SK hynix Inc. announced today that it has developed UFS 4.1 solution product adopting the world's highest 321-layer 1 Tb triple level cell 4D NAND flash for mobile applications. The development comes amid increasing requirements for high performance and low power of a NAND solution product to ensure a stable operation of on-device AI. The company expects the UFS 4.1 product, optimized for AI workload, to help enhance its memory leadership in the flagship smartphone markets.

With an increase in demand for on-device AI leading to greater importance of the balance between computation capabilities and battery efficiency of a device, the mobile market is now requiring thinness and low power from a mobile device. The latest product comes with a 7% improvement in power efficiency, compared with the previous generation based on 238-high NAND and a slimmer 0.85 mm thickness, down from 1 mm before, to fit into ultra-slim smartphones.

Die shots of Intel's "Arrow Lake" desktop processors have appeared online, confirming the chiplet design we have known about since the launch. The images annotated by the YouTube channel HighYield show a four‑tile arrangement mounted on a base die made with Intel's 22 nm FinFET process. The compute tile sits at the top left, built on TSMC's N3B node and covering 117.24 mm². To its right are the SoC tile on TSMC's N6 node measuring 86.65 mm², and the GPU tile, which houses four Xe cores alongside an Arc Alchemist render slice. The I/O tile, at 24.48 mm² on the same N6 node, completes the group at the bottom left. Intel has redesigned its hybrid core layout for Arrow Lake, moving away from separate P‑core and E‑core clusters. Four of the eight high‑performance P‑cores line the die's outer edges, with the remaining four in the center. In between these lie the four efficiency E‑core clusters, each sharing 3 MB of L2 cache. A unified 36 MB L3 cache ring bus connects to every core, allowing E‑cores to tap into that larger cache pool for the first time. Intel aims to spread heat more evenly and boost background task performance.

The I/O tile integrates Thunderbolt 4 controllers, PCIe buffers and PHYs. The SoC tile carries display engines, media accelerators and DDR5 memory controllers. All tiles are bonded to the base die via Intel's Foveros Omni stacking technology. Arrow Lake also reflects a shift in Intel's manufacturing strategy. Plans to use Intel's 20A node were dropped in favor of TSMC processes, making this the first desktop CPU from Intel that relies almost entirely on external foundries. On the software side, Intel has begun offering its IPO profiles in select prebuilt systems. These presets optimize CPU and memory settings for a hassle‑free performance boost that remains within warranty limits. Meanwhile, the native 200S Boost overclocking option is rolling out via BIOS updates. Early tests suggest that 200S Boost alone yields modest gains unless paired with very high-speed DDR5 modules, while IPO profiles deliver more consistent improvements with mainstream memory configurations.

Transcend Information Inc. (Transcend), a leading global manufacturer of memory storage solutions, introduces the ETD410T, a new U.2 enterprise solid-state drive (eSSD) designed for high-performance computing environments. Tailored to meet the stringent demands of enterprise users for ultra-fast data transfer and reliability, the ETD410T adopts the PCIe Gen 4 x4 high-speed interface and U.2 15 mm form factor, featuring a DRAM cache for exceptional performance and robust data protection. It is an ideal solution for data centers and enterprise applications.

Durable and Stable for High-Frequency Workloads
The Transcend ETD410T is a professional solution optimized for read-intensive workloads. Compliant with JESD219 standards, it offers a durability of up to 7,000 Program/Erase (P/E) cycles to withstand frequent use over long periods. With Quality of Service (QoS) consistently maintained between 99.9% and 99.99%, it delivers stable and reliable operation even in demanding enterprise environments, ensuring consistent and dependable data access.

AEWIN is glad to introduce our latest storage adapter cards, RS110A and RS118A. Each card has two hot-swappable E1.S trays while RS110A in a Standard PCIe x8 FHHL form factor and RS118A is in AEWIN Expansion Module form factor. RS118A can be installed in current AEWIN platforms with AEWIN expansion module bays while RS110A is suitable for platforms with standard PCIe slots for flexible storage expansion. With RS110A and RS118A, two E1.S NVMe SSDs with Maximum 9.5 mm and 15 mm height can be applied to existing systems for excellent scalability.

Market researchers have reported that the E1.S form factor is projected to become the most widely adopted small form factor for enterprise SSDs of data center in the coming years. E1.S NVMe storage features better thermal management solutions and can utilize bigger power consumption of 20 W which can overcome the scaling issue that M.2 is having. In addition, E1.S storage has hot-swappable features to minimize downtime and perform easier maintenance for replacement or capacity upgrade of the servers.

APNX is thrilled to introduce APNX V1, a mid-tower case designed for customizable cooling precision for both GPU and CPU, housed in a sleek, dual-chamber structure with a panoramic view. Engineered for optimized thermal management, hardware compatibility, and a seamless build experience, the V1 is ideal for gamers, professionals, and system builders.

The APNX V1 features a 45° angled front intake that efficiently directs cool airflow toward the GPU and CPU. The angled fan bracket accommodates up to 2 x 160 mm, 2 x 140 mm or 3 x 120 mm fans, plus the visually appealing top and side panels maximize ventilation and heat dissipation. Furthermore, the adjustable motherboard positioning enables tailored airflow for the GPU or additional space for thicker radiators at the top. Overall, the V1 is designed with airflow dynamics for a high-performance build while maintaining the hallmark view of a panoramic case.

ViewSonic Corp., a global leader in visual solutions, announces the launch of its new ViewSonic GAMING VX54 Series of 16-inch and 17-inch portable monitors. Designed for gamers on the go, these ultra-sleek, lightweight monitors—each weighing under 1 kg—provide versatile connectivity options and deliver high-quality visuals across mobile devices, PCs, and gaming consoles.

The VX54 Series' 16-inch and 17-inch monitors boast a thin 9.85 mm and 11 mm profile, respectively, and both weigh less than 1 kg. This lightweight, compact design makes them perfect for small living spaces like dorm rooms, and easy to carry in bags for gaming on the go. Each monitor also includes a built-in foldable stand with adjustable viewing angles up to 53 degrees, allowing gamers to find the perfect screen position for maximum comfort during long gaming sessions.

KIOXIA America, Inc. today announced the availability of its new KIOXIA XD8 Series PCIe 5.0 Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S SSDs. The new drives are the third generation of E1.S SSDs from KIOXIA and are compliant with PCIe 5.0 (32 GT/s x 4) and NVMe 2.0 specifications, and support the Open Compute Project (OCP) Datacenter NVMe SSD v2.5 specification.

Designed for cloud and hyperscale environments, the KIOXIA XD8 Series meets the growing demand for higher performance, enhanced efficiency, and greater scalability in data centers. The new drives empower cloud providers and hyperscalers to optimize their infrastructure, delivering superior performance while maintaining operational efficiency.

Koss Corporation (NASDAQ Symbol: KOSS), the U.S. based high-fidelity Stereophone manufacturer and creator of the world's first SP3 Stereophone in 1958, celebrates the 40th Anniversary of the Koss Porta Pro with the introduction of the next generation Koss Porta Pro Wireless Bluetooth Headphones.

The evolutionary Koss Porta Pro Wireless combines the legendary sound and the iconic design of the Koss Porta Pro Classic headphones with the convenience and freedom of true wireless, with Bluetooth.

Winbond Electronics Corporation, a leading global supplier of semiconductor solutions, has unveiled the W25N01KW, a 1 GB 1.8 V QspiNAND flash. This new NAND solution is designed to meet the increasing demands of wearable and battery-operated IoT devices with low standby power, small-form-factor package, and continuous read for fast boot and instant-on support.

The W25N01KW flash memory stands out for its high-speed read capabilities, achieving speeds up to 52 MB/sec in both Continuous Read and Sequential Read modes. The fast boot and instant-on support enhance energy efficiency and extend the devices' operational lifespan. It also offers an advanced deep power-down mode that reduces power consumption to as low as 1µA. The W25N01KW comes in a small form factor and is available in compact WSON8 (8 mm x 6 mm) and WSON8 (6 mm x 5 mm) packages. These exceptional features ensure ultra-fast code/data access, longer battery life, and compact design, contributing to an optimized user experience across various applications.

Palit today introduced the GeForce RTX 4070 Ti SUPER GameRock OmniBlack graphics card. The GameRock OmniBlack is a variant of the GameRock custom design that does away with all illumination. The acrylic embellishment that's supposed to resemble ice or frost on the cooler shroud, remains, it's not illuminated from behind. The three 80 mm GaleHunter fans are now black and opaque, unlike on the original GameRock board, where they were frosted acrylic, and illuminated. The card features the same heavy aluminium fin-stack heatsink you'd find on the company's RTX 4080 GameRock series. The cooler makes the card 3.5-slot thick (71.5 mm thick), almost 33 cm long, and 13.7 cm tall.

Palit has increased the power limit of the RTX 4070 Ti SUPER to 295 W, up from its reference 285 W, although interestingly, the card sticks to NVIDIA reference clock speeds of 2340 MHz base, and 2610 MHz boost, with its memory running at 21 Gbps. The card offers dual-BIOS, however, both BIOSes run the card at the same speeds, with the "silent" BIOS having a quieter fan profile. Based on the same 5 nm "AD103" silicon as the RTX 4080 and RTX 4080 SUPER, the new RTX 4070 Ti SUPER is equipped with 8,448 CUDA cores, 264 Tensor cores, 66 RT cores, 264 TMUs, and 96 ROPs. Palit did not reveal pricing for the GameRock OmniBlack.

Acer today announced new models of the Acer Swift Edge 16 and Acer Swift Go 14 laptops, blending AI power and innovative features in stylish thin and light devices. The latest additions to the Swift lineup feature AMD Ryzen 8040 Series processors with up to AMD Radeon 780M Graphics and equipped with Ryzen AI for versatile performance and support for Acer's AI-powered capabilities such as Acer PurifiedVoice, Acer PurfiedView, and the new Acer LiveArt photo-editing feature. Intuitive control and seamless navigation on the AI PCs are made possible thanks to the AcerSense application and Copilot in Windows with instant access through dedicated keys. Users can also appreciate clear images and rich colors when working or streaming through the OLED laptops' displays, as well as Microsoft Pluton technology, enabled by default, to help secure devices, personal data, and encryption keys.

Harnessing the Power of AI with AMD Ryzen 8040 Series Processors
Designed to deliver premium AI experiences and reliable performance for everyday productivity, the Swift Edge 16 and Swift Go 14 laptops are powered by AMD Ryzen 8040 Series processors with Ryzen AI technology built in. AMD's latest processors enable the efficient distribution of AI workloads between accelerators on the NPU, GPU, and CPU, to advance user experiences with AI technology on the devices. It leverages AMD's "Zen 4" processor architecture with up to eight cores and delivers up to 16 threads of processing power, so creative professionals and mainstream users can expect fast, power-efficient computing and longer battery life on the ultrathin Swift laptops.

Chinese processor designers need help creating a leading-edge design that satisfies their needs, with the imposed sanctions and restrictions of Western countries. However, designers are using creative ways to make a server processor to fulfill their needs. According to the latest Sina report, Chinese company Loongson has developed a 32-core processor using chiplet technology. Previously, the company announced its 16-core 3C5000 processor based on LA464 cores, which utilize LoongArch ISA. Loongson used chiplet technology to fuse two 3C5000 processors into a single-socket solution called 3D5000, which features 32 LA464 cores to create a higher-performing design. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm.

The company claims that the typical power consumption is rated for 130 Watts at 2.0 GHz or 170 Watts at 2.2 GHz, with TDP power consumption not exceeding 300 Watts at 2.2 GHz even with peaks. The performance of the new 3D5000 processor, measured using SPEC2006, is 400 points and 800 points for single-socket and dual-socket servers, respectively. The four-socket server is expected to reach 1600 points in the same benchmark, so scaling is advertised as linear. Loongson hopes to provide samples to industry partners in the first half of 2023 with an unknown price tag.

ASUS today revealed the all-new Zenfone 9 smartphone at a virtual launch event. Zenfone 9 is a totally redesigned compact 5.9-inch device with high performance and exciting new features. Powered by the latest flagship Snapdragon 8+ Gen 1 Mobile Platform, it's the most powerful Zenfone ever released. This latest generation Zenfone 9 has been totally redesigned to give it a premium, sleek look and feel, with four eye-catching new colors, a tactile new high-grip texture, and IP68 certification. The modern design features a massively upgraded dual-camera system with a 50 MP Sony IMX 766 main camera featuring a new 6-Axis Hybrid Gimbal Stabilizer, electronic image stabilization (EIS) and ultrafast autofocus technology for sharp, shake-free photos and videos. There's also a 12 MP IMX 363 ultrawide camera, and a 12 MP IMX 663 punch-hole front camera for crystal clear selfies and video chats.

As Zenfone 9 fits perfectly in one hand, the ASUS ZenUI 9 (Android 12) interface has been optimized for one-handed use. There's also the unique ASUS ZenTouch, a multifunction side-mounted power button incorporating a fingerprint sensor for hassle-free unlocking and support for convenient gesture controls. The new Connex Case accessory allows users to attach the Connex Card Holder or Connex Smart Stand, and there's also a new Smart Backpack Mount for safely attaching Zenfone 9 to a backpack's strap.

Qualcomm Technologies, Inc. today announced the Snapdragon X60 5G Modem-RF System, its third-generation 5G modem-to-antenna solution (the Snapdragon X60). Snapdragon X60 features the world's first 5-nanometer 5G baseband and is the world's first 5G Modem-RF System to support spectrum aggregation across all key 5G bands and combinations, including mmWave and sub-6 using frequency division duplex (FDD) and time division duplex (TDD), providing ultimate operator flexibility to uplift 5G performance utilizing fragmented spectrum assets. This 5G modem-to-antenna solution is designed to enhance the performance and capacity for operators worldwide while increasing average 5G speeds in mobile devices. Snapdragon X60 is engineered to accelerate network transition to 5G standalone mode through support for any key spectrum band, mode or combination, along with 5G Voice-over-NR (VoNR) capabilities.

Cooler Master, a global leader in designing and manufacturing innovative gaming peripherals and PC components, has unveiled its latest lineup of headsets for gamers of all types: the MH600 Series.

The MH600 Series emphasizes high performance and premium sound quality with a core suite of features standard in every model:

• Swiveling ear cups and fabric mesh cushioning for superior, long-lasting comfort
• Hassle-free portability with detachable cords and foldable frames
• Adjustable omnidirectional boom mic for superior voice quality and minimal background noise
• Premium sound quality with 50 mm neodymium audio drivers

Razer, the leading global lifestyle brand for gamers, today announced their new Razer Blade Stealth 13 with NVIDIA GeForce GTX 1650 graphics - the World's First Gaming Ultrabook. Powered by Intel's new 10th generation processor, the new Razer Blade Stealth 13 delivers true gaming performance packed into an amazingly thin 15 mm chassis weighing only 1.3 kg.

"Razer is constantly pushing the boundaries of what's possible, by designing laptops that utilize the most powerful components in the smallest chassis" says Brad Wildes, Senior Vice President of Razer's Systems Division. "We did it with our original Razer Blade, which led the trend of slim gaming systems, and now we're doing it again with our Blade Stealth, pioneering a new market for powerful, small-footprint laptops."

Razer is launching an updated, TKL (Tenkeyless) version of the Chroma V2 keyboard, which we covered back in January. The keyboard's actual product name is "Razer BlackWidow Tournament Edition Chroma V2". Like the Chroma V2, it's available with Razer's three desktop switches (Yellow, Orange, or Green), and boasts a detachable USB cable and likewise detachable wrist rest.

Unchanged BlackWidow features on this Chroma V2 version include Razer's Chroma lighting (which boasts individually backlit keys at 16.8 million colors per key), with Chroma effects powered by Razer's Synapse software. 10 key roll-over anti-ghosting and fully programmable keys with on-the-fly macro recording options are present, with the keyboard featuring 1000 Hz polling, a braided USB cable, a USB pass-through and a 3.5 mm 4-pole audio pass-through jack.

That some M.2 SSDs throttle their speeds because of increased operating temperatures has already been demonstrated. Some companies, like Plextor, have even launched M.2 SSDs with specifically-developed heatsinks to reduce operating temperatures and thus reduce performance degradation. Other companies, Like MSI, have started incorporating M.2 heatsinks on their motherboard design, looking to attract more customers on the prospect of increased SSD performance - though some say the merits of MSI's approach are debatable.

Now, SilverStone has announced a more cost-effective - and compatible - way of improving thermals of your M.2 SSD of choice, by introducing its TP01-M2 thermal pads. These pads are colored blue (because blue means cool, see?), and the company claims their usage on a Samsung SM951 SSD brought about improvements of around 15ºC in the operating temperatures, down to 71ºC from the 86ºC sans thermal pads. These go for around 5€ a pack, which comes with two 20 mm (W) x 100 mm (D), one with 0.5 mm thickness, and another with improved cooling capabilities but a greater 1.5 mm thickness.

Thermaltake is consistently increasing its offers in the wall-mountable chassis portion of its business. Now, the company is introducing a mITX chassis that's supposed to appeal to wall-mounting users who prefer a lither system with a smaller footprint.

As is the hallmark of the P series, the P1 offers support for your choice of AIO or custom loop liquid coolers. It's open-frame design and 5 mm thick tempered glass will make sure to showcase all your components and bling properly. The Core P1 features three setup choices - vertical, horizontal, and wall-mounted. The chassis allows for three 2.5" drives and an extra 2.5" or 3.5". The case features five expansion slots, looking to offer more flexibility in the installation. The Core P1 allows 2x 120 mm fans to be installed, or 1x 240 mm radiator. The clearance for the CPU cooler is 170 mm, the graphics card can be up to 380 mm with a radiator thinner than 30 mm (without fans), and the PSU length sits at to 180 mm.

Slim and light, MSI's GP60 and GP70 presents better performance of the latest laptops for online gaming competitions. Under the hood, these NBs meet your need for machines that with good performance with better gaming experience. In addition, they sport envelope-pushing SteelSeries gaming keyboards, unique Audio Boost for headsets sound enhancement solution. Easy to Take and powerful, these NBs will give you the furious advantage in HD gaming competitions. MSI has received high marks for its high-end gaming laptops, the good performance but compact gaming design in new gaming notebooks. They featured Intel's 4th Generation Quad Core processor and new Generation NVIDIA GeForce GT 740M discrete graphics. Specially designed to meet the demands of online gamers around the world.

Seagate Technology plc, a world leader in storage solutions, today announced it's shipping its thinnest hard disk drive (HDD) ever to OEM partners - the Seagate Laptop Ultrathin HDD. Just 5mm thin, the Laptop Ultrathin HDD is designed to be integrated into ultra-thin, lightweight mobile computing devices and tablets all while delivering high capacity storage at an affordable price.

"When we originally demonstrated this solution last September, we knew we had a truly innovative product that would empower our partners to reimagine mobile applications," said Steve Luczo, president, CEO and chairman of Seagate. "The strong support from our OEM partners indicates we have delivered on our vision and look forward to a new wave of innovative solutions enabled by this revolutionary product."

Toshiba Electronics Europe (TEE) has announced that solid state drives (SSDs) built on the company's 19nm Multi-Level Cell (MLC) NAND flash technology are now readily available across Europe. Toshiba was the first company to develop 19nm NAND SSDs and the family includes the world's smallest and highest density NAND flash drives.

Toshiba's THNSNH family addresses the storage, performance and power efficiency demands of even the most data-intensive and energy-sensitive systems. The drives are ideal for high-end notebooks, tablets, PCs, all-in-one desktop computers and industrial PCs. Capacities of 512GB1, 256GB, 128GB and 60GB are all now available in 2.5-inch form factors with a choice of 7.0 mm and 9.5 mm profiles. mSATA modules with capacities of 256GB, 128GB and 60GB are also available.

Buffalo Japan introduced the BSKBB15SV foldable keyboard for those who find on-screen keyboards on their phablets less than ergonomic. Measuring 149 x 95.5 x 16 mm (WxDxH) when folded and 297 x 95.5 x 7.5 mm unfolded, the keyboard features Bluetooth 2.0 keyboard-class compliance, which lets it pair with almost any modern Bluetooth-enabled smartphone, tablet, or notebook. It features an English QWERTY layout, with a total of 83 keys. The keys feature 17 mm pitch and 2.2 mm travel (stroke). It includes a complementary stand that can hold most tablets. Available in black and silver color options, and slated for early December, it is priced around 7,035¥ (US $86).

The "A-Drive", one of the world's thinnest 5 mm hybrid hard drive in a 2.5" form factor, was officially launched by Mr. S. Iswaran, Minister in the Prime Minister's Office and Second Minister for Home Affairs and Trade & Industry, to commemorate the Data Storage Institute's (DSI) 20 years of R&D in the area of data storage capabilities.

The "A-Drive" represents the next generation of storage innovation providing capacities of up to 1 TB Hard Disk Drive (HDD) with 32 GB Solid State Drive (SSD). This potentially allows the "A-Drive" to store over 250,000 songs in its 5 mm body. The "A-Drive" also addresses limitations of the popular, yet expensive, flash-based SSD, as well as the conventional HDD for the consumer and business industry.

ADATA announced a new line of affordable client SSDs, the Premier Pro SP600 series. Built in the 9.5 mm-thick 2.5-inch form-factor, the drives take advantage of SATA 6 Gb/s interface. Available in 32 GB, 64 GB, and 128 GB capacities, the Premier Pro SP600 series is driven by JMicron JMF661 processor, and features 20 nm-class MLC NAND flash memory. The drives offer sequential read speeds of up to 360 MB/s, and up to 130 MB/s writes. Random access performance numbers provided to us include 40,000 IOPS 4K random reads, and 30,000 IOPS 4K random writes. The drives pack most common client SSD features, including TRIM, NCQ, and 40 b/KB ECC. The 32 GB, 64 GB, and 128 GB variants are priced at US $49.99, $69.99, and $99.99, respectively.