MSI listed the MPG B850I EDGE TI WIFI, a Mini-ITX form-format AMD AM5 socket motherboard built around AMD's B850 chipset with support for the latest Ryzen CPU series. The board features an 8+2+1 phase digital VRM with 90 A SPS DrMOS power stages, powered through a single 8-pin EPS connector. It uses a 10-layer PCB with 2oz copper for enhanced conductivity and thermal performance. The motherboard supports DDR5 memory up to 8200 MT/s in a dual-slot, single DIMM per channel configuration. Storage connectivity includes a front-mounted PCIe 5.0×4 M.2 slot with active cooling fan connected directly to the CPU, plus a rear PCIe 4.0×4 M.2 slot through the chipset and two SATA III ports. A single PCIe 5.0×16 slot provides GPU connectivity via CPU lanes.

Networking capabilities include 5 GbE wired connectivity through a Realtek RTK8126 controller and Wi-Fi 7 with 320 MHz channels supporting up to 5.8 Gbps, alongside Bluetooth 5.4. Audio processing uses the Realtek ALC4080 codec. The I/O configuration provides USB-C connectivity at 20 Gbps on the rear panel and 10 Gbps via internal header, multiple USB-A ports ranging from 480 Mbps to 10 Gbps speeds, HDMI 2.1 FRL video output, S/PDIF digital audio, and dual antenna connectors for wireless connectivity. The active cooling fan on the primary M.2 slot addresses thermal management for high-performance PCIe 5.0 SSDs while maintaining the compact Mini-ITX form factor.

At Computex 2025, ASRock deliberated over the problems that have plagued certain AMD 800-series motherboard models. Fatal combinations—usually affecting popular Ryzen 7 9800X3D gaming CPUs—have been highlighted by sections of the PC hardware community, and (subsequently) press outlets. Months ago, the Taiwanese mainboard manufacturer's Japanese branch took a combative stance (in response to widespread criticism). Following continued failures of Team Red "Granite Ridge" desktop processors on "mid-to-high-end" ASRock mainboards—even in non-3D V-Cache guises—company representatives have interacted with key media conduits, including Tech YES City's Bryan Bilowol. Coinciding with the release of fresh BIOS fixes, long-form video coverage of Q&A sessions have turned up on YouTube.

Company reps have alluded to a warranty replacement scheme, but full details were not disclosed during May-time Computex proceedings. Many critics are still waiting for an official company statement; hopefully addressed to a global audience. In the meantime, one regional office has weighed in with some much-needed outreach: "ASRock Korea takes the recent AMD 800 series motherboard issues experienced by some users very seriously and will follow up with you to protect your trust. ASRock is continuously monitoring the performance and stability of the platform and will provide a firmware update as soon as possible if any issues are identified. In addition, if the system you are using is damaged due to this issue, we will take responsible measures for both the CPU and the motherboard distributed through the official domestic importer, and please submit the case through ASRock Korea's official distributor for diagnosis and processing. ASRock Korea will continue to listen to the voices of our customers and do our best to remain a trusted brand." This message was posted on Quasar Zone; a high-traffic PC hardware forum. A good number of manufacturers have responded to cases raised by members of this South Korean community.

Yesterday, members of the Bobantang discussion board disclosed intriguing insider knowledge. According to recent industry murmurs, AMD has informed motherboard manufacturing partners about the discontinuation of B650 chipset production. Chinese media outlets have jumped on this alleged revelation, with Western counterparts quickly joining in on the fun (hours later). ITHome and Unika's Hardware were the first channels to parse info from the Bobantang forum. Since a 2022 launch, Team Red's mid-range B650 board design has remained a firm favorite for many budget-conscious owners of Ryzen 7000 (plus 8000G and 9000) series desktop processors. A "direct" successor—B850—reached retail at the start of this year, but higher price points combined with relatively minor feature set advantages have discouraged a lot of buyers. The likes of ASUS, ASRock, Colorful and Sapphire have released (or previewed) new B650 chipset-based mainboard products in 2025—mostly in microATX form factors.

A Bobantang member has prophesized two major trends—the first being: "after AMD's B650 chip production line is shut down, its inventory is expected to be large. According to Team Red, the B650M series inventory sales plan will probably end in the third quarter (of 2025)." A second claim was outlined: "it is expected that the digestion time of the tail end stock of AMD's B650 series motherboard will be longer, at least there will be inventory to sell in the second quarter (of this year), but the inventory of B650M chips will become more and more scarce as time goes by." PC hardware watchdogs propose a fall in B850 pricing; likely expertly timed to occur shortly after the complete depletion of predecessor stock—by the fourth quarter of this year.

Earlier this month, Bryan Bilowol—of Tech YES City fame—was taken aback by the unexpected "death" of his Ryzen 9 9950X processor, at the alleged hands of an ASRock X870 Steel Legend motherboard. Throughout early 2025, widespread news reports and community tracking efforts have largely implicated ASRock boards. AMD's highly popular Ryzen 7 9800X3D gaming CPU has "fallen victim" on numerous occasions, but a smaller number of incidents have affected non-3D V-Cache equipped Ryzen 9000 "Granite Ridge" models. The Taiwanese manufacturer and Team Red have investigated these problems, and have released fixes via BIOS updates. Despite these efforts, unhappy owners have experienced CPU failures in Q2'25. Following the uploading of initial findings and theories, Bilowol promised further reports. Fortunately, a sit-down—with ASRock's motherboard team—happened late last week, at Computex 2025. At the time of writing, the company has not published an official statement regarding their latest findings or fixes. Tech YES City shared a couple of compelling details in a May 26 YouTube upload (viewable below).

Commenting on the Ryzen 9000 CPU failure situation, Bilowol relayed important ASRock material: (the motherboard team) told me it had to do with the EDC and TDC, which is the electric design current as well as the thermal design current. Essentially, they're saying it's an ampage problem that exists with the precision boost overdrive (PBO) settings. In particular, these mid-range and high-end motherboards—say for instance a B650E or an X670E Taichi or even a B850 Steel Legend—have the ability to run Ryzen 9000 series CPUs at their maximum PBO settings out of the box. What's happening here is ASRock told me they were implementing these settings to what they believe was too aggressive for what the CPUs were able to handle, at least for earlier samples. However, they do promise me that these issues have been fixed with their latest BIOS updates that they're rolling out for these mid-range and high-end motherboards. They also told me that the lower-end boards, say for instance, an A620 HDV or something like that, shouldn't be affected by this issue simply because those PBO settings have been deliberately tuned down, due to the motherboard in question not being a high-end model." Three months back, ASRock's Japanese branch accused the PC hardware community of spreading "misinformation." Hopefully, the latest batch of fixes will bring an end to all Ryzen 9000 CPU + high-end/mid-range ASRock mainboard controversies.

At this year's Computex, BIOSTAR introduced a carefully curated selection of next-generation motherboards designed for gamers, content creators, and system integrators. Leading the Intel lineup is the Z890 VALKYRIE, which delivers extreme overclocking capabilities and high bandwidth performance. Alongside it, the Z890A-SILVER combines a clean, minimalist appearance with a robust power delivery system. Both models support Intel's latest processors, feature reinforced PCIe slots, dual-channel DDR5 memory compatibility, and advanced thermal solutions to maintain stability under continuous heavy loads.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, is excited to announce the participation in Computex Taipei 2025. Under the theme Gaming Beyond Limits, AI Beyond Imagination, ASRock will showcase the dual focus on next-level gaming and AI applications. From immersive gaming setups to AI solutions, the exhibit highlights ASRock's commitment to innovation across both fields. Visitors are invited to explore the latest products and technologies, and to experience the Phantom Gaming Zone at booth L0818.

ASRock Unveils Flagship Taichi OCF and Taichi Creator AM5 Motherboards
To expand its success on AMD AM5 motherboards, ASRock will be adding more exciting products into its product portfolio. New product such as X870E Taichi OCF, the very first OC formula motherboard based on AMD platform, Phantom Gaming X870 Nova WiFi, the new high end gaming motherboard based on X870 chipset, a functional yet elegantly designed X870 Taichi Creator and also a lot more products that are based on X870 / B850 / B840 / A620A chipset.

If you recall NVIDIA's GTX TITAN Z GPU with two GPU dies and an impressive 6 GB of memory, it was a big deal at the time and quite an interesting engineering solution. Today, thanks to sources close to VideoCardz, we learn that Intel's Arc "Battlemage" B580 could get the next dual GPU, dual VRAM treatment. According to the source, an unnamed Intel add-in board partner is preparing to launch a GPU with two B580 dies and 48 GB of VRAM. This means that the 24 GB VRAM version of the Arc B580 we saw in EEC filings is basically confirmed, and that some models will be out for display very soon. While the BMG-G21 chip offers up to 20 Xe cores and 2,560 shader units, a dual BMG-G21 configuration will yield 40 Xe cores and 5,120 shader units working in tandem with 48 GB of VRAM.

Clearly, this model is mostly tailored to AI enthusiasts. No game (thankfully) requires 48 GB of VRAM for now, but it is still nonetheless an interesting solution to see. It has been a while since we got something like a TITAN Z, even in high-end form factors. There is a rumored Intel Arc PRO A60/B60 card carrying a B580 die with 24 GB of VRAM, tailored for local AI workloads and professional visualization. This GPU could be the base for the newly rumored dual B580, 48 GB SKU from an unnamed Intel AIB partner. We expect to hear more details at Computex, which is now just a week away!

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading computer brand, continues to redefine DIY PC building with its innovative Project STEALTH, first introduced in 2022. The Project STEALTH concept was the industry's pioneer in adopting reverse-connector motherboards for a cleaner, more streamlined assembly. Now, responding to the growing demand for all-white and cableless PC builds, GIGABYTE launches the STEALTH ICE Series, featuring the AMD X870 and B850 chipset motherboards.

Beyond aesthetics and easier assembly, GIGABYTE ensures that the Project STEALTH build is highly compatible. In addition to supporting its own chassis lineup (GIGABYTE C500P STEALTH Series), GIGABYTE has partnered with over 10 renowned case manufacturers, including Corsair, Cooler Master, Fractal Design, Phanteks, and more, to provide reverse-connector-ready cases across more than 25 models. This makes the GIGABYTE Project STEALTH Series the most compatible, the most widely supported and flexible solution in the market for cableless PC builds.

Over a year ago, hardcore overclocking fanatics celebrated MSI's resurrection of the much missed MPOWER motherboard product line. After a seven-year hiatus, the Taiwanese manufacturer revived this series—beginning with a brand-new Z790MPOWER option. Back then, an exclusive Wccftech news report put a spotlight on the (then) brand-new model's support of Intel Core 12th, 13th, and 14th Gen processors (on LGA 1700/1800). Returning to the present day, MSI seems to be prepping a new MPOWER motherboard model—leaked shots imply a return to an old school color theme (black/yellow, rather than metallic tones). Wccftech has uploaded two close-up teaser images, from a "brief glimpse" preview session. There is evidence of AI upscaling here—despite the presence of anomalies/aberrations, we can see MSI logo and MPOWER branding on attached heatsinks.

Wccftech believes that the proposed "MSI MPOWER AMD series" will be: "a strong and cost-effective design for overclockers. The previous Z790 MPOWER motherboard brought great OC capabilities in an affordable design, offering 8000 MT/s DDR5 support and the new design will be no exception...Starting with the details, the...motherboard will feature an AM5 socket and is likely to leverage the B850E chipset. The new MPOWER motherboard also comes with a microATX form factor." Like last year's edition, MSI has readied the board with two DDR5 DIMM slots—ideal for ardent memory overclocking enthusiasts. This twin-stick setup reportedly supports up to 128 GB capacities. An extra bit of real estate is freed up; thus granting room for an additional M.2 bay. Wccftech did not disclose every tidbit of insider info, but they have hinted about the board's prowess: "it's awesome that we are finally getting an MPOWER motherboard from MSI for AM5 builders. The MPOWER series is great for overclocking and this motherboard should be just as good. We also managed to get information regarding the OC capabilities which are going to rival some of the high-end AM5 offerings as far as memory tuning is concerned."

ASUS has launched its B850M AYW GAMING WiFi motherboard worldwide giving users a small but mighty option for AMD Ryzen desktop systems. This board comes in a narrow microATX form factor measuring 24.4 cm x 22.1 cm. It sports a six-layer black PCB and silver-white heatsinks keeping a tidy look while sticking to the ASUS AYW series style. The board uses an 8+2+1 phase setup with discrete MOSFETs and has one 8-pin EPS CPU power plug. For a compact board, it offers plenty of storage choices. You'll find one PCIe 5.0 M.2 slot that can handle speeds up to 128 Gbps and another PCIe 4.0 M.2 slot with speeds up to 64 Gbps. To add extra cards, the motherboard provides one PCIe 5.0 x16 slot running at full speed plus one PCIe 4.0 x16 slot that works at x8/x4 speed.

The B850M AYW GAMING WiFi has two DIMM slots for DDR5 memory in a dual-channel setup with AEMP support (up to 8400+ MS/s OC). It comes with Wi-Fi 6 wireless networking, 2.5 Gigabit Ethernet, various USB ports, including Type-C, and Realtek 7.1 channel audio CODEC. You'll find a pre-mounted shield on the rear I/O panel. This panel includes one HDMI 2.1 port, several USB ports at different speeds (10 Gbps, 5 Gbps, and 480 Mbps), one 2.5 GbE RJ45 network port, two Wi-Fi antenna connections, and three audio jacks. For those looking to customize, the board offers three Addressable RGB Gen 2 headers. Exact pricing is yet to be revealed.

ASUS silently releases its first AMD B850 motherboard featuring the GC-HPWR connector, allowing it to deliver up to 600 W to a compatible graphics card without needing external cables. The TUF Gaming B850 BTF Wi-Fi W motherboard supports Ryzen 7000, 8000, and 9000 CPUs, including the latest 9950X3D, and offers all the typical features expected from a mid-tier AMD motherboard. On a quick look over main specifications, we can see it uses a 14+2+1 power stage design and an eight-layer PCB, supports DDR5 memory up to 8000 MT/s, PCIe 5.0 x16 with updated Q-Release system, one Gen 5 M.2 slot, ALC1220P audio, and BIOS flashback.

ASUS first created its Back to the Future (BTF) lineup with the intention of moving all motherboard connectors to the back of the PCB. While this makes installation and cable routing a bit more challenging, it results in a much tidier-looking motherboard and a cleaner overall system look without the usual mess of wires. BTF-compatible GPUs help eliminate power cables by replacing the standard 8-pin or 12VHPWR connectors with a metal plug at the end of the PCIe slot. ASUS is now bringing this connector to its more affordable B850 boards, which could help make this rare GPU power solution more common. As a BTF board, it hides all cable connectors on the front—even for GPU power as we said, you'll find the GC-HPWR connector at the end of the PCIe x16 slot, just below the RAM slots. However, you don't have to use this feature—the motherboard works fine with any modern graphics card, whether it relies on the new power option or standard connectors. That said, to achieve a completely cable-free setup, you'll need to pair it with one of ASUS's BTF graphics cards. This currently limits you to the RTX 40-series, as ASUS has yet to release any 50-series BTF cards. The fact that ASUS is adding this new type of connector to midrange motherboards could suggest that it plans to expand the BTF lineup in the future. ASUS didn't reveal pricing or any release date information for the TUF Gaming B850 BTF Wi-Fi W motherboard.

Last month, ASRock added two "brand-new" B650M Pro X3D motherboard models to its global website. The Taiwanese manufacturer did not release any press material at the time, so the low-key additions were only spotted by watchful PC hardware news outlets. At the time, ASRock signalled that the eventual launch of "Pro X3D" mainboards would be restricted to certain market regions. Roughly a month later, momomo_us has stumbled across fresh listings in Japan. Yodobashi and Dospara are ready to ship out the ASRock B650M Pro X3D WiFi SKU to local customers. Respective price points—including VAT—are 26,640 yen (~$179 USD), and 23,980 yen (~$161 USD).

Curiously, the B650M Pro X3D series registers as an almost perfect visual match when compared to ASRock's "slightly older" B850M Pro RS mainboard family. Dospara's current price for the B850M Pro RS WiFi SKU is 27,800 yen (~$186.61 USD). This "refreshed" B650M design is up-to-date enough with PCI-E 5.0 support for mounted graphics cards and SSDs. According to the brand's product description: "(our Pro X3D motherboard series) is optimized for AMD Ryzen (9000 and 7000) X3D processors, delivering superior stability, compatibility, and enhanced performance, making it ideal for gaming and creating." Due to apparent confusion between "Pro X3D" and the latest "Pro RS" aesthetic, ASRock is not expected to roll out of with a wide release (of the former).

Without making any official announcement, Colorful silently listed a new AMD B850 microATX (244 mm x 235 mm) motherboard on their Chinese website: the Battle-AX B850M-E Wi-Fi V14. The model is clearly oriented toward entry-level builds and users on a tight budget, a sharp contrast to the CVN B850I Gaming Frozen that Colorful introduced this week. Built around AMD's B850 chipset, it supports the latest AMD AM5 Ryzen 7000, 8000, and 9000 series processors. The two DDR5 dual-channel memory slots can accommodate up to 96 GB (max. 48 GB per slot), with a maximum speed of 7600 MHz (OC) and support for both XMP and EXPO. For storage and expansion, the motherboard offers 2x M.2 slots (1x PCIe 5.0 x4 and 1x PCIe 4.0 x4), one PCIe 4.0 x16 slot, and one PCIe 4.0 x4 slot. It also features a Realtek RTL8111K for 1GbE wired connectivity and Intel's AX200 Wi-Fi 6 with Bluetooth 5.2 for wireless connections.

The build is "very spartan," so to speak, with a black PCB, a single 8-pin EPS power connector for the CPU, no integrated I/O rear shield panel or VRM cooling—the only heatsink present is the one covering the AMD B850 chipset. Regarding power delivery, it seems that Colorful used a simple (budget-friendly) 7+2 phase approach. The rear I/O panel offers a surprise: an ancient PS/2 port (just wondering who's going to use it aside from some retro-nostalgic users). Then we have the usual array of connectors, including six USB ports (4x USB 2.0, 2x USB 3.2 Gen 1), DisplayPort 1.2, HDMI 2.0, Gigabit RJ45, two Wi-Fi antenna ports, audio jacks, and one BIOS reset/update button (placed just next to the PS/2 port).

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, introduces the CVN B850I GAMING FROZEN Mini-ITX motherboard for the Ryzen 9000 Series processors. The CVN B850I GAMING FROZEN is a compact yet powerful Mini-ITX motherboard featuring a sleek design that blends geometric slanted lines with military-inspired elements. It is equipped with a dedicated PCIe 5.0 M.2 heatsink and CNC composite cooling grooves, enhancing thermal efficiency while emphasizing the motherboard's rugged and durable construction.

Built with the B850 chipset, the CVN B850I supports AMD Ryzen 7000, 8000, and 9000 series processors. It features a 10-layer high-speed PCB with a 9+2+1 phase power delivery system, ensuring stable performance even for the high-end Ryzen 9 9950X. Additionally, the second-generation memory routing design enables support for up to 8000 MHz dual-channel DDR5 memory. The motherboard also includes a PCIe 5.0 GPU slot, dual front and rear Type-C 10G ports, and a Wi-Fi 6E module, making it ideal for building a high-performance, wireless Ryzen-based system.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC solutions, today introduced the new B850MT2-E DJ motherboard. Built on AMD's B850 chip architecture, B850MT2-E DJ is tailor-made for casual home and office use.

Engineered to support the latest AMD Ryzen 9000, 8000, and 7000 series processors, the B850MT2-E DJ ensures seamless multitasking and efficient power management, making it an ideal choice for modern computing needs. Supporting up to 128 GB of DDR5 across two DIMM slots, the B850MT2-E DJ offers more bandwidth than DDR4, delivering faster data access and smoother performance. Additionally, PCIe 4.0 M.2 support provides lower latency and lightning-fast speeds of up to 64 Gb/s, doubling the bandwidth of PCIe 3.0 M.2 for quick data transfers and minimal load times, ensuring a smooth and efficient user experience.

Press outlets have spotted two new B650M motherboard models on ASRock's product site; the B650M Pro X3D and B650M Pro X3D WiFi (6E). According to the manufacturer's descriptions, both are advertised as: "optimized for AMD Ryzen X3D processors, delivering superior stability, compatibility, and enhanced performance, making it ideal for gaming and creating." The "Pro X3D" SKUs have not launched at retail, so pricing information is not available at the time of writing. ASRock could publish a dedicated press release in the near future, but we are looking at a very quiet reveal. Curiously, the Taiwan-based motherboard and graphics card specialist has seemingly "downcycled" its fairly new B850M Pro "Race Sport" RS board design.

VideoCardz's coverage of the Pro X3D series includes a handy image comparison tool. When lined up against each other (visually), the B650M Pro X3D and B850M Pro RS designs are nigh identical. Two of the images (below) show a minor difference in printed-on model names. As expected, the ASRock website comparison tool reveals only minor disparities between respective specification sheets. The standard B850M Pro RS variant is currently on sale for $148 (normally $180). The B650M Pro X3D (non-WiFi 6E) equivalent could arrive at retail with a slightly lower price point. ASRock has signalled that its "Pro X3D" mainboard series will only be available within certain regions. According to VideoCardz, a comprehensive global rollout is not planned.

GIGABYTE introduced its STEALTH series motherboard design at last summer's Computex event; where TechPowerUp staffers inspected a B650E AORUS STEALTH ICE sample model. The Taiwanese manufacturer was readying new board SKUs with backside connectors (power and I/O); destined to take on similar products from rival companies. GIGABYTE's debut wave of STEALTH did not include any AMD X670 chipset-based options, but a recent ECC filing points to possible forthcoming X870-based models. A weekend sleuthing session—performed by harukaze5719—unearthed multiple registrations of X870 and B850 boards. Two unannounced STEALTH ICE models were highlighted in the regional registry.

The X870 and B850 AORUS STEALTH ICE models are expected to arrive within the coming months, reportedly sporting familiar white designs—as seen on GIGABYTE's current-gen option. Insiders believe that a high-end X870E-based offering will not emerge, due to STEALTH occupying a very niche market segment. According to a Chinese leaker, B850 models could arrive in ATX and microATX form factors. Further up in product hierarchies, they reckon that the X870 AORUS STEALTH series: "comes standard with PCIe 5.0 and DDR5 overclocking support. The flagship model comes with dual Thunderbolt 4 interfaces." GIGABYTE's back-connected X870 and B850 board designs could demand high asking prices; their current B650E AORUS STEALTH ICE is not readily available, but in some regions it is selling for $320+.

One feature that gamers have loved about AMD Ryzen processors is the company's commitment to socket longevity. If you have a PC with an AMD Ryzen 7000 Series CPU and an AM5 motherboard, for example, you're able to upgrade to an AMD Ryzen 9000 Series CPU without stripping your PC down to the studs and replacing the motherboard. But perhaps you're starting from scratch with your first AM5 PC. In that case, you have several years' worth of AM5 motherboard options to consider, including the TUF Gaming B850-Plus WiFi from our B850 motherboard family.

For years, one of the most popular AM5 motherboards has been the TUF Gaming B650-Plus WiFi. This rock-solid, battle-proven board delivers on all fronts with its durable design, comprehensive cooling, and ruggedized aesthetic. Yet if you're building a new PC in 2025, we think you'll be happier in the long run with this board's successor, the TUF Gaming B850-Plus WiFi. Armed with key updates like a bolstered power solution, PCIe 5.0 x16 slot, Wi-Fi 7, and more and faster USB ports, this motherboard offers incredible value for your gaming rig.

Sapphire Technology has introduced a new NITRO+ motherboard model in China—weekend reports pointed to a listing on JD.com, where the latest addition resides alongside various previous-gen B650 options. This appears to be another region specific release—priced at 1299 RMB (~$179 USD). The NITRO+ B850M Wi-Fi model seems to share its overall aesthetic design with the preceding B650M-equipped equivalent. As surmised by VideoCardz, the Sapphire NITRO+ board's VRM patterning reminded them of the leaked premium-tier Radeon NITRO+ RX 9070 graphics card series.

The generational jump from AMD B650 to B850 chipset—as expected—yields only minor benefits (see below). The older NITRO+ B650M Wi-Fi model is a significantly cheaper prospect; coming in at 899 RMB ($124 USD). VideoCardz's weekend detective work settled on a nice improvement: "based on our research, the memory overclocking support has increased from 7600 MT/s+ to 8000 MT/s. Keep in mind that these figures may be higher for both motherboards; this is just what Sapphire guarantees when paired with a supported memory kit." Industry watchdogs believe that ASRock is likely involved in the contract manufacturing of Sapphire's motherboard offerings—the former has been long-involved in pumping out NZXT-badged products.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, proudly announces that its entire lineup of AM5 motherboards fully supports the AMD Ryzen 9 9950X3D and 9900X3D processors. With this seamless compatibility, gamers can harness the full potential of these flagship processors for an unparalleled gaming experience.

The AMD Ryzen 9 9950X3D and 9900X3D processors are the flagship models of the Ryzen 9000X3D series, designed for hardcore gaming enthusiasts who demand the ultimate in gaming performance. ASRock AM5 motherboards offer seamless compatibility with the Ryzen 9000X3D series, making them the ideal choice for gamers worldwide to experience the power of the AMD Ryzen 9 9950X3D and 9900X3D processors firsthand.

MSI introduced an impressive number of new AMD B850 and B840 chipset-based motherboards at January's CES trade event. According to a Wccftech report, the company's AM5—socketed lineup will expand in the near future—a leaked presentation slide provides an early preview of (allegedly) incoming budget-friendly offerings. MSI's leaked roadmap (Q1 to Q2 2025) shows new additions—mostly smaller form factor—across performance (MPG) and Pro Series product ranges. Their Arsenal Gaming (MAG) B850 range seems to be fully released, as of the first quarter of this year—consisting of models already unveiled at CES.

Five new models are seemingly lined up for release within the next couple of months—the Wccftech article listed the following SKUs: MPG B850I Edge WIFI (Mini-ITX), PRO B850M-P WIFI (M-ATX), PRO B850M-B (M-ATX), B850 Gaming PLUS WIFI PZ (ATX) and PRO B850M-A WIFI PZ (M-ATX). The publication commented on its discoveries: "as you can see, MSI will have at least one new variant within the MPG lineup which will feature a Mini-ITX design. The company has already released the full ATX-sized version of the EDGE TI WIFI, and it's nice to know that we will get a Mini-ITX variant too." The report proposes that MSI has prepped its new budget models with the latest connectivity features—most notably, Wi-Fi 7 rated at the full 320 MHz band. Support for Zen 4 and 5 Ryzen X3D CPUs is expected upon launch.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, PC peripherals, and IPC solutions, introduces the B850MT-E PRO motherboard, designed to deliver exceptional performance for office professionals and casual use. The BIOSTAR B850MT-E PRO motherboard is designed to meet the diverse needs of various users, offering a perfect blend of performance and reliability. Built on AMD 's B850 chipset, this motherboard combines superior features at an affordable price. It supports the latest AMD Ryzen 9000, 8000, and 7000 series processors, enabling seamless multitasking and efficient power management.

The B850MT-E PRO is expertly engineered for versatility, making it the definitive solution for office professionals, small businesses, and system integrators. It guarantees stable and efficient performance for everyday tasks and document management. With BIOSTAR's renowned 55 A Dr. MOS and Digital PWM technology, you can expect steady power delivery that ensures consistent performance and enhanced durability, even during extended work sessions.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.