Nintendo's Switch 2 hybrid console is due to arrive at retail tomorrow (June 5), and pre-launch marketing campaigns are in full swing. The Japanese gaming giant has called in a high profile partner—Jensen Huang—to add some surprisingly technical heft during hype festivities. At this stage in time, NVIDIA's Tegra "T239" chipset is a well known quantity—thanks to years of leaked "internal info," and disabled examples turning up for close analysis in China. Industry experts did not anticipate Nintendo's fairly frank discussions that covered Switch 2's hardware capabilities. The Nintendo "Creator's Voice" video series has featured a number of high-profile third-party software development buddies (including CD Projekt RED), but yesterday's Team Green CEO contribution received widespread press attention.

Jensen paid tribute to Satoru Iwata, a former and much missed Nintendo president. Their collaboration started during the era of OG Switch development: "he wanted to create something no one had seen before. A console powerful enough for big, cinematic games—but small enough to take anywhere. It sounded impossible. But that vision became the original Nintendo Switch. We lost Iwata-san before the launch, but his clarity, his purpose, it still inspires our work every day. Together, we poured everything into that system." As mentioned back in April, NVIDIA dedicated significant resources into making their latest "technical marvel."

Demand for AI accelerators has surged in recent years, putting pressure on suppliers to deliver more high-bandwidth memory to enable faster training and higher token throughput in inference. In response, Intel, SoftBank, and the University of Tokyo have quietly formed a new startup called "Saimemory" to develop an alternative to existing HBM solutions, by also using stacked DRAM. According to sources close to the effort, prototype chips are slated for 2027, with volume production aimed at 2030. The venture will combine Intel's extensive chip design experience with novel memory patents from the University of Tokyo, while SoftBank has pledged approximately ¥3 billion (approximately $21 million) to fund the research. Riken Research Institute and Shinko Electric Industries may also join as investors or technical partners, and the team plans to seek government support to accelerate development.

Traditional HBM relies on through-silicon vias (TSVs) to link multiple DRAM dies and uses a wide-bus interposer to achieve data rates above 1 TB/s. Saimemory's design reorganizes signal routing and refresh management to improve energy efficiency, latency, and performance. As readers may recall, there have been past efforts to introduce a rival stacked DRAM technology, but it has not been successful. For example, the Hybrid Memory Cube (HMC), co-developed by Samsung and Micron Technology around 2011, promised speeds up to fifteen times that of DDR3. Despite initial industry backing through the Hybrid Memory Cube Consortium, Micron discontinued HMC production in 2018 after it failed to gain market adoption. HMC's decline shows the challenge of displacing hard-rooted memory standards like HBM. If the Saimemory succeeds, Intel will likely be the first adopter with its upcoming AI accelerators. Others, such as AMD and NVIDIA, could also be approached by the consortium to get a trial chip. Still, the feasibility of mass deployment will largely depend on availability and yields.

The Surface Laptop Studio 2 could be the last of its kind; according to Tom Warren's latest theories. Yesterday, The Verge's senior editor envisioned a streamlined future lineup of Microsoft's portable PC devices. According to inside track information, the tech giant is expected to announce the end-of-life (EOL) status for this relatively young branch of Surface products (debuted back in 2021). The Surface Laptop Studio 2 is advertised as being "a laptop like no other"—courtesy of a unique/versatile setup that features a "dynamic woven hinge." Three hybrid configurations are officially outlined as: "laptop mode for productivity, stage mode for streaming, and studio mode for creativity." Current generation models are powered by Intel's 13th Gen Core i7-13700H processor (aka the "Evo" platform), and can be configured with discrete NVIDIA mobile graphics solutions (GeForce RTX 4060, RTX 4050, or RTX 2000 Ada Generation). Under normal circumstances, a baseline build—reliant on an iGPU—starts at about $2400.

At the time of writing, Microsoft has not acknowledged The Verge's insider report. So far, resellers have shared top secret info—indicating an upcoming official announcement; possibly due by next month. Another group of unnamed sources claim that Surface Laptop Studio 2 manufacturing activities have already ended, as of early May (2025). The megacorporation has culled other Surface products in the past; sometimes coinciding with the departure of key executive team members and mass layoffs. A few days ago, mainstream news outlets covered Microsoft's latest batch of staff reductions—affecting roughly 6000 workers. Warren's article dashes all hopes of a potential third-gen design: "there doesn't appear to be a Surface Laptop Studio 3 on the horizon."

At the recent AI Semiconductor Forum in Seoul, Samsung Electronics revealed that it will adopt hybrid bonding in its upcoming HBM4 memory stacks. This decision is intended to reduce thermal resistance and enable an ultra‑wide memory interface, qualities that become ever more critical as artificial intelligence and high‑performance computing applications demand greater bandwidth and efficiency. Unlike current stacking methods that join DRAM dies with tiny solder microbumps and underfill materials, hybrid bonding bonds copper‑to‑copper and oxide‑to‑oxide surfaces directly, resulting in thinner, more thermally efficient 3D assemblies. High‑bandwidth memory works by stacking multiple DRAM dies on top of a base logic die, with through‑silicon vias carrying signals vertically through each layer. Traditionally, microbumps routed horizontal connections between dies, but as data rates increase and stack heights grow, these bumps introduce significant electrical and thermal limitations.

Hybrid bonding addresses those issues by allowing interconnect pitches below 10 micrometers, which lowers both resistance and capacitance and improves overall signal integrity. SK hynix has taken a different path. The company is enhancing its molded reflow underfill (MR‑MUF) process to produce 16‑Hi HBM4 stacks that comply with JEDEC's maximum height requirement of 775 micrometers. The company believes that if its advanced MR‑MUF technique can achieve performance on par with hybrid bonding, they will avoid the substantial capital investment needed for the specialized equipment that true 3D copper bonding requires. The cost and space demands of hybrid bonding equipment are significant. Specialized lithography and alignment tools occupy more clean‑room real estate, increasing capital expenditures. Samsung may mitigate some of these costs through Semes, its in‑house equipment subsidiary, but it remains uncertain whether Semes can deliver production‑ready hybrid bonding systems in time for mass production. If Samsung successfully qualifies its HBM4 stacks using hybrid bonding, which it plans to begin manufacturing in 2026, the company could gain a competitive edge over Micron and SK hynix.

Late last month, Kurnal (@Kurnalsalts) shared a partial die shot of a supposed Nintendo Switch 2 chipset—this teaser image seemed to verify previous leaked claims about the forthcoming next-gen hybrid gaming console being powered by a custom NVIDIA "T239" SoC design. Two weeks after the fact, Kurnal has boasted about delivering an alleged "world's first Nintendo Switch 2 die shot." Their social media post included a couple of key specification data points: "Samsung 8N (8 nm), eight Cortex-A78C cores, (shared) 4 MB L2 cache, and 1536 CUDA/6TPC 'Ampere' GPU." Another leaker—Geekerwan—said that they acquired a "Switch 2 motherboard" via Xianyu. This Chinese equivalent to eBay seems to be a veritable treasure trove of tech curiosities.

Earlier on in 2025, black market sellers were attempting to offload complete pre-launch Switch 2 packages for big money. As reported by VideoCardz, recent acquisitions only involved the securing of non-functional motherboard + SoC units—Kurnal disclosed a 1000 RMB (~$138 USD) price point. Digital Foundry's Richard Leadbetter is a very visible advocate of the Switch 2 chipset being based on a mature 8 nm Samsung node process. His personal belief was aimed at certain critics; these opposers predicted 5 nm manufacturing origins. Older leaks suggested a larger than expected die footprint—relative to Switch 1's internal setup; almost twice the size—leading to Leadbetter's conclusion. Comparison charts—produced by Kurnal and Geekerwan—propose an occupied area of 207 mm².

IBM is working with Oracle to bring the power of watsonx, IBM's flagship portfolio of AI products, to Oracle Cloud Infrastructure (OCI). Leveraging OCI's native AI services, the latest milestone in IBM's technology partnership with Oracle is designed to fuel a new era of multi-agentic, AI-driven productivity and efficiency across the enterprise. Organizations today are deploying AI throughout their operations, looking to take advantage of the extraordinary advancements in generative AI models, tools, and agents. AI agents that can provide a single, easy-to-use interface to complete tasks are emerging as key tools to help simplify the deployment and use of AI across enterprise operations and functions. "AI delivers the most impactful value when it works seamlessly across an entire business," said Greg Pavlik, executive vice president, AI and Data Management Services, Oracle Cloud Infrastructure. "IBM and Oracle have been collaborating to drive customer success for decades, and our expanded partnership will provide customers new ways to help transform their businesses with AI."

Watsonx Orchestrate to support multi-agent workflows
To give customers a consistent way to build and manage agents across multi-agent, multi-system business processes, spanning both Oracle and non-Oracle applications and data sources, IBM is making its watsonx Orchestrate AI agent offerings available on OCI in July. This multi-agent approach using wastonx Orchestrate is designed to work with the expansive AI agent offerings embedded within the Oracle AI Agent Studio for Fusion Applications, as well as OCI Generative AI Agents, and OCI's other AI services. It extends the ecosystem around Oracle Fusion Applications to enable further functionality across third-party and custom applications and data sources. The first use cases being addressed are in human resources. The watsonx Orchestrate agents will perform AI inferencing on OCI, which many customers use to host their data, AI, and other applications. IBM agents run in watsonx Orchestrate on Red Hat OpenShift on OCI, including in public, sovereign, government, and Oracle Alloy regions, to enable customers to address specific regulatory and privacy requirements. The agents can also be hosted on-premises or in multicloud environments for true hybrid cloud capabilities.

Stack Your Way to the Throne! The wait is over—Drop Duchy is now available on Steam! It's time to start building your glorious duchy, outsmart your enemies, and claim your place as the greatest ruler of them all! A Medieval puzzle-strategy game like no other: in a charming, maquette-inspired medieval world, Drop Duchy blends deckbuilding, puzzle mechanics, and rogue-lite progression into one seamless, strategic experience.

Build your duchy piece by piece by thoughtfully placing terrain tiles and buildings. Gather resources and rally your forces to vanquish your enemies. Customize your deck with over 110 unique cards to match your playstyle and optimize your realm's growth. Enjoy endless replayability by unlocking new cards and uncovering fresh combos and strategies with every run! With its unique blending of genres, Drop Duchy has a charming, minimalist look that you'll love, along with fun and refreshing tactical gameplay that'll keep you coming back for more!

This week, IBM and Tokyo Electron (TEL) announced an extension of their agreement for the joint research and development of advanced semiconductor technologies. The new 5-year agreement will focus on the continued advancement of technology for next-generation semiconductor nodes and architectures to power the age of generative AI. This agreement builds on a more than two-decade partnership between IBM and TEL for joint research and development. Previously, the two companies have achieved several breakthroughs, including the development of a new laser debonding process for producing 300 mm silicon chip wafers for 3D chip stacking technology.

Now, bringing together IBM's expertise in semiconductor process integration and TEL's leading-edge equipment, they will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI. "The work IBM and TEL have done together over the last 20 years has helped to push the semiconductor technology innovation to provide many generations of chip performance and energy efficiency to the semiconductor industry," said Mukesh Khare, GM of IBM Semiconductors and VP of Hybrid Cloud, IBM. "We are thrilled to be continuing our work together at this critical time to accelerate chip innovations that can fuel the era of generative AI."

AMD has launched a new open-source project called, GAIA (pronounced /ˈɡaɪ.ə/), an awesome application that leverages the power of Ryzen AI Neural Processing Unit (NPU) to run private and local large language models (LLMs). In this blog, we'll dive into the features and benefits of GAIA, while introducing how you can take advantage of GAIA's open-source project to adopt into your own applications.

Introduction to GAIA
GAIA is a generative AI application designed to run local, private LLMs on Windows PCs and is optimized for AMD Ryzen AI hardware (AMD Ryzen AI 300 Series Processors). This integration allows for faster, more efficient processing - i.e. lower power- while keeping your data local and secure. On Ryzen AI PCs, GAIA interacts with the NPU and iGPU to run models seamlessly by using the open-source Lemonade (LLM-Aid) SDK from ONNX TurnkeyML for LLM inference. GAIA supports a variety of local LLMs optimized to run on Ryzen AI PCs. Popular models like Llama and Phi derivatives can be tailored for different use cases, such as Q&A, summarization, and complex reasoning tasks.

Compal recently showcased a concept for a laptop that can switch from a typical 14-inch laptop, to an ultra-wide 18-inch laptop with the help of foldable display technology. While the concept is undoubtedly quite interesting, there is no denying that the device is pretty far from mass-production. The company seemingly has yet another concept up its sleeve, which has also raked in an iF design award. Essentially, Compal's Hybrid AIO concept consists of an AIO desktop that can transform into a laptop, or even a tablet. Specifications and technical details are scarce, which is to be expected considering that the concept solely depicts the overall form factor of the product.

The AIO seemingly boasts an additional display mounted on one side of the monitor, which can be detached and used as a standalone tablet. This tablet, can then be attached with a keyboard base, which will allow it to function as a laptop. This keyboard base will also function as a wireless keyboard for the AIO, and judging by the images, it might also serve as a smartphone stand. It is not clear if the stand will have wireless charging, which should surely be a nifty feature. For those wondering where the actual guts of the AIO will exist, will likely be surprised to know that it is the tablet which will contain the computer. The AIO's primary display is simply a larger, secondary monitor for the tablet, and the keyboard base is just an accessory. Overall, the concept does look pretty neat, especially for those of us who prefer to switch up workstations every now and then, or are looking for a single system that can serve as a work, travel, as well as an entertainment hub.

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced the launch of the Hybrid M, a revolutionary gaming chair engineered to redefine comfort for gamers, creators, and professionals. Integrating advanced massage technology, cordless power, and premium ergonomic design, the Hybrid M transforms long hours at the desk into a seamless experience of performance, relaxation, and rejuvenation.

A Chair That Works as Hard as You Do
Imagine this: You're deep in a high-stakes gaming session, pushing your skills to the limit, or perhaps you're finalizing an intricate video edit after hours of meticulous work. The clock keeps ticking, but your body begins to protest—muscles tense, posture slouches, and fatigue takes hold. What if your chair could do more than just support you? What if it could help you stay focused, relaxed, and at peak performance? Cooler Master saw an opportunity to revolutionize the way we experience seating. Enter the Hybrid M—a chair designed to multitask as effectively as the users who rely on it.

At MWC 2025, Lenovo unveils its latest portfolio of AI-powered business devices, featuring next-generation ThinkPad and ThinkBook laptops, expanded software and recent ThinkShield security solutions, and showcases visionary proof-of-concept innovations. Designed to enhance productivity, personalization, and business protection, these new devices integrate AI-driven computing, flexible form factors, and enterprise security solutions to meet the evolving demands of professionals and hybrid workers.

"AI is fundamentally transforming how businesses operate, and at Lenovo, we are committed to delivering smarter, more secure, and more adaptable solutions that empower professionals in today's fast-evolving workplace. Our latest ThinkPad and ThinkBook innovations leverage AI to enhance productivity, streamline IT management, and provide more secure and seamless hybrid work experiences," said Eric Yu, SVP of SMB and Commercial Product Center, Lenovo Intelligent Devices Group. "The ThinkBook codename Flip AI PC Concept exemplifies our vision for the future—where AI-powered devices drive efficiency, personalization, and collaboration like never before. With our expanding portfolio of AI-integrated business devices and intelligent IT solutions, Lenovo is helping organizations to harness the power of AI in an ever-changing world."

IBM (NYSE: IBM) today announced it has completed its acquisition of HashiCorp, whose products automate and secure the infrastructure that underpins hybrid cloud applications and generative AI. Together the companies' capabilities will help clients accelerate innovation, strengthen security, and get more value from the cloud.

Today nearly 75% of enterprises are using hybrid cloud, including public clouds from hyperscalers and on-prem data centers, which can enable true innovation with a consistent approach to delivering and managing that infrastructure at scale. Enterprises are looking for ways to more efficiently manage and modernize cloud infrastructure and security tasks from initial planning and design, to ongoing maintenance. By 2028, it is projected that generative AI will lead to the creation of 1 billion new cloud-native applications. Supporting this scale requires infrastructure automation far beyond the capacity of the workforce alone.

Lenovo Group Limited (HKSE: 992) (ADR: LNVGY), together with its subsidiaries ('the Group'), today announced Q3 results for fiscal year 2024/25, reporting significant increases in overall group revenue and profit. Revenue grew 20% year-on-year to US$18.8 billion, marking the third consecutive quarter of double-digit growth. Net income more than doubled year-on-year to US$693 million (including a non-recurring income tax credit of US$282 million) on a Hong Kong Financial Reporting Standards (HKFRS) basis. The Group's diversified growth engines continue to accelerate, with non-PC revenue mix up more than four points year-on-year to 46%. The quarter's results were driven by the Group's focused hybrid-AI strategy, the turnaround of the Infrastructure Solutions Group, as well as double-digit growth for both the Intelligent Devices Group and Solutions and Services Group.

Lenovo continues to invest in R&D, with R&D expenses up nearly 14% year-on-year to US$621 million. At the recent global technology event CES 2025, Lenovo launched a series of innovative products, including the world's first rollable AI laptop, the world's first handheld gaming device that allows gamers free choice of Windows OS or Steam OS, as well as Moto AI - winning 185 industry awards for its portfolio of innovation.

Shrinking components was (and still is) the main way to boost the speed of all electronic devices; however, as devices get tinier, making them becomes trickier. A group of scientists from SANKEN (The Institute of Scientific and Industrial Research), at Osaka University has discovered another method to enhance performance: putting a special metal layer known as a metamaterial on top of a silicon base to make electrons move faster. This approach shows promise, but the tricky part is managing the metamaterial's structure so it can adapt to real-world needs.

To address this, the team looked into vanadium dioxide (VO₂). When heated, VO₂ changes from non-conductive to metallic, allowing it to carry electric charge like small adjustable electrodes. The researchers used this effect to create 'living' microelectrodes, which made silicon photodetectors better at spotting terahertz light. "We made a terahertz photodetector with VO₂ as a metamaterial. Using a precise method, we created a high-quality VO₂ layer on silicon. By controlling the temperature, we adjusted the size of the metallic regions—much larger than previously possible—which affected how the silicon detected terahertz light," says lead author Ai I. Osaka.

We previously covered the announcement of the One-Netbook OneXPlayer G1, a hybrid handheld gaming laptop with a unique removable keyboard and trackpad module that hides PS Vita-like game controls, but a launch date for the Ryzen-powered Windows handheld was unknown until now. One-Netbook has now officially launched the Indiegogo crowdfunding page for the OneXPlayer G1, providing more details about the upcoming hybrid's launch configurations and confirming a January launch date. Still missing from the Indiegogo page, though, are any indications of pricing or memory configurations for the G1.

Notebookcheck also says it received confirmation from One-Netbook that the OneXPlayer G1 will launch on January 9, and that it will only be available initially via Indiegogo. As for launch configurations, the G1 will be equipped with an AMD Ryzen AI 9 HX 370, a 144 Hz, 8.8-inch, 2.5 K, IPS touchscreen display, and a 14,283 mAh battery. It will also offer OcuLink and dual USB4 ports, for enhanced connectivity and compatibility with a variety of eGPU solutions.

LG Electronics (LG) is set to unveil its 2025 LG gram lineup, the company's first on-device AI-powered laptops, at CES 2025 in January. The new lineup includes innovative models such as the gram Pro, gram Pro 2-in-1, gram and gram Book. Leveraging LG's gram AI technology, the latest grams deliver state-of-the-art capabilities and stellar performance, harnessing large language models and personalized AI features to elevate the user experience - all while preserving the series' iconic slim and lightweight design.

Enhancing Productivity and Personalization with LG gram AI
The 2025 gram laptops present a smarter, more secure and highly-personalized user experience through LG's innovative gram AI. With gram chat On-Device, these laptops utilize AI algorithms to process and analyze data locally without requiring a network connection. At the same time, they provide convenient access to cloud-based AI services via gram chat Cloud, powered by GPT-4o. This subscription-based service, which uses GPT-4o, is offered free of charge for the first year. The integration of on-device and cloud-based AI creates a hybrid AI solution that enhances productivity by delivering personalized insights, a comprehensive knowledge base and an intuitive, ever-evolving experience that adapts to users' needs.

Today at its inaugural IBM Quantum Developer Conference, IBM announced quantum hardware and software advancements to execute complex algorithms on IBM quantum computers with record levels of scale, speed, and accuracy.

IBM Quantum Heron, the company's most performant quantum processor to-date and available in IBM's global quantum data centers, can now leverage Qiskit to accurately run certain classes of quantum circuits with up to 5,000 two-qubit gate operations. Users can now use these capabilities to expand explorations in how quantum computers can tackle scientific problems across materials, chemistry, life sciences, high-energy physics, and more.

The EuroHPC Joint Undertaking (EuroHPC JU) has signed a purchase agreement with IQM Quantum Computers (IQM), a global leader in designing, building, and selling superconducting quantum computers. Under the agreement, IQM will deliver two advanced Radiance quantum systems of 54 qubits and 150 qubits in the second half of 2025 and by the end of 2026, respectively.

The two distinct systems, featuring high-quality qubits and industry-leading fidelities will play a pivotal role in executing quantum algorithms across a range of application domains.

Edifier International, the award-winning audio electronics designer, announces the NeoDots True Wireless earbuds featuring a hybrid driver unit combined with a digital signal processor for the optimum in sound quality.

The combination of dynamic drivers and balanced armature drivers in audio equipment allows a broad frequency response, where dynamic drivers effectively manage low frequencies, delivering deep and rich bass, whilst the balanced armature drivers handle mid and high frequencies ensuring clear and detailed treble. This synergy results in a well-rounded sound profile that enhances the listening experience across different music genres and audio content.

After a successful product introduction during Computex 2024, Sea Sonic is now launching the sales of the new PRIME PX-2200 power supply. The Seasonic PRIME Series represents Sea Sonic's pinnacle of engineering, blending cutting-edge design with premium materials and advanced production processes. The latest models showcase digital fan control, modern interleaved PFC (Power Factor Correction), and a patented dual-transformer design running in parallel.

Seasonic's Latest Power Milestone Unveiled
The PRIME PX-2200 stands out above all PRIME units by capable of delivering an impressive 2200 watts of power at 80 Plus Platinum EU 230 V levels. Catering to a wide range of power users, this ATX 3.1 and PCIe 5.1 compatible powerhouse delivers top-quality power combined with long-term reliability for various high-performance applications.

PanelSemi, a developer of ultra-thin flexible LED displays and semiconductor substrates, has partnered with NGK Insulators to create high-performance hybrid packaging solutions. Leveraging its tiled thin-film transistor (TFT) circuit fabrication technology, PanelSemi is developing a hybrid circuit board that combines fine wiring and functional circuits on polyimide film with a ceramic substrate. The company is expanding into high-performance circuit boards for semiconductor modules, targeting large-scale panel manufacturing for wireless communications and opto-electronic integration. The collaboration with NGK extends the application of ceramic substrates to higher power and thermal scenarios.

NGK aims to integrate PanelSemi's circuit fabrication technology with its own products, including the ultra-compact EnerCera lithium-ion rechargeable battery, ceramic substrates, and ceramic packages. PanelSemi's HyBrid Substrate (HBS) technology platform features ultra-fine line width and spacing achieved through Thin Film (TF) and Panel Level Packaging (PLP) processes. HBS enables high-density interconnection, functioning as both an interposer and package substrate in advanced packaging, with the top die directly bonded to the HBS.

HAVN make its debut at Computex 2024 with HS 420, and HS 420 VGPU PC cases. The HS 420 stands out with its dual chamber Hybrid Structure, a design that maximizes GPU cooling within a traditional mid-tower footprint. It can support up to 11x 140 mm or 120 mm fans (3x top, 3x right, 3x bottom, 2x rear), and features customizable spaces to fit storage, fans, radiators, and portable displays (LCD VESA display mount included). Of course, HAVN HS 420 supports liquid cooling solutions with up to 420 mm radiators. HAVN HS 420 VGPU features a VGPU kit with a PCIe 5.0 riser cable, an angled fan bracket, and a glass airflow guide.

With 541 x 259.5 x 547 mm, the case supports E-ATX (max. width 277 mm), ATX, M-ATX, and Mini-ITX motherboards, including 6 horizontal, and 4 vertical expansion slots. It also accommodates up to 470 mm graphics card, and up to 220 mm PSU. If you're still wondering who's behind the HAVN brand and design, we can tell you that it's the work of Pro Gamers Group (PGG), some of whom have gained experience working with Fractal, NZXT, Wistron, and Corning. No clear details yet about when the HS 420 / HS 420 VGPU will hit the stores or about pricing.

Acer today announced the expansion of its wireless router portfolio with two new options designed for gamers and a wide range of individuals, including families and remote workers. The Acer Wave 7 leverages the latest Wi-Fi 7 technology to deliver broad, reliable coverage for large homes with many devices, while the Predator Connect W6x utilizes Wi-Fi 6 to prioritize speed and performance for smooth online gaming experiences.

The W6x boasts dual-band connectivity, utilizing both 2.4 GHz and 5 GHz frequencies to ensure strong and consistent signals throughout the home, while the Wave 7 elevates further with the additional support of up to 6 GHz of Wi-Fi 7. Additionally, they come equipped with Hybrid Quality of Service (QoS) software and the Intel Killer Prioritization Engine, working together to identify and prioritize critical network traffic for maximized speed and minimal lag. User-friendly interfaces make setup and management a breeze, while built-in Trend Micro Home Network Security safeguards network and connected devices from potential threats.

Creative Technology today proudly unveils its latest True Wireless Stereo (TWS) earbuds and headphones, the Creative Zen Air SXFI and Creative Zen Hybrid SXFI, designed to transport users into the immersive world of Super X-Fi. With a simple tap, users can expand their soundstage and be engulfed in every detail of their preferred content across platforms like Netflix, Spotify, and YouTube, all powered by the built-in SXFI technology. Boasting additional features such as Adaptive Hybrid ANC and Ambient mode, Bluetooth 5.3, low-latency of up to ~100 ms, the Creative Zen Air SXFI and Creative Zen Hybrid SXFI are poised to redefine how users engage with their favorite content.

Renowned for its ability to recreate the expansive soundstage of a high-end multi-speaker surround system, Super X-Fi now shines in the latest Creative Zen Air SXFI and Creative Zen Hybrid SXFI, enriching users' listening experience with spatial audio. With Super X-Fi activated, users can transcend the boundaries of traditional stereo sound, immersing themselves in a three-dimensional audio world teeming with heightened realism and depth. Whether it's the thunderous roar of a cinematic explosion, the subtle rustle of leaves in a forest, or the precise positioning of footsteps in a game, Super X-Fi delivers unparalleled spatial accuracy and depth, allowing users to truly feel like they're part of the action.