Chinese tech news sites have alluded to the launch of Colorful's brand-new SMART 900 Mini PC in the region. Oddly, the company's various web presences and social media accounts do not mention this diminutive 4-liter (volume) product. At last month's Computex trade show, the TechPowerUp crew happened upon a preview unit—dubbed generically as a "Mini AI PC." The latest press material confirms Colorful's selection of AMD's top-flight 16-core Ryzen AI Max+ 395 APU. The Team Red "Strix Halo" mobile series leverages "Zen 5" processor cores and RDNA 3.5 integrated graphics solutions. Colorful has joined a small club of Mini PC providers that deal in Ryzen AI Max-equipped hardware. GMKtec seems to be leading this pack; with last month's global release of configurable EVO-X2 Mini PC pre-builds (starting at $1499).

Zotac is readying a competing Magnus EA (2025) range; the TPU team encountered a 12-core Ryzen AI Max 390-equipped example at Computex 2025. In North America, Framework is still working on getting its "4.5L Mini-ITX" Desktop out of the door—hopefully by the third quarter of this year. Colorful's SMART 900 Mini PC design sports a high quality anodized aluminium chassis. An "excellent" heat dissipation solution is advertised as taking: "advantage of the metal body—ensuring that the system can maintain a low operating temperature and a relatively reasonable noise level under high load." Rival manufacturers have outlined memory configurations of 64 GB or 128 GB LPDDR5X, but Colorful has opted for an unusual in-between 96 GB setup. At the time of writing, no SMART 900 Mini PC pricing information was included in local media reports.

It looks as though AMD might be planning to finally commercialize the more affordable version of its Ryzen AI Max APUs that have proven to be capable of powering impressively high-end gaming experiences. The first set of benchmarks of the new Strix Halo APU, dubbed the AMD Ryzen AI Max 385, have appeared on Geekbench, and the new APU is putting up some impressive numbers. AMD originally said that the Strix Halo line-up would be available between Q1 and Q2 2025, so the timing makes sense.

One major difference between the Ryzen AI Max 395 and the 385 is the iGPU, which is downgraded from the Radeon 8060S to the 8050S. When AMD launched the Strix Halo line-up, it revealed that AI Max Pro 385 would have an eight-core CPU paired with 32 graphics cores, instead of the 16-core CPU and 40-core iGPU setup. While we don't yet have GPU benchmark results for the 8050S, the CPU results put up by the APU are impressive on their own, with 2,489 points in the single-core benchmark and 14,136 points in the multicore benchmark. The laptop the new Ryzen silicon was tested in was an HP ZBook Ultra G1a with 32 GB of RAM. The results put the 385 only slightly behind the AI Max+ 395 in certain configurations, but in a similar HP ZBook Ultra G1a laptop, the Ryzen AI Max+ 395 comes out ahead of the 385 by as much as 45%. It's unclear just how much laptops with this new Ryzen AI Max Pro 385 APU will cost, but they will almost certainly be cheaper than the current crop of Ryzen AI Max+ laptops, which generally run well north of $2,000.

At Computex 2025 in Taipei, Framework Computer highlighted the growing importance of compact, serviceable hardware by unveiling an AI cluster built entirely from its new Framework Desktop mini PCs. Each 4.5-liter unit is equipped with an AMD Ryzen AI Max+ 395 processor, which combines 16 Zen 5 cores running up to 5.1 GHz and a Radeon 8060S graphics engine with up to 128 GB of unified LPDDR5x memory. In a striking demonstration, four of these desktops were mounted side by side in a 10-inch half-rack enclosure, creating a scalable cluster that delivers up to 200 TOPS of on-device AI performance from the XDNA 2 NPUs alone, before the 8060S comes into play. The rack features integrated Wi-Fi 7 and 5 GbE networking, while its modular expansion card slots allow users to tailor ports to their exact needs. By packaging powerful inference capability into a compact, repairable chassis with efficient cooling and low power draw, Framework is making it simpler for research labs, small businesses, and edge-computing enthusiasts to deploy AI solutions outside traditional data centers.

ZOTAC made a notable impression at Computex 2025 by unveiling a range of compact gaming and AI-ready machines combining high performance and tiny footprints. The highlight was the second-generation ZOTAC Zone handheld prototype, now powered by AMD's top-tier Ryzen AI 9 HX 370 APU. Equipped with Radeon 890M graphics, the Zone achieves smooth 1080p gameplay on its 7-inch AMOLED display, which offers a 120 Hz refresh rate and up to 800 nits of brightness. Despite its size, the device packs either 24 GB or 32 GB of LPDDR5X memory alongside a 1 TB PCIe Gen 4 SSD to ensure rapid load times and efficient multitasking.

For wireless connectivity, ZOTAC has included Wi-Fi 6E, Bluetooth 5.2, dual USB4 ports, and a microSD slot. A built-in kickstand adds flexibility to handheld play, and Hall-effect joysticks, precise triggers, and twin trackpads provide a control scheme designed for accuracy. A 48.5 Wh battery that should support extended gaming sessions is powering all this. ZOTAC also previewed its Manjaro Linux distribution on the Zone, featuring a dedicated handheld interface and Wine-based compatibility for Windows titles.

Officially, AMD Ryzen AI Max "Strix Halo" mobile processors are only available in complete systems—e.g. laptops, notebooks, and mini desktop PCs. Upon learning about this release status, DIY enthusiasts were left disappointed. After all, these impressively potent all-in-one solutions have picked up considerable praise pre- and post-launch. Team Red's "Strix Halo" flagship—the Ryzen AI Max+ 395—is the subject of much online debate, but cost of entry is steep. Under normal circumstances (i.e. no leveraging of promotional discounts), potential buyers are looking at $2000+ pre-built systems.

Separate BGA packages have turned up for sale in China—specifically on Goofish; Alibaba's second-hand trading platform. A past weekend VideoCardz investigative piece covered these curiosities. At this stage in time, viable custom motherboard designs are not yet widely distributed—effectively making individual "Strix Halo" units expensive paperweights. At the time of writing, seller "The Eraser in My Mind" offers the best Ryzen AI Max+ 395 deal: 3998 RMB (~$555 USD). This Suzhou-based trader also lists Ryzen AI Max PRO 390, and 380 SKUs. Product descriptions indicate that some of these processors are already powering mysterious handheld gaming devices (likely regional exclusives). Four Goofish accounts are displaying the same set of images; distinctive Team Red branding and "Made in Taiwan" tags are clearly visible across specimens—mostly mounted on plastic transport trays.

Zotac is ready with the Magnus EA (2025) mini PC powered by AMD Ryzen AI Max "Strix Halo" line of processors. It was inevitable for "Strix Halo" to make its way into gaming-capable mini PCs, given its small PCB and cooling footprint for the kind of hardware chops on offer—up to 16 "Zen 5" CPU cores, and a powerful iGPU with up to 40 RDNA 3.5 compute units that makes it capable of 1440p AAA gaming; besides full Microsoft Copilot+ capability with a 50 TOPS-class NPU. The Magnus EA comes in a similar 140 mm-class 1U chassis as the 2025 Magnus One that's expected to be built on Core Ultra 200V "Lunar Lake" processors, which is noticeably thinner than the 2025 Magnus EN, which combines a Core Ultra 200H "Arrow Lake-H" processor with GeForce RTX 50-series "Blackwell" mobile discrete GPUs. Zotac is expected to unveil the Magnus EA, the 2025 Magnus EN, and the 2025 Magnus One at Computex, later this month.

Around the middle of March, GMKtec's EVO-X2 Mini PC design attracted international media attention—thanks to Dr. Lisa Su's autograph adorning a special presentation sample. During festivities, this relatively young Chinese brand—founded back in 2019—introduced the "world's first" AI mini PC equipped with AMD's Ryzen AI Max+ 395 APU. This flagship "Strix Halo" chip leverages Zen 5 and RDNA 3.5 technologies; the latter aspect forms the basis of an impressively potent Radeon 8060S iGPU. This integrated graphics solution has surpassed or matched some worthy (previous-gen) discrete competitors, and apparently performs admirably in LLM inference workload scenarios. At the tail end of March, GMKtec opened up pre-orders for its $2000+ headline product—starting off in China. Back then, potential international buyers were intrigued—many envisioned a pleasing wider distribution of EVO-X2 Mini PC retail stock. Given that GMKtec had semi-recently expanded its sales operation into Europe, hopes were elevated.

As reported by TechRadar last week, Eurozone tech enthusiast prayers were answered—their coverage outlined an intriguing pre-order campaign: "buyers can unlock a reduced pre-sale price of €1,499 for the base model by paying a $100 deposit. Those who want the higher configuration need to place a €200 deposit to qualify for a discounted €1,799 final price. All orders must be completed by May 7 to receive the full discount." Days later, VideoCardz and Notebookcheck noted a similar promotion—rolled out for North American audiences. Officially, the EVO-X2 Mini PC is (tentatively) set to launch on May 20—well ahead of Framework's projected "early Q3 2025" debut shipment of "tiny 4.5L Mini-ITX" Desktop units. Time limited promo prices are in effect until next week—the 64 GB and 128 GB RAM EVO-X2 package are currently discounted: $1399 and $1799 (respectively). As expected, GMKtec's official US webshop also requires pre-order deposits—refer to these details below.

Yesterday, AMD released Radeon Software Adrenalin Edition 25.4.1 Optional Beta drivers that add FidelityFX Super Resolution 4 to The Elder Scrolls IV: Oblivion Remastered, Assassin's Creed Shadows, Kingdom Come Deliverance 2, Dynasty Warriors Origin, Civilization 7, and Naraka Bladepoint. It also brings Amuse 3 support and AMD-optimized models to Radeon RX 9000 and RX 7000 series graphics cards alongside Ryzen AI 300 series processors. Among the many fixes you'll find corrected lighting artifacts in Topaz Photo AI's Adjust Lighting features on RX 9000 series cards, removed flicker when using AMD FreeSync, improved DirectML and GenAI performance in Amuse 3.0 on RX 7000 GPUs and Ryzen AI 300 series chips, and patched image corruption in certain diffuser models on RX 9000 hardware.

The update also smooths out stutter and performance drops in World of Warcraft's Western Plaguelands, restores integrated camera detection after factory resets on Ryzen AI Max devices, and addresses AMD Chat installation hangs. Since this is still an optional beta with some known issues, like FSR 4 not activating in Naraka Bladepoint on Windows 10, crashes in The Last of Us Part 2, memory leaks in SteamVR on RX 9000 cards, or intermittent launch and stability hiccups in games like Cyberpunk 2077, Fantasy VII Rebirth, Battlefield 1, Monster Hunter Wilds and Marvel's Spider-Man 2, AMD recommends using the suggested workarounds such as disabling motion smoothing or integrated graphics in your BIOS and holding out for your system vendor's certified driver to ensure full compatibility.

DOWNLOAD: AMD Software Adrenalin 25.4.1 Beta

GMKtec has launched the EVO-X2 mini PC, personally autographed by AMD CEO Dr. Lisa Su. As the world's first AI mini PC equipped with the AMD Ryzen AI Max+ 395 processor, it delivers exceptional performance. This processor features 16 cores and 32 threads, with a maximum frequency of 5.1 GHz and 80 MB cache, ensuring rapid data processing. The integrated Radeon 8060S iGPU excels in graphics handling, while the XDNA2 architecture NPU offers 50 TOPS of AI computing power, significantly outperforming competitors. In AI inference tasks involving 70-billion-parameter local models, it even surpasses the NV 5090D.

GMKtec EVO-X2: A New Era in AI Mini PCs
GMKtec has officially unveiled the EVO-X2, a groundbreaking mini PC that marks a significant milestone in AI computing. This compact device is the world's first to feature the AMD Ryzen AI Max+ 395 processor, a testament to GMKtec's commitment to innovation and performance.

We dedicated a lot of our launch presentation of Framework Desktop to the Ryzen AI Max processor it uses, and for a good reason. These truly unique, ultra-high-performance parts are the culmination of decades of technology and architecture investments that AMD has made, going all the way back to their acquisition of ATI in 2006. For our first technical deep dive on Framework Desktop, we're going to go even deeper into Ryzen AI Max and what makes it a killer processor for gaming, workstation, and AI workloads.

What makes Ryzen AI Max special is a combination of three elements: full desktop-class Zen 5 CPU cores, a massive 40-CU Radeon RDNA 3.5 GPU, and a giant 256-bit LPDDR5x memory bus to feed the two, supporting up to 128 GB of memory. Chips and Cheese did an excellent technical overview of the processor with AMD that goes even deeper on this, and we'll pull out some of the highlights along with our own insights. We'll start with the CPUs. Ryzen AI Max supports up to 16 CPU cores split across two 4 nm FinFET dies that AMD calls CCDs. These dies are connected together using an extremely wide, low power, low latency bus across the package substrate. The CPUs are full Zen 5 cores with 512-bit FPUs and support for AVX-512, a vector processing instruction set otherwise only available on Intel's top end server CPUs. We're excited for you to see the multicore performance numbers these CPUs can do in our upcoming press review cycle!

Shahram Mokhtari and Elizabeth Chamberlain—members of the iFixit Teardown Team—spent hands-on time with Framework's freshly introduced 4.5 liter Mini-ITX "Desktop" PC system. Official press material revealed cooling solution partnerships with Cooler Master and Noctua, but only a minority of "2nd Gen event" attendees were allowed to handle these pre-release modular parts. iFixit employees did not perform a full evaluation of Framework's new desktop model, since they were dealing with a prototype unit. A "repairability score" will be awarded once finalized hardware is delivered to iFixit's base of operations. In the meantime, their video team was hosted at Framework's Northern California office.

According to a follow-up report, Mokhtari and Chamberlain enjoyed their visit: "it's teardown time. Framework has been a beacon of repairability in the laptop space, and now they're bringing that ethos to desktops...Taking this thing apart was exactly as easy as we've come to expect from Framework. They brought us to their HQ to rip into it, and from the very first step, it was clear: this desktop was designed to be opened." Potential buyers—of Framework Desktop—are faced with many configurations, but a crucial choice will focus on available APU options. The highest-end builds will feature AMD's 16-core Ryzen AI Max+ 395 "Strix Halo" processor—iFixit's teardown did not reveal any major revelations in terms of the APU's physical appearance. Even Framework's own press release contains an exposed shot—hardcore processor design enthusiasts are better catered to with a more in-depth analysis of "Strix Halo."

GSMA MWC Barcelona, runs from March 3 to 6, 2025 at the Fira Barcelona Gran Via in Barcelona, Spain. AMD is proud to participate in forward-thinking discussions and demos around AI, edge and cloud computing, the long-term revolutionary potential of moonshot technologies like quantum processing, and more. Check out the AMD hospitality suite in Hall 2 (Stand 2M61) and explore our demos and system design wins. Attendees are welcome to stop by informally or schedule a time slot with us.

As modern networks evolve, high-performance computing, energy efficiency, and AI acceleration are becoming just as critical as connectivity itself. AMD is at the forefront of this transformation, delivering solutions that power next-generation cloud, AI, and networking infrastructure. Our demos this year showcase AMD EPYC, AMD Instinct, and AMD Ryzen AI processors, as well as AMD Versal adaptive SoC and Zynq UltraScale+ RFSoC devices.

Today, we introduced the Framework Desktop, a tiny 4.5L Mini-ITX desktop powered by AMD's massive new Ryzen AI Max processors. Pre-orders are open now, with first shipments in early Q3 2025. When AMD shared the Ryzen AI Max with us, we immediately knew we had to use it. It has up to 16 CPU cores at 5.1 GHz boost clock, discrete-level Radeon 8060S graphics, and support for up to an insane 128 GB of unified LPDDR5x. That enables 1440p or higher gaming on the heaviest titles, big creative and workstation workloads, and true local AI use cases. This is an absolute monster of a processor, and we shifted our roadmap a year ago to make space for it. In a desktop form factor, we get to unlock every bit of its performance with 120 W sustained power and 140 W boost while staying quiet and cool.

You may still be wondering, why does Framework need to build a desktop? Aren't desktops already modular and upgradeable? They are. In fact, the desktop PC ethos is part of what inspired the Framework Laptop to begin with. The desktop world is amazing. There is a broad, long-lived, interoperable ecosystem with hundreds of brands and hundreds of millions of consumers participating. You can build, upgrade, repair, and personalize to the limits of your imagination (and budget, and desk space), and share your amazing creations with all of the other true believers. We want to make this space as accessible as we possibly can by building a desktop that is simultaneously small and simple and incredibly powerful and customizable. Everyone should have the opportunity to experience the culture around PCs and PC gaming first-hand.

It's that time again! 3DExperience World 2025 kicks off on February 23 and runs through February 26 at the George R. Brown Convention Center in Houston, Texas. The show is hosted by Dassault Systèmes and highlights annual advances and improvements throughout its product ecosystem. It's a great opportunity to meet the engineers, students, and industry professionals who use SolidWorks and other Dassault Systèmes applications across browsers, local workstations, and the cloud.

One of the best parts of the event for me is showcasing how advances in silicon engineering can lead to transformational products - systems that offer performance, features, and efficiency that wasn't possible before. In 2024, the AMD Ryzen Threadripper PRO 7000 WX-Series processor stole the proverbial show with its excellent single-thread performance, support for multi-GPU configurations for AI training, and up to 96 cores and 2T B of memory for the largest and most demanding projects. This year, AMD has complemented these full-size tower systems with compact and mobile workstations based on the new AMD Ryzen AI Max PRO Series processors. Drop by booth #919 and see the array of systems and demos on exhibit.

AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package. The processor's architecture centers on two 67.07 mm² CPU CCDs, each housing eight Zen 5 cores with a dedicated 8 MB L2 cache. A substantial 307.58 mm² I/O complements these die that houses an RDNA 3.5-based integrated GPU featuring 40 CUs and AMD's XDNA 2 NPU. The memory subsystem demonstrates a 256-bit LPDDR5X interface capable of delivering 256 GB/s bandwidth, supported by 32 MB of strategically placed Last Level Cache to optimize data throughput.

The die shots reveal notable optimizations for mobile deployment, including shortened die-to-die interfaces that reduce the interconnect distance by 2 mm compared to desktop implementations. Some through-silicon via structures are present, which suggest potential compatibility with AMD's 3D V-Cache technology, though the company has not officially confirmed plans for such implementations. The I/O die integrates comprehensive connectivity options, including PCIe 4.0 x16 lanes and USB4 support, while also housing dedicated media engines with full AV1 codec support. Initial deployments of the Strix Halo APU will commence with the ASUS ROG Flow Z13 launch on February 25, marking the beginning of what AMD anticipates will be broad adoption across premium mobile computing platforms.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

ASUS's Republic of Gamers China account on Weibo has teased the ROG Magic X mobile device that combines laptop/tablet form with a detachable keyboard. Inside, the device is powered by AMD Ryzen AI MAX+ SoC, which ASUS called a "three-in-one" chip, mainly due to its CPU, NPU, and iGPU combination. One possible SKU for ROG Magic X is AMD's top-end Ryzen AI MAX+ 395 processor. Carrying 16 "Zen 5" cores and 32 threads, the chip is designed for AI-enhanced laptops with 126 combined TOPS of AI processing power. The Ryzen AI MAX+ 395 features 64 MB of L3 cache and operates at a base clock of 3 GHz, with boost capabilities up to 5.1 GHz, depending on workload conditions. Manufactured on TSMC's 4 nm process node, the processor maintains a modest 55 W TDP, suitable for high-performance mobile systems. The chip includes support for ECC memory and PCIe Gen 5. It integrates the Radeon 8060S solution based on RDNA 3.5 architecture for graphics.

We are yet to see more details about the ROG Magic X, but with the arrival of AMD Ryzen AI MAX+, we assume this machine will result in a powerful gaming device for users on the go. More details are expected on February 25, when ASUS plans to showcase it. Pricing and availability are also expected to follow soon after.

AI PC capabilities have evolved rapidly in the two years since AMD introduced the first x86 AI PC CPUs at CES 2023. New neural processing units have debuted, pushing available performance from a peak of 10 AI TOPS at the launch of the AMD Ryzen 7 7840U processor to peak 50+ TOPS on the latest AMD Ryzen AI Max PRO 300 Series processors. A wide range of software and hardware companies have announced various AI development plans or brought AI-infused products to market, while major operating system vendors like Microsoft are actively working to integrate AI into the operating system via its Copilot+ PC capabilities. AMD is on the forefront of those efforts and is working closely with Microsoft to deliver Copilot+ for Ryzen AI and Ryzen AI PRO PCs.

In the report "The Year of the AI PC is 2025," Forrester lays out its argument for why this year is likely to bring significant changes for AI PCs. Forrester defines the term "AI PC" to mean any system "embedded with an AI chip and algorithms specifically designed to improve the experience of AI workloads across the computer processing unit (CPU), graphics processing unit (GPU), and neural processing unit (NPU)." This includes AMD products, as well as competing products made by both x86 and non-x86 CPU manufacturers. 2025 represents a turning point for these efforts, both in terms of hardware and software, and this Forrester report is an excellent deep dive into why AI PCs represent the future for enterprise computing.

AMD today put out detailed guides on how to get DeepSeek R1 distilled reasoning models to run on Radeon RX graphics cards and Ryzen AI processors. The guide confirms that the new Ryzen AI Max "Strix Halo" processors come in hardwired to LPCAMM2 memory configurations of 32 GB, 64 GB, and 128 GB, and there won't be a 16 GB memory option for notebook manufacturers to cheap out with. The guide goes on to explain that "Strix Halo" will be able to locally accelerate DeepSeek-R1-Distill-Llama with 70 billion parameters on the 64 GB and 128 GB memory configurations of "Strix Halo" powered notebooks, while the 32 GB model should be able to run DeepSeek-R1-Distill-Qwen-32B. Ryzen AI "Strix Point" mobile processors should be capable of running DeepSeek-R1-Distill-Qwen-14B and DeepSeek-R1-Distill-Llama-14B on their RDNA 3.5 iGPUs and NPUs. Meanwhile, older generation processors based on "Phoenix Point" and "Hawk Point" chips should be capable of DeepSeek-R1-Distill-Llama-14B. The company recommends running all of the above distills in Q4 K M quantization.

Switching gears to the discrete graphics cards, and AMD is only recommending its Radeon RX 7000 series for now, since the RDNA 3 graphics architecture introduces AI accelerators. The flagship Radeon RX 7900 XTX is recommended for DeepSeek-R1-Distill-Qwen-32B distill, while all SKUs with 12 GB to 20 GB of memory—that's RX 7600 XT, RX 7700 XT, RX 7800 XT, RX 7900 GRE, and RX 7900 XT, are recommended till DeepSeek-R1-Distill-Qwen-14B. The mainstream RX 7600 with its 8 GB memory is only recommended till DeepSeek-R1-Distill-Llama-8B. You will need LM Studio 0.3.8 or later and Radeon Software Adrenalin 25.1.1 beta or later drivers. AMD put out first party LMStudio 0.3.8 tokens/second performance numbers for the RX 7900 XTX, comparing it with the NVIDIA GeForce RTX 4080 SUPER and the RTX 4090.

AMD has just published its "How to Sell" Ryzen AI MAX series guide—several news outlets have pored over the "claimed" gaming performance charts contained within this two-page document. Team Red appears to be in a boastful mood—their 1080p benchmark results reveal compelling numbers, as produced by their flagship Zen 5 "Strix Halo" processor (baseline 55 W TDP). According to Team Red's marketing guidelines, the Ryzen AI Max+ 395 APU: "competes with a GeForce RTX 4070 Mobile GPU at similar TDP and form factor." The first-party produced comparison points to their Radeon 8060S integrated graphics solution being up to 68% faster—in modern gaming environments at 1080p settings—than the competing Team Green dedicated laptop-oriented GPU, limited to 65 W TGP due to form factor restrictions. Overall, the AMD test unit does better by 23.2% on average (referring to Wccftech's calculations).

According to the document, AMD's reference system was lined up against an ASUS ROG Flow Z13 (2023) gaming laptop specced with an Intel Core i9-13900H processor, and a GeForce RTX 4070 mobile graphics card. The Ryzen AI Max+ 395's "massive iGPU" can unleash the full force of forty RDNA 3.5 compute units, paired with up to 96 GB of unified on-board memory (from a total pool of 128 GB). Non-gaming benchmarks place the flagship Team Red processor above Intel Core Ultra 9 288V and Apple M4 Pro (12-core) CPUs—as always, it is best to wait for verification from independent evaluators. Saying that, the "Strix Halo" APU family has generated a lot of excitement—even going back to early leaks—and the latest marketed performance could drum up further interest.

Thanks to the informative breakdown by Chips and Cheese, we are learning that AMD's latest Ryzen AI processors for laptops, codenamed "Strix Halo," utilize a parallel "sea of wires" interconnect system between their chiplets, replacing the SERDES (serializer/deserializer) approach found in desktop Ryzen models. The processor's physical implementation consists of two Core Complex Dies (CCDs), each manufactured on TSMC's N4 (4 nm) process and containing up to eight Zen 5 cores with full 512-bit floating point units. Notably, the I/O die (IOD) is also produced using the N4 process, marking an advancement from the N6 (6 nm) process used in standard Ryzen IODs on desktops. The key change lies in the inter-chiplet communication system. While the Ryzen 9000 series (Granite Ridge) employs SERDES to convert parallel data to serial for transmission between chiplets, Strix Halo implements direct parallel data transmission through multiple physical connections.

This design achieves 32 bytes per clock cycle throughput and eliminates the latency overhead associated with serialization/deserialization processes. The parallel interconnect architecture also removes the need for connection retraining during power state transitions, a limitation present in SERDES implementations. However, this design choice necessitates additional substrate complexity due to increased connection density and requires more pins for external connections, suggesting possible modifications to the CCD design compared to desktop variants. AMD's implementation required more complex substrate manufacturing processes to accommodate the dense parallel connections between chiplets. The decision to prioritize this more challenging design approach was driven by requirements for lower latency and power consumption in data-intensive workloads, where consistent high-bandwidth communication between chiplets is crucial.

At CES, AMD unleashed the much awaited Ryzen AI Max "Strix Halo" APUs with mammoth iGPUs, up to a whopping 40 CUs for the Radeon 8060S. These chips are powerful enough to not require discrete graphics at all, making them ideal for mini PCs, which lack the physical room for dedicated graphics. GMK appears to be among the first to announce a mini PC with the top-end Ryzen AI Max+ 395 APU, although any further details are under wraps as of now.

Unlike the Strix Point parts, Strix Halo abandons the smaller and more efficient Zen 5c cores for a Zen 5-only setup, with up to 16 Zen 5 cores for the highest-end Ryzen AI Max+ 395 SKU. This allows for some serious performance potential, with AMD promising substantially better performance than both Intel's Lunar Lake and Apple's M4 Pro, although it would be much fairer to compare Strix Halo to Apple's M4 Max, and Intel's Arrow Lake-H/X instead. Regardless, there is no denying Strix Halo APUs open up new doors in terms of performance for compact systems, the rest remains to be seen as and when the products reach reviewers.

ASUS Republic of Gamers (ROG) today announced the arrival of the 2025 ROG Flow Z13, a powerful gaming tablet. This versatile 2-in-1 gaming machine now features the brand new ultra-powerful AMD Ryzen AI Max+ 395 with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

AMD today vastly fleshed out its mobile processor lineup with the introduction of two new processor lines besides the Ryzen AI Max 300 series. This includes the introduction of more processor models in the Ryzen AI 300 series that are powered by the "Strix Point" silicon, and the introduction of the Ryzen 200 series mobile processors, which are based on the older "Hawk Point" silicon. In 2024, AMD had debuted the Ryzen AI 300 series "Strix Point," but with just the top-end Ryzen AI 9 370 and 365, which came with maxed out 12-core/24-thread (4x Zen 5 + 8x Zen 5c) core configuration, and a maxed out iGPU with 16 CU. Today the company is introducing the Ryzen AI 7 350, the Ryzen AI 5 340, and their AMD PRO variants for commercial notebooks. Both the consumer and commercial parts have identical specs, except for the latter featuring the AMD PRO feature-set.

The Ryzen AI 7 350 comes with a CPU configuration of 8-core/16-thread (4x Zen 5 + 4x Zen 5c). All cores have a base frequency of 2.00 GHz, the Zen 5 cores boost up to 5.00 GHz. The iGPU on offer is the Radeon 860M, with 12 CU and an engine clock of up to 3.00 GHz. TDP is configurable between 15 W to 55 W. The Ryzen AI 5 340 comes with a 6-core/12-thread configuration (3x Zen 5 + 3x Zen 5c), and CPU clock speeds of 2.00 GHz base with 4.80 GHz boost achievable on the Zen 5 cores. The iGPU is heavily cut down, with just 4 CU available, and an iGPU engine clock of 2.90 GHz. Notebook designers can configure this chip with a wide power range from 15 W to 55 W. All four processor models mentioned above come with a Ryzen AI XDNA 2 NPU that's capable of 50 AI TOPS, which means they're all Microsoft Copilot+ AI PC logo eligible.