brand-new offering being the "world's first AI mini PC" equipped with AMD's Ryzen AI "Strix Halo" Max+ 395 APU. Extra international attention was gained, due to Lisa Su's autographing of a showcased unit during proceedings at the 2025 AI PC Innovation Summit (held on March 18, in Beijing). Pricing and availability were not mentioned during this press event, but GMKtec's Saturday (March 29) bulletin has revealed a (roughly) $2067 USD price point for the EVO-X2 launch model.

The manufacturer's blog entry stated that the: "EVO-X2 AI supercomputing host is coming, 128 GB + 2 TB priced at 14999 yuan, pricing reconstructs the desktop computing power boundary! Equipped with AMD Ryzen AI Max+ 395 flagship processor, 16-core 32-thread architecture with 5.1 GHz acceleration frequency, combined with 128 GB LPDDR5X memory and 2 TB high-speed storage, it can realize local deployment of 70 billion parameter large models, and AI performance exceeds NVIDIA's GeForce RTX 5090D graphics card." This potent compact AI-crunching solution is tempered by GMKtec's "innovative" Arctic Ocean cooling system. They advertise this design as using: "dual-turbofans and VC heat sinks to achieve silent heat dissipation at a peak power consumption of 140 W. The body adopts a recycled aluminium suspension design, equipped with HDMI, DP and USB4 interfaces, and supports Wi-Fi 6 + 2.5G network access." The brand has not yet announced an international release, but their EVO-X2 mini PC could face serious competition. Late last month, Framework debuted its Desktop product range—consisting of configurable 4.5L Mini-ITX systems—with a top-end Ryzen AI Max+ 395 (128 GB) model starting at $1999.

We dedicated a lot of our launch presentation of Framework Desktop to the Ryzen AI Max processor it uses, and for a good reason. These truly unique, ultra-high-performance parts are the culmination of decades of technology and architecture investments that AMD has made, going all the way back to their acquisition of ATI in 2006. For our first technical deep dive on Framework Desktop, we're going to go even deeper into Ryzen AI Max and what makes it a killer processor for gaming, workstation, and AI workloads.

What makes Ryzen AI Max special is a combination of three elements: full desktop-class Zen 5 CPU cores, a massive 40-CU Radeon RDNA 3.5 GPU, and a giant 256-bit LPDDR5x memory bus to feed the two, supporting up to 128 GB of memory. Chips and Cheese did an excellent technical overview of the processor with AMD that goes even deeper on this, and we'll pull out some of the highlights along with our own insights. We'll start with the CPUs. Ryzen AI Max supports up to 16 CPU cores split across two 4 nm FinFET dies that AMD calls CCDs. These dies are connected together using an extremely wide, low power, low latency bus across the package substrate. The CPUs are full Zen 5 cores with 512-bit FPUs and support for AVX-512, a vector processing instruction set otherwise only available on Intel's top end server CPUs. We're excited for you to see the multicore performance numbers these CPUs can do in our upcoming press review cycle!

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products - is pleased to introduce the MMB566, a high-performance micro ATX motherboard designed for demanding industrial and commercial applications. Powered by the 14th/13th/12th Gen Intel Core i9/i7/i5/i3 or Celeron processors with the Intel Q670E, R680E, or H610E chipset, the MMB566 delivers exceptional computing power and reliability. Designed for precision and durability, it excels in remote control and automated test equipment, ensuring accurate system monitoring and control. Its high processing power makes it ideal for data processing and analysis, while its robust design guarantees seamless operation in ATM applications. With versatile expandability and reliable performance, the MMB566 is a future-ready solution for industrial computing needs.

"Axiomtek's MMB566 is engineered to provide exceptional connectivity, flexibility, and long-term reliability for industrial and commercial applications," said Irene Su, Product Manager of the IDS Division at Axiomtek. "It features two 2.5GbE LAN ports, with optional 10GbE LAN ports available to meet customer-specific high-speed networking requirements. Designed for versatility, it offers a rich array of I/O options, including up to six SATA ports, six COM ports, and twelve USB ports, ensuring seamless integration with various peripheral devices. With support for TPM and Intel AMT, the MMB566 enhances security and remote management. Furthermore, its guaranteed 10-year supply makes it a reliable choice for embedded systems requiring long-term availability. Ultimately, with highly customizable service options, the MMB566 delivers optimized performance and long-term value across diverse applications."

Apple today introduced the faster, more powerful iPad Air with the M3 chip and built for Apple Intelligence. iPad Air with M3 brings Apple's advanced graphics architecture to iPad Air for the first time—taking its incredible combination of power-efficient performance and portability to a new level. iPad Air with M3 is nearly 2x faster compared to iPad Air with M1, and up to 3.5x faster than iPad Air with A14 Bionic. Users will feel the speed of M3 in everything they do, from creating engaging content faster than ever to playing demanding, graphics-intensive games. Available in two sizes and four gorgeous finishes that users love, the 11-inch iPad Air is super portable while on the go, and the 13-inch model provides an even larger display for more room to be creative and productive. Designed for iPad Air, the new Magic Keyboard enhances its versatility and delivers more capabilities at a lower price. With iPadOS 18, support for Apple Intelligence, advanced cameras, fast wireless 5G connectivity, and compatibility with Apple Pencil Pro and Apple Pencil (USB-C), the new iPad Air offers an unrivaled experience.

With the same starting price of just $599 for the 11-inch model and $799 for the 13-inch model, the new iPad Air is a fantastic value. And for education, the 11-inch iPad Air starts at just $549, and the 13-inch model starts at just $749. Customers can pre-order the new iPad Air with M3 and Magic Keyboard for iPad Air starting today, with availability beginning Wednesday, March 12.

Today, we introduced the Framework Desktop, a tiny 4.5L Mini-ITX desktop powered by AMD's massive new Ryzen AI Max processors. Pre-orders are open now, with first shipments in early Q3 2025. When AMD shared the Ryzen AI Max with us, we immediately knew we had to use it. It has up to 16 CPU cores at 5.1 GHz boost clock, discrete-level Radeon 8060S graphics, and support for up to an insane 128 GB of unified LPDDR5x. That enables 1440p or higher gaming on the heaviest titles, big creative and workstation workloads, and true local AI use cases. This is an absolute monster of a processor, and we shifted our roadmap a year ago to make space for it. In a desktop form factor, we get to unlock every bit of its performance with 120 W sustained power and 140 W boost while staying quiet and cool.

You may still be wondering, why does Framework need to build a desktop? Aren't desktops already modular and upgradeable? They are. In fact, the desktop PC ethos is part of what inspired the Framework Laptop to begin with. The desktop world is amazing. There is a broad, long-lived, interoperable ecosystem with hundreds of brands and hundreds of millions of consumers participating. You can build, upgrade, repair, and personalize to the limits of your imagination (and budget, and desk space), and share your amazing creations with all of the other true believers. We want to make this space as accessible as we possibly can by building a desktop that is simultaneously small and simple and incredibly powerful and customizable. Everyone should have the opportunity to experience the culture around PCs and PC gaming first-hand.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

At some point this week, HP's North American online store was updated with new high-end EliteBooks that feature AMD Strix Point APUs. Three models appear to support up to 128 GB of LPDDR5X-8533 memory—these curious entries were highlighted by tech enthusiast Hoang Anh Phu (AnhPhuH). The advertised maximum 8533 MT/s transfer rate exceeds Team Red's official reference figure (7500 MT/s) for the EliteBook X G1a's Ryzen AI 9 HX 375 APU. Looking further up in the Team Red "Strix Point" product stack, we spotted their Ryzen AI 9 HX PRO 375 spec sheet boasting a maximum LPDDR5x transfer speed of 8000 MT/s. Press outlets have expressed doubt when analyzing three of HP's EliteBook X G1a SKUs. Theories point to product pages containing possible placeholder information, or inaccuracies.

Working with the belief that the specs are legit, AnhPhuH commented: "this is the first laptop featured with 128 GB LPDDR5x-8533 128-bit memory. That would mean it's using four 256 Gb x32 modules(?!). As far as I know, all three major DRAM manufacturers currently only have 128 Gb x32 modules...the EliteBook X G1a uses Strix Point, not Strix Halo, so it only pairs with four x32 modules (two 64-bit channels)." HP's web shop states that the EliteBook X G1a models are due to launch on March 14. We hope that further clarification and concrete specifications appear online closer to release time. Initial pricing starts at $2749 for the lowliest of the three "128 GB LPDDR5X-8533" equipped models. The agonizingly named flagship "HP EliteBook X G1a 14 inch Notebook Next Gen AI PC Wolf Pro Security Edition" offering comes in at an eye-watering $4299.

In the design of wearable devices, every millimeter matters. As AI technology becomes deeply integrated, wearable devices demand not only enhanced performance but also the ability to deliver more functionalities within highly limited spaces. Recently, Longsys introduced a 7.2 mm × 7.2 mm subsize eMMC, providing a groundbreaking memory solution for optimizing the physical space of AI wearables.

Ultra-Compact: Unlocking New Possibilities for Wearable Design
7.2 mm × 7.2 mm is one of the smallest subsize eMMCs currently available on the market, achieving maximum space efficiency. Its 153 solder balls nearly cover the entire panel, pushing the design to the very edge of physical limits. Compared to the standard 11.5 mm × 13 mm eMMC, its surface area is reduced by approximately 65%, with a thickness of just 0.8 mm. Featuring a lightweight design, it weighs only 0.1 g (approx.), nearly 67% lighter than the standard 0.3 g eMMC. This ultra-compact design frees up additional space for other internal components, enabling wearable devices to maintain a sleek and lightweight form while integrating more functional modules to meet diverse user demands.

Samsung Electronics Co., Ltd. today announced the Galaxy S25 Ultra, Galaxy S25+, and Galaxy S25, setting a new standard towards a true AI companion with our most natural and context-aware mobile experiences ever created. Introducing multimodal AI agents, the Galaxy S25 series is the first step in Samsung's vision to change the way users interact with their phone—and with their world. A first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset delivers greater on-device processing power for Galaxy AI plus superior camera range and control with Galaxy's next-gen ProVisual Engine.

"The greatest innovations are a reflection of their users, which is why we evolved Galaxy AI to help everyone interact with their devices more naturally and effortlessly while trusting that their privacy is secured," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Galaxy S25 series opens the door to an AI-integrated OS that fundamentally shifts how we use technology and how we live our lives."

At CES this year, UGREEN was showing off two new NAS models, the NASync iDX6011 and the iDX6011 Pro, with the i in the model name seemingly denoting that both models are using Intel Core Ultra processors. The basic design builds on last years NASync models and the UGOS Pro operating system, but with several added features that may or may not appeal to the target audience. The common feature set between the two models is six 3.5-inch drive bays and a pair of M.2 slots that can be used for either storage or as a cache for the mechanical drives. Both models are expected to ship with 32 GB of RAM as standard and can be expanded to 64 GB and both of them also supports a PCIe 4.0 x8 expansion card slot, although at this point it's not clear what that slot can be used for. As with the already launched NASync models, the two new SKUs will come with the OS installed on a 128 GB SSD.

Where things get interesting is on the connectivity side of things, as both models sports dual 10 Gbps Ethernet ports, what is said to be an 8K capable HDMI port, a pair of USB 3.2 (10 Gbps) ports, two USB 2.0 ports and an SD 4.0 card slot. However, the NASync iDX6011 comes with a pair of Thunderbolt 4 ports around the front, although it's not clear if it can be used as a DAS using these ports, or if they simply act as virtual network ports. The iDX6011 Pro on the other hand, sports two USB Type-C ports around the front—as well as a small status LCD display—in favour of an OCuLink port around the back. The OCuLink port is capable of up to 64 Gbps of bandwidth, compared to 40 Gbps for the Thunderbolt 4 ports. It's currently not know what the OCuLink port can be used for, but it's more or less an external PCIe interface. It's also unknown what type of AI or LLM features the two new NASync devices will support, but it's clear they'll rely on the capabilities of the Intel processors they're built around. No pricing was announced at CES and the NASync iDX6011 is expected to launch sometime in the second quarter this year, with the NASync iDX6011 Pro launching in the third quarter. We should also note that the NASync iDX6011 Pro wasn't on display at CES, hence the renders below.

The 2025 CES Global Consumer Electronics Show opened in Las Vegas, USA. With the theme "Dive In", this year's CES focuses on cutting-edge fields such as artificial intelligence, sustainability, mobile technology, and human safety. Longsys, a leading innovator in memory technology, showcased a series of innovative memory products under its two major brands, highlighting the diversity and infinite possibilities of storage technology.

Among the cutting-edge products showcased, Longsys' first NFC portable solid-state drive (PSSD) garnered significant attention. Designed for enhanced data privacy and convenience, this PSSD supports unlocking invisible storage space via NFC, integrating regular functionality with data privacy protection. By simply tapping an NFC-enabled device, such as a smartphone, smartwatch, or NFC card - users can unlock private data effortlessly, making it an ideal solution for both personal and professional use.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

Samsung Electronics America, a world leader in advanced memory technology, has expanded its microSD portfolio with a line of new cards inspired by iconic characters from the Sonic the Hedgehog franchise, giving players an exciting new way to celebrate their fandom, while expanding their storage and powering ultra-fast gameplay. Created in collaboration with SEGA, the Sonic the Hedgehog PRO Plus microSDs will feature special designs depicting Knuckles (128 GB), Tails (256 GB), Sonic (512 GB) and Shadow (1 TB).

"Samsung PRO Plus microSD cards provide gamers, content creators and more with an easy, reliable, and secure way to store large amounts of data - delivering Sonic-speed right to your fingertips," said Jim Kiczek, Vice President of Memory Marketing at Samsung Electronics America. "Since debuting more than three decades ago, Sonic has become an icon of pop culture, featured in dozens of games, TV series, and movies. Now, with the Sonic the Hedgehog PRO Plus microSD cards, we're combining the franchise's instantly recognizable characters with the speed and reliability of Samsung PRO Plus microSDs to give your gear the ultimate Sonic boost."

- CTL, a global cloud-computing solution leader for education and enterprise, announced today the introduction of two new 14" Chromebooks for enterprise: the CTL Chromebook Plus Enterprise PX141G Series and the CTL Chromebook Enterprise PX141E Series. Featuring an included Chrome Enterprise Upgrade license, these new Chromebooks offer professionals the speed, power, and connectivity they need for daily on-the-go productivity. Easy ChromeOS device manageability combined with CTL's life cycle services reduces the burden on IT departments.

"With an included Chrome Enterprise Upgrade license, these Chromebooks can be deployed instantly to serve in any number of enterprise applications, such as retail, healthcare, and front-line workers, for example. As a leader in the ChromeOS space, we know our customers will appreciate the design, performance, and, in the Chromebook Plus model, the enhanced AI and cybersecurity capabilities of this next-generation device," said Jason Mendenhall, CEO of CTL.

PNY announced today the newest additions to its Flash Drive assortment, the PRO Elite V3 USB 3.2 Gen 2 and Attaché X USB 3.2 Flash Drives. PRO Elite V3 USB 3.2 Gen 2 Flash Drives advance file management to the next level, boasting extreme speeds of up to 1,000 MB/s read and up to 800 MB/s write, with storage capacities ranging from 256 GB - 1 TB, while the Attaché X brings a sleek and modern design with boosted performance for mainstream users

Exceptional Performance Storage Solution
PNY's new PRO Elite V3 brings a new level of speed and reliability to its high-performance USB product assortment. Exceptional performance improvements boost maximum speeds up to 1,000 MB/s read and up to 800 MB/s write, achieving speeds 265x faster than standard USB 2.0 flash drives. Experience the elevated performance of the PRO Elite V3's USB 3.2 Gen 2 flash drive technology to enhance workflows with demanding applications. PRO Elite V3 was designed to be an invaluable asset for content creators, professionals, designers, and gamers who need to store, access, and transfer critical, high-density files such as movies, professional high-resolution photos, video gaming data, and full HD & 4K videos at incredible speeds.

Expanding the system's computing capability with an additional accelerator like a GPU is common. However, expanding the system's memory capacity with room for more DIMM is something new. Thanks to ServeTheHome, we see that at the OCP Summit 2024, Lenovo showcased its ThinkSystem SR860 V3 server, leveraging CXL technology and Astera Labs Leo memory controllers to accommodate a staggering 16 TB of DDR5 memory across 128 DIMM slots. Traditional four-socket servers face limitations due to the memory channels supported by Intel Xeon processors. With each CPU supporting up to 16 DDR5 DIMMs, a four-socket configuration maxes out at 64 DIMMs, equating to 8 TB when using 128 GB RDIMMs. Lenovo's new approach expands this ceiling significantly by incorporating an additional 64 DIMM slots through CXL memory expansion.

The ThinkSystem SR860 V3 integrates Astera Labs Leo controllers to enable the CXL-connected DIMMs. These controllers manage up to four DDR5 DIMMs each, resulting in a layered memory design. The chassis base houses four Xeon processors, each linked to 16 directly connected DIMMs, while the upper section—called the "memory forest"—houses the additional CXL-enabled DIMMs. Beyond memory capabilities, the server supports up to four double-width GPUs, making it also a solution for high-performance computing and AI workloads. This design caters to scale-up applications requiring vast memory resources, such as large-scale database management, and allows the resources to stay in memory instead of waiting on storage. CXL-based memory architectures are expected to become more common next year. Future developments may see even larger systems with shared memory pools, enabling dynamic allocation across multiple servers. For more pictures and video walkthrough, check out ServeTheHome's post.