Audioscenic, the UK-based audio technology innovator, announces a technology collaboration with Philips and semiconductor solutions leader NXP Semiconductors, to demonstrate the world's first reference design for gaming soundbars. This breakthrough combines Audioscenic Amphi Hi-D spatial audio featuring AI position sensing with Acoustic Echo Cancellation (AEC) from Philips BeClear. Powered by the NXP i.MX 8M Mini applications processor, this technology enables soundbar manufacturers to deliver fully immersive, location-accurate game audio simultaneously with crystal-clear voice chat—a combination previously unachievable in gaming soundbars. Product designers, product managers, and engineers can experience the reference design in person at Computex Taipei 2025.

Gamers have long faced a trade-off: enjoy rich, immersive sound through speakers or have clear voice communication with teammates through headsets. While headsets have dominated hardcore gaming, many players prefer speaker systems like soundbars for extended comfort without headset fatigue, and a more natural "room-filling" audio experience versus the inside-your-head sound of headsets.

Award-winning embedded solutions provider AAEON (stock code: 6579) has announced the launch of the RICO-MX8P, an NXP i.MX 8M Plus-powered fanless single-board built on the Pico-ITX Plus form factor. Utilizing the i.MX 8M Plus, the RICO-MX8P leverages a platform comprised of a quad-core Arm Cortex -A53 processor, a secondary core Arm Cortex M7, and an optional Neural Processing Unit (NPU) offering up to 2.3 TOPS of inference performance.

Equipped with an integrated Vivante GC7000 UltraLite 3D GPU, a dedicated VPU, MIPI DSI interface, and an HDMI 2.0 port, it is clear AAEON is positioning the RICO-MX8P as a candidate for multimedia applications, with digital signage, smart kiosk, and interactive Digital Out-of-Home (DOOH) advertising earmarked as potential uses. Further benefits to such use are evident from the board's support for APIs like OpenGL ES 3.1, Vulkan, and OpenCL 1.2, alongside its multiformat encoding and decoding capabilities.

Industry leader AAEON has expanded its RISC computing product portfolio with the release of the SRG-IMX8PL and PICO-IMX8PL, a Mini PC and 2.5" PICO-ITX board, respectively. Both products are powered by the NXP i.MX 8M Plus platform, featuring a quad-core Arm Cortex -A53 processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.

Built to provide cost-efficient IoT Gateway solutions in rugged environments, the SRG-IMX8PL and PICO-IMX8PL both offer wide temperature ranges of -40°C to 80°C with the use of a fanless heatsink, a 9 V to 36 V power input range. The SRG-IMX8PL Mini PC also features enhanced shock, drop, and vibration resistance. Dual LAN ports with IEEE 1588 and TSN capabilities, alongside Wi-Fi and 4G module support via M.2 2230 E-Key and full-size mini card, provide each device with broad connectivity options for industrial IoT use. Additionally, both the PICO-IMX8PL and SRG-IMX8PL support a wide range of operating systems, including Debian 11, Android 13, Windows 10 IoT, and Yocto, as well as data communication protocols such as Modbus, MQTT, and OPC Unified Architecture (OPC UA).

After many back and forths, it now appears that TSMC is finally getting ready to start construction of its fab in Dresden, Germany. Multiple news outlets are reporting that TSMC is getting ready to start production on its new fab within the next few weeks, which is ahead of the expected Q4 groundbreaking. That said, TSMC has yet to announce an official date for a groundbreaking ceremony or a date when construction will start, but according to media reports TSMC's Chairman and CEO C.C. Wei will be in Germany at the end of August to sign documents with the German government and during this trip, the groundbreaking ceremony is expected to take place.

Assuming everything goes according to plan, the Dresden fab is expected to start production sometime in late 2027, but it's far from a cutting edge fab, as it'll mainly be supplying the European automotive industry with components. The new fab should start its life with two different process technologies, namely a 28 or 22 nm planar CMOS node as well as a 16 or 12 nm FinFET node. The Dresden fab is said to have a production capacity of around 40,000 12-inch wafers monthly. The new fab is expected to be an investment in excess of €10 billion for TSMC, with the city of Dresden spending an additional €250 million for a special water supply system and enhancements to the power grid. Unlike similar projects, TSMC will not be the sole owner of the new fab, as Infineon, Robert Bosch and NXP are each taking a 10 percent stake in the fab.

In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

Starting in the second quarter, chip companies like AMD have actively engaged with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging and helping drive industry interest in FOPLP. TrendForce observes that there are three main models for introducing FOPLP packaging technology: Firstly, OSAT providers transitioning from traditional methods of consumer IC packaging to FOPLP. Secondly, foundries and OSAT providers packaging AI GPUs that are transitioning 2.5D packaging from wafer level to panel level. Thirdly, panel makers who are packaging consumer ICs.

On June 5th, Vanguard and NXP announced plans to jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a 12-inch wafer plant. TrendForce posits that this move reflects the trend of global supply chains shifting "Out of China, Out of Taiwan"(OOC/OOT), with Taiwanese companies accelerating their overseas expansion to improve regional capacity flexibility and competitiveness.

TrendForce noted that the semiconductor supply chain has been diversifying over the past two years to mitigate geopolitical and pandemic-related risks, forming two major segments: China's domestic supply chain and a non-China supply chain. Recent US tariff increases have accelerated this shift, leading to increased orders from American customers.

During his keynote address today at Intel Foundry Direct Connect, Intel's inaugural foundry event, CEO Pat Gelsinger introduced four members of the company's Foundry Advisory Committee. The committee advises Intel on its IDM 2.0 strategy, including creation and development of a thriving systems foundry for the AI era.
The advisory committee includes leaders from the semiconductor industry and academia, two of whom are also members of Intel's board of directors:

• Chi-Foon Chan, former Co-CEO of Synopsys; former Microprocessor Group general manager at NEC; director at PDF Solutions.
• Joe Kaeser, former CEO of Siemens; supervisory board chair at Siemens Energy and Daimler Truck; supervisory board member at Linde; former member of the board of NXP semiconductor; member of the board of trustees at the World Economic Forum.
• Tsu-Jae King Liu, vice chair of the Foundry Advisory Committee; dean of College of Engineering at the University of California, Berkeley; Intel director; and director at MaxLinear.
• Lip-Bu Tan, chair of the Foundry Advisory Committee; former CEO of Cadence Design Systems; chairman of Walden International; and Intel director; director at Credo Technology Group and Schneider Electric.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor ASA, NXP Semiconductors, and Qualcomm Technologies, Inc., have formally established Quintauris GmbH. Headquartered in Munich, Germany, the company aims to advance the adoption of RISC-V globally by enabling next-generation hardware development.

The formation of Quintauris was formally announced in August, with the aim to be a single source to enable compatible RISC-V-based products, provide reference architectures, and help establish solutions to be widely used across various industries. The initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

DEEPX, a leading AI semiconductor technology company makes significant advancements towards creating an expansive Edge AI ecosystem by introducing innovative Edge AI Development Kits that transcend the limitations of GPUs. The company, known for its pioneering work in artificial intelligence semiconductors for Edge devices, is gearing up to participate in the AI Hardware & Edge AI Summit in Silicon Valley, set to run from September 12th to 14th.

At this prestigious event, DEEPX's CEO Lokwon Kim will share the stage with luminaries like Professor Andrew Ng of Landing AI and Tenstorrent CEO Jim Keller. More than 100 major tech companies, including Microsoft, Google, Intel, AMD, and Qualcomm, will converge to discuss the latest trends and insights in AI hardware and edge AI.

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300 mm fab to support the future capacity needs of the fast-growing automotive and industrial sectors, with the final investment decision pending confirmation of the level of public funding for this project. The project is planned under the framework of the European Chips Act.

The planned fab is expected to have a monthly production capacity of 40,000 300 mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe's semiconductor manufacturing ecosystem with advanced FinFET transistor technology and creating about 2,000 direct high-tech professional jobs. ESMC aims to begin construction of the fab in the second half of 2024 with production targeted to begin by the end of 2027.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company aimed at advancing the adoption of RISC-V globally by enabling next-generation hardware development.

Formed in Germany, this company will aim to accelerate the commercialization of future products based on the open-source RISC-V architecture. The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry. Initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

TSMC, a Taiwanese semiconductor giant, is reportedly talking to its partners to develop an $11 billion (€10 billion) factory in Germany with the help of a few European partners. Currently assessing the plant location for Saxony in Germany, the fab wouldn't only be exclusively made by TSMC but will bring in NXP, Bosch, and Infineon that, will create a budget of around 7 billion Euros, including state subsidies, while the total budget is leaning closer to 10 billion Euros in total. However, it is essential to note that TSMC is still assessing the possibility of a Europe-based plant altogether.

Asking for as much as 40% of the total investment to be European-backed subsidies, TSMC wants to create a European facility that will be focused on a growing sector--automotive. If approved in August, the TSMC plant will become the company's first European facility and will first focus on manufacturing 28 nm chips. As one of the first significant EU Chips Act €43 billion investment, it will heavily boost European semiconductor manufacturing.

ASUS IoT, a global AIoT solution provider, today announced a partnership agreement with Canonical to provide pre-installed and certified versions of the Ubuntu Linux operating system for embedded boards and systems in diverse edge computing applications. New ASUS IoT devices such as the PE100A will be guaranteed by Canonical for optimized performance with Ubuntu Linux, in the interest of improving development time, configuration and installation.

This collaboration between ASUS IoT and Canonical ensures that individual hardware I/O functions conform to industrial-grade standards and to the version of Ubuntu running on the device. Moreover, it provides up to 10 years of Linux security (with five years of bundled ESM service) along with updated capabilities for users in industrial manufacturing, smart retail, smart transportation, surveillance and many other application sectors.

The demand for data is insatiable, from 5G to the cloud to smart cities. As a society we want more autonomy, information to fuel our decisions and habits, and connection - to people, stories, and experiences.

To address these demands, the cloud infrastructure of tomorrow will need to handle the coming data explosion and the effective processing of evermore complex workloads … all while increasing power efficiency and minimizing carbon footprint. It's why the industry is increasingly looking to the performance, power efficiency, specialized processing and workload acceleration enabled by Arm Neoverse to redefine and transform the world's computing infrastructure.

Kinara, Inc., developer of unrivaled Edge AI solutions that accelerate and optimize real-time decision making, today announced that it has partnered with Arcturus Networks Inc., provider of edge AI analytics and enablement for smart city applications, to help customers deliver high-performance, cost-optimized AI solutions.

The partnership combines the Kinara Ara-1 Edge AI processor with Arcturus Brinq edge AI and vision analytics software to drive leading-edge detection, tracking and characterization solutions. The partnership delivers the critical software and hardware platforms required by OEMs to build sophisticated real-time edge applications for public safety, transportation, healthcare, retail, and industrial markets. For example, Kinara and Arcturus can deliver a real-time solution for road condition monitoring, allowing public transportation buses retrofitted with smart cameras to detect road obstructions such as potholes and report them directly to city operations.

The rumour mill never seems to stop churning when it comes to TSMC and now the company is said to be looking at the tiny nation of Singapore for a future fab. This time the information comes via the Wall Street Journal rather than the usual Taiwanese sources and although the publication points out that no decision has been made at this point in time, it says that TSMC is apparently in talks with the Economic Development Board of Singapore. The official statement from the TSMC on the matter is that the company "doesn't rule out any possibility but does not have any concrete plan at this time".

The potential Singapore Fab would be producing 28 to 7 nm chips, in other words, quite far from TSMC's cutting edge nodes. However, TSMC is already building a similar facility in the southern city of Kaohsiung in Taiwan that's scheduled for opening in 2024. As such, the nodes used in a future facility in Singapore might change depending on when the fab will open and it might end up producing chips on more advanced nodes as well. As these fabs take a few years to get going, they're not projects that are started on a whim. We should also mention that TSMC already has a joint venture in Singapore together with NXP, called SSMC, which also produces for third parties.

Due to material shortages caused by insufficient semiconductor supply, to date, power management IC (PMIC) prices remain on an upward trend, according to TrendForce's latest investigations. Average selling price (ASP) for 1H22 is forecast to increase by nearly 10%, reaching a record six year high.

In terms of the global supply chain, in addition to the production capacity of major IDM manufacturers including TI, Infineon, ADI, STMicroelectronics, NXP, ON Semiconductor, Renesas, Microchip, ROHM (Maxim has been acquired by ADI and Dialog by Renesas), IC design houses such as Qualcomm and MediaTek (MTK) have obtained a certain level of production capacity from foundries. Of these, TI is in a leadership position and the aforementioned companies possess a combined market share of over 80%.

According to an industry report by IC Insights, AMD will see a yearly growth rate of no less than 65 percent this year, compared to 2020, whereas Intel is expected to have a slightly negative growth rate of one percent. The report includes the top 25 semiconductor sales leaders, ranked by growth rate, although it should be pointed out that some of them are foundries and not just semiconductor companies.

AMD is closely followed by MediaTek, which is expected to reach a 60 percent growth rate this year, followed by Nvidia at 54 percent and Qualcomm and 51 percent growth. The only surprise in the top five is PRC based SMIC, which saw a 39 percent growth this year, despite, or maybe because of the US sanctions against various Chinese IC makers.

As one of the most important tech summits globally, COMPUTEX Forum and its discussion topics have always garnered great attention. To facilitate the discussion on future technology trends, the COMPUTEX Forum on June 2 and 3 will evolve around the theme of "The New Era of Intelligence." TAITRA announced the lineup of speakers to discuss key applications of 5G, AI, IoT, and electric vehicles, deep diving into business strategies in the post-pandemic era.

In the morning of Wednesday, June 2, COMPUTEX Forum will address the topic of "AIoT Evolution." Leading semiconductor giants such as Intel, Micron, NVIDIA and Supermicro, will explore how they accelerate business opportunities in the 5G era. In the afternoon, NXP Semiconductors will kick off the "AI Empowerment" session by sharing its vision and lead the Secure Edge and AI Empowerment discussions in fields. As AI rises in various applications, Arm, Delta Electronics, Micron and Check Point Software will elaborate their latest solution in different scopes.

Kingston Digital, Inc., the flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it is partnering with NXP Semiconductors on their new i.MX 8M Plus applications processors. NXP is a leading applications processor developer for creating infrastructure solutions involving smart technology, and Kingston is proud that its eMMC embedded memory solution is part of the reference board for its latest application processor.

Smart device makers requesting NXP's engineering verification kits featuring the i.MX 8M Plus chipset will see Kingston's eMMC onboard. This creates a terrific opportunity to expand the relationship with NXP and also further showcase Kingston embedded memory solutions to other IoT manufacturers. Kingston's discrete memory and storage solutions were also embedded on NXP's previous-generation i.MX 6 and i.MX 7 series processor boards.

A federal jury in Texas has ruled that Intel Corporation violated two patents of VLSI Technology and must pay 2.18 billion USD in damages. The damages include 1.5 billion for one patent and 675 million for the other. The patents are related to clock frequency control and minimum memory operating voltage technique and were awarded to Freescale Semiconductor Inc in 2012 and SigmaTel in 2010. Freescale bought SigmaTel gaining control of the two patents before being passed to NXP after the company acquired Freescale in 2015, these patents were then transferred to the newly resurrected VLSI Technology in 2019 with the sole purpose of launching a legal battle against Intel. In a comment to Tom's Hardware the company said "Intel strongly disagrees with today's jury verdict. We intend to appeal and are confident that we will prevail.". This legal battle will likely drag-out for several years as Intel plans to appeal the recent ruling. Intel recorded a net income of 5.9 billion USD in Q4 2020 so this fine is by no means insignificant.

News just keep flowing that are bound to have impact on pricing for components users of this website know and love. The Austin-American Statesman reports that Samsung has been ordered to shutter its Texas factories in wake of recent power shortages that have impacted the state. The order, which came from Austin Energy, doesn't just affect Samsung: all industrial and semiconductor manufacturers in the state were ordered to idle or shut down their facilities, meaning that NXP Semiconductors and Infineon Semiconductors have also been affected. According to Austin Energy, all companies have complied with the order. A date for the lifting of these restrictions still hasn't been given.

As we know, semiconductor manufacturing is a drawn-out process, with some particular wafers taking several months in their journey from initial fabrication until they reach completion. This meas that it's a particularly sensitive business in regards to power outages or general service interruptions. The entire semiconductor manufacturing lines - and products therein, in various stages of production - can be rendered unusable due to these events, which will have a sizable impact in the final manufacturing output of a given factory. It remains to be seen the scale of this production impact, but a few percentage points difference in the overall global semiconductor manufacturing could have dire implications for availability and pricing, considering the already insufficient operational capacity in regards to demand. Considering the impact adverse temperatures are having on Texas residents, here's hoping for the quick resolution of these problems, which affect much more than just semiconductor manufacturing capabilities.

NXP Semiconductors N.V. today announced the grand opening of its 150 mm (6-inch) RF Gallium Nitride (GaN) fab in Chandler, Arizona, the most advanced fab dedicated to 5G RF power amplifiers in the United States. The new internal factory combines NXP's expertise as the industry leader in RF power and its high-volume manufacturing know-how, resulting in streamlined innovation that supports the expansion of 5G base stations and advanced communication infrastructure in the industrial, aerospace and defense markets.