According to the Financial Times, new restrictions—affecting the supply of Electronic Design Automation (EDA) software suites to Chinese companies—will cause major disruption within the domestic chip design industry. The US government's latest trade amendments are expected to impact Xiaomi and its freshly launched flagship XRING mobile chip family; the first iteration is a compelling first-party effort. Unlike many Chinese tech firms, the popular smartphone specialist can access pretty advanced TSMC node processes. Xiaomi's CEO—Lei Jun—announced his team's 3 nm design during pre-launch preview events.

Days later, closer analysis indicated a selection of TSMC's "N3E" node process. Digital Chat Station—a noted smartphone industry expert—summarized an uncertain future: "under this ban (of EDA tools), XRING chips will not be breaking through a 2 nm barrier, and can only revolve around the (current 'N3E') 3 nm node for a long time. XRING O1 will also be the only time in recent years that it can be on par with current-gen (proprietary) Apple, Qualcomm, and MediaTek mobile chipsets." Crucially, EDA software plays an important role in creating Gate All Around Field Effect Transistor (GAAFET) structures. TSMC's upcoming 2 nm node process is a GAA product. Tom's Hardware believes that several big Chinese tech players, including Huawei, are in the process of developing in-house EDA tools. Not long after unveiling their XRING flagship, Xiaomi outlined an extended Qualcomm chip deal.

Three weeks ago, Kurnal and Geekerwan dived deep into Nintendo's alleged Switch 2 chipset. The very brave Chinese leakers are notorious for their acquiring of pre-release and early silicon samples. Last week, their collective attention turned to a brand-new Xiaomi mobile chip: the XRING 01. After months of insider murmurs and official teasers, the smartphone giant recently unveiled its proprietary flagship SoC. According to industry moles, Xiaomi has invested a lot of manpower into a special chip design entity—leadership likely wants to avoid a repeat of prior first-party developed disappointments. Despite rumors of disappointing prototype performance figures, mid-May Geekbench results pointed to the emergent XRING 01 mobile chip being up there with Qualcomm's dominant Snapdragon 8 Elite platform. Die shot analysis has confirmed Xiaomi's selection of a TSMC 3 nm "N3E" node process; also utilized by the latest Apple, Qualcomm and MediaTek flagships. Overall die size is 114.48 mm² (10.8 x 10.6 mm), with 109.5 mm² of used area; comparable to Apple's A18 Pro SoC footprint (refer to Geekerwan's comparison shot, below).

Unlike nearby rivals, the XRING 01 seems to not sport an integrated 5G modem. Notebookcheck surmised: "it is rumored to use an external radio from MediaTek. It isn't located on the actual die itself, and likely a contributing factor to why its size is so small." Annotations indicate the presence of off-the-shelf/licensed Arm CPU cores (ten in total): two Cortex-X925 units, four Cortex-A725 units, two Cortex-A725 units, and two Cortex-A520 units. Additionally, an Arm Immortalis-G925 MP16 iGPU was identified. A 6-core NPU—with 16 MB of cache—was highlighted, but it is not clear whether this is a proprietary effort or something bought in. Observers have noted the absence of SLC cache. GSMArena posited: "the Geekerwan team speculates that (Xiaomi's) omission of the SLC has hurt GPU efficiency—it's pretty fast, but it uses more power than the Dimensity GPU at peak performance. The more efficient CPU combined with the fact that the GPU rarely runs at full tilt makes for pretty good overall efficiency in real-life gaming tests." The XRING department's debut product is impressive, but industry watchdogs are looking forward to refined variants or full-fledged successors.

Last Thursday, Xiaomi revealed its proprietary XRING O1 3 nm mobile chipset. After months of rumors, the Chinese firm's highly anticipated first-party chip design was introduced during their special "A New Beginning" event—held in Beijing. During this multipronged product launch celebration, company leadership disclosed the underpinnings of their first-ever flagship processor. According to official descriptions, Xiaomi's pivotal XRING O1 SoC is built on: "a cutting-edge second-gen 3 nm process with 19 billion transistors, features a 10-core CPU and 16-core Immortalis-G925 GPU, delivering flagship performance with industry-leading power efficiency. It also integrates Xiaomi's fourth-gen ISP and a 6-core NPU offering 44 TOPS for advanced AI processing." Days prior to important ceremonies in China, a joint statement—issued by Qualcomm—detailed an extended Snapdragon chipset supply agreement. The XRING O1 processor line will drive forthcoming Xiaomi 15S Pro smartphones and Pad 7 Ultra tablets; reserved for initial "domestic market" launches. Qualcomm's current flagship offerings are technically superior to Xiaomi's fresh effort, but an ever-shifting political landscape could affect future shipments.

Lu Weibing—a company president and partner—has outlined a vision for XRING's eventual expansion beyond a flagship/high-end product tier. Last week's intro firmly positioned the 3 nm part as premium option that will power suitably expensive Android-based mobile devices. Weibing acknowledged that his team has jumped into the deep end: "(for) this platform capability, it is most difficult to work on smartphone flagship SoC, it has high power consumption demand and its technology is extremely complicated. If you can, then you should have the ability to work on flagship smartphone SoC. (Once you) move to work on other chips, it won't be that difficult." Industry moles posit that Xiaomi's XRING division is already a formidable force, in terms of staff headcounts and experience. The department could be absorbing some inspiration from Apple; namely their custom C1 modem chip. The firm's president painted a picture of things to come: "so we want to focus on the flagship SoC, and then we want to make a capable modem for the future. We have to work on 4G and 5G parts—together with 3G—leading to a complete matrix. So that is what we need to do at this stage." Early leaks have indicated the existence of a binned version of the XRING O1 SoC; present within early Xiaomi Pad 7 Ultra tablet samples. In theory, these compromised chips could be deployed in unannounced cheaper products.

At Xbox, we want to help you spend more time playing the games you love, to be there when you need some help—and out of the way when you don't. Copilot for Gaming (Beta) is designed to do just that, and starting today, you can begin testing this new feature as it starts rolling out to the beta version of the Xbox app for mobile devices.

Copilot for Gaming is the ultimate gaming sidekick, making gaming with Xbox more seamless and personalized. In this early version of the feature for mobile, you'll be able to access Copilot for Gaming on a second screen, without distracting you from your core gameplay experience. The companion knows what game you're playing and understands your Xbox activity, so it can answer any questions about the games you're interested in, provide links to more information when its response includes web sources, or answer questions based on your account, play history and achievements.

Qualcomm Technologies, Inc. and Xiaomi Corporation are celebrating 15 years of collaboration and have executed a multi-year agreement. The relationship between Qualcomm Technologies and Xiaomi has been pivotal in driving innovation across the technology industry and the companies are committed to delivering industry-leading products and solutions across various device categories globally.

"Qualcomm Technologies has always been one of Xiaomi's most trusted and vital partners, supporting our journey from a startup to a global technology leader. We look forward to continuing the next 15 years of our collaboration and leveraging Qualcomm's cutting-edge Snapdragon platforms and technologies to deliver even more innovative and high-quality products to our customers worldwide," said Lei Jun, CEO of Xiaomi.

As previously promised, Dr. Rick Tsai took to the Computex 2025 stage earlier today. The MediaTek CEO's keynote speech included a teaser for next-gen. Currently, the fabless chip design firm's best offerings are manufactured at TSMC foundries—utilizing 3 nm node processes. According to inside track knowledge, the forthcoming Dimensity 9500 mobile chipset will be based on "N3P." During today's important presentation, Tsai announced his company's next major leap—with "2 nm silicon innovation." According to a presentation slide, a tape-out phase is anticipated by this September. Industry experts reckon that a futuristic flagship—perhaps "Dimensity 9600"—SoC will benefit from this generational jump. Finalized products could arrive around late 2026; with MediaTek reportedly being on TSMC's 2 nm (N2) mass production order books. Officially, MediaTek's shift from 3 nm into 2 nm is expected to improve chip performance—with an estimated 15% uplift—while reducing power consumption (by ~25%).

Yesterday, Lei Jun—the CEO of Xiaomi—finally introduced his firm's proprietary XRING 01 mobile chipset, via a couple of Weibo posts. In an initial afternoon short blog entry, the executive informed his followers with a happy unveiling: "I would like to share with you a piece of news: Xiaomi's self-developed and designed mobile phone SoC chip, named XRING 01, will be released in late May. Thank you for your support!" About a month ago, the company's oft-rumored return to in-house chip efforts was linked to a major corporate offshoot. The speculated "chip platform department" was likely established a while ago, given early May reports of the division's staff headcount exceeding 1000+. At the time, an "Xring" codename was mentioned by industry tipsters (in China).

In a follow-up "Weibo Text" bulletin, Xiaomi's head honcho recalled older project timelines and technological attempts: "even drinking ice for ten years can't cool your blood! Xiaomi's journey to making chips began in September 2014. Time flies, and more than ten years have passed in the blink of an eye...Figures 2 and 3 are photos of Xiaomi's first chip launch conference in February 2017." Jun's did not provide any hints about the XRING 01 chip's underpinnings. Late 2024 leaks alluded to a reportedly troubled prototype—insiders connected this design to fairly new Arm Cortex architecture, and a TSMC 4 nm "N4P" node process. The vast majority of Xiaomi's modern flagship smartphone devices utilize top-end Qualcomm Snapdragon chipsets. For example, the brand's latest Xiaomi Ultra 15 model is powered by the ubiquitous Snapdragon 8 Elite (Gen 4) platform.

Digital Chat Station (DCS)—a dedicated watcher of futuristic smartphone chip developments—has returned to a favorite topic: Qualcomm's rumored "Snapdragon 8 Elite Gen 2" mobile chipset. The tenured technological soothsayer disclosed compelling "SM8850" details over a month ago; mostly focusing on key next-gen upgrades. His latest bulletin reiterates many past claims, but a new proposition points to a significant bump in onboard AI-crunching capabilities. DCS's latest dose of inside track knowledge points to the Gen 2 chip's NPU computing power being bumped up "to 100 TOPS."

At the tail end of their bulletin, DCS mentioned an interesting new feature: "(the SM8850) chip natively supports hardware-level sunlight screen; display brightness of new devices will be greatly improved, and the native-level super frame will be further improved." In a separate post, DCS hinted about a forthcoming "Snapdragon 8 flagship chip-powered" smartphone that will make use of a "new silicon" 7800 mAh capacity battery. Commenters have linked OnePlus to this development—Chinese electronics firms seem to be ahead of mainstream South Korean rivals, with their formulations of silicon-carbon battery technology. DCS's freshest theory did not place the cutting-edge "Snapdragon 8 Elite Gen 2" chip alongside a super high-capacity power cell, but examples of this potent combination could arrive later this year.

Mid-way through April, a few Asian media outlets proposed a fairly recent formation of Xiaomi's "chip platform department"—most likely operating as part of the Chinese corporation's mobile phone development operation. Industry insiders claimed that this special branch was tasked with the designing of "Xuanjie" chipsets, with added expertise provided by an ex-Qualcomm marketing director. Weeks later, Jukanlosreve has weighed in with alleged new details. The keen tracker—of unannounced flagship smartphone chips and semiconductor business revelations—believes that previous leaks were of merit, but made some corrections.

Given reported greater than expected "new division" headcounts, Xiaomi probably established its "Xring SoC" team a while ago—on this topic, Jukanlosreve divulged: "it operates as a new company; independent of the original parent firm. It's not a small team either—it has over 1000 people. To be honest, I see it as a positive development if a domestically produced chip gets used in a domestically made smartphone and sold globally. I genuinely hope it becomes reality. If Xring succeeds, it might encourage more companies to get involved, and even engineers currently working at major firms could see better pay opportunities."

Yesterday, Chosun Daily published a news report that alleges a key "Galaxy Z Flip 7-related" decision made by Samsung leadership. According to smartphone industry moles, the oft-leaked/rumored "Exynos 2500" chipset destined to debut in the company's next-gen (horizontal) foldable smartphone design. As stated in the South Korean insider article: "this is the first time that Samsung's own mobile application processor (AP) is being installed in a foldable phone." Prior to 2025, Galaxy Flip Z product lines made use of Qualcomm Snapdragon chipsets. Throughout early 2025, leaks have linked the "troubled" Exynos 2500 mobile processor to futuristic Galaxy Z Flip 7, Fold 7, and affordable "FE" Enterprise Edition models. The emergence of a superior 2 nm "Exynos 2600" flagship chip—apparently tailored for Galaxy S26 devices (2026)—has allegedly relegated the lesser SoC into lower leagues.

Semiconductor industry watchdogs reckon that the "Exynos 2500" will be manufactured via Samsung Foundry's own 3 nm GAA node process (aka SF3). Notebookcheck commented on this odd choice: "industry estimates from earlier suggested (SF3) yields were around 40%, making it less than ideal for mass production. But it seems Samsung decided to proceed anyway to save on costs, and likely give a new lease of life to its struggling foundry business." Jukanlosreve followed up with additional inside knowledge, just after the publication of Chosun Daily's news piece. The keen tracker of foundry-related revelations let slip with this observation: "the Exynos 2500 being used in the Flip 7 is said to be a lower-clocked chip due to its low yield. So it might as well be called the E2500E." Samsung is expected to unveil its Galaxy Z Flip 7 smartphone family during an "Unpacked" July event. Experts believe that Foundry employees will accumulate useful experience from the mass production of 3 nm parts; thus leading to improved output of finalized 2 nm (SF2) production lines.

Industry watchdogs have held the belief that Samsung's foundry business has lost several key clients due to alleged yield problems—the South Korean megacorp appears to be diligently working on major improvements with currently "in-progress" manufacturing processes; namely 2 nm GAA (aka SF2). Semiconductor industry insiders believe that TSMC is still leading the way with a recently completed trial run of their own 2 nm design, but rumors of elevated prices have reportedly upset certain important customers. According to a fresh Sedaily news article, Qualcomm has conducted negotiations with Samsung Foundry top brass—semiconductor industry moles claim that a "Snapdragon 8 Elite 2nd generation product" was the main topic of discussion. This next-gen flagship mobile chipset was previously linked to a 3 nm TSMC node, but newer rumors point to a possible spin-off that will utilize a "more advanced 2 nm process"—courtesy of Samsung Electronic's prime "Hwaseong S3" facility.

Sedaily and Jukanlosreve reckon that mass production will kick off at this cutting-edge early next year. Earlier today, Jukanlosreve added extra conjecture/context via a long social media bulletin: "the completed chips are expected to be integrated into Samsung Galaxy smartphones slated for launch in H2 2026. Design work is to finish in Q2 2025, after which mass-production preparations will begin and wafer runs will start in Q1 2026. Output is estimated at roughly 1,000 twelve-inch wafers per month. Given that Samsung's current 2 nm capacity is about 7,000 wafers/month, this project would utilize only around 15 % of its available capacity—suggesting this is a modest order rather than a large-scale win." These predictions have surprised many industry observers; Samsung leadership has seemingly tried to prioritize the in-house Exynos mobile processor designs within futuristic flagship Galaxy smartphone devices. Jukanlosreve reckons that the Samsung Foundry is keen to embrace any new "golden opportunities," given the operation's weakened track record across the past half decade. One unnamed insider posited: "this Qualcomm partnership could pave the way for orders from other big tech players." Sedaily sent a query to Samsung HQ, regarding the latest inside talk—a company spokesperson replied with: "we cannot confirm anything related to customer orders."

TSMC today unveiled its next cutting-edge logic process technology, A14, at the Company's North America Technology Symposium. Representing a significant advancement from TSMC's industry-leading N2 process, A14 is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities, making them even smarter. Planned to enter production in 2028, the current A14 development is progressing smoothly with yield performance ahead of schedule.

Compared with the N2 process, which is about to enter volume production later this year, A14 will offer up to 15% speed improvement at the same power, or up to 30% power reduction at the same speed, along with more than 20% increase in logic density. Leveraging the Company's experience in design-technology co-optimization for nanosheet transistor, TSMC is also evolving its TSMC NanoFlex standard cell architecture to NanoFlex Pro, enabling greater performance, power efficiency and design flexibility.

Looking for the perfect entry-level mobile controller? Meet the GameSir X5 Lite—lightweight, widely compatible, and designed for all-day comfort. With Hall Effect sticks, cushioned triggers, and more, it delivers everything you need for a smoother, more comfortable mobile gaming experience. Now available for pre-order on the GameSir official website. Designed for flexibility, the X5 Lite supports both Android and iOS devices from 105 mm to 213 mm wide. Enjoy ultra-low latency gaming sessions with the GameSir movable Type-C port for a secure connection and lag-free play.

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Last year, leakers posited that Xiaomi engineers were working on proprietary new-generation mobile chipset. The giant Chinese technology company has produced proprietary SoC designs in the past—most notably 2017's Pengpai/Surge S1 (blink, and you missed it)—but has largely relied on a wide swatch of Qualcomm solutions for deployment in smartphones. According to a fairly fresh ITHome news report (via a source at Sina Technology), Xiaomi has established a "chip platform department" under the umbrella of its mobile phone product development division. The exact nature of this newly-formed team remains semi-mysterious, and how it intermeshes with current (rumored) proprietary chip design efforts. The megacorporation's speculated "dedicated chip platform department" is said to be working on a "Xuanjie" SoC series.

Qin Muyun—a former senior director of product marketing at Qualcomm—is purported to be the new department's leader. Insiders believe that Muyun will answer directly to Xiaomi's CEO: Lei Jun. Over the past half decade, company engineers have accumulated chip designing experience in multiple lesser technology fields—ITHome lists: "imaging, fast charging, power management, communication, and display" aspects. Xiaomi leadership could be "shaking up" its first-party SoC development projects. Two weeks ago, rumors turned up online regarding a node process downgrade—from 3 nm to 4 nm. Smartphone industry watchdogs reckon that Xiaomi's forthcoming flagship chipset design will perform on the level of Qualcomm's first generation Snapdragon 8 mobile processor (from 2021).

MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek's Dimensity flagship chipset family. Providing exceptional Generative and agentic AI capabilities as well as other performance enhancements, the Dimensity 9400+ supports the latest Large Language Models (LLM) while sustaining a super power-efficient design. The Dimensity 9400+ features an All Big Core design, integrating one Arm Cortex-X925 core operating up to 3.73 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This powerful configuration accelerates single and multithreaded performance for top-tier Android UX experiences.

"The MediaTek Dimensity 9400+ will make it easier to deliver innovative, personalized AI experiences on-device, combined with enhanced overall performance to ensure your device can handle all tasks with ease," said JC Hsu, Corporate Senior Vice President at MediaTek. "We are working closely with developers and manufacturers to continue building a robust ecosystem of AI applications and other features that will bring a number of speed and privacy benefits to consumers."

According to a fresh Money Today SK news article, Samsung is expected to launch a next-generation Galaxy Ring model later this year—this tiny wearable device is touted to operate with a "dream battery" design. The South Korean giant's Electro-Mechanics division is reportedly tasked with the challenging development of "all-solid-state" batteries for all manner of ultraportable products. Yesterday's report suggests that Samsung's upcoming Galaxy Ring sequel—apparently scheduled for launch within Q4'25—will be driven by the Electro-Mechanics team's pioneering effort. The production of all-solid-state battery units is an expensive endeavor, so industry watchdogs have predicted tough retail conditions for the forthcoming "Galaxy Ring 2" rollout—the original unit was not exactly a "hot property" in terms of sales figures.

Money Today's inside sources reckon that the Electro-Mechanics branch will—eventually—fit all-solid-state battery designs inside new-gen earphones (aka Galaxy Buds) by Q4 2026, and very futuristic smartwatches by the end of 2027. Given cost considerations, larger all-solid-state solutions—potentially for usage in smartphones—are not in the pipeline. Around early February of this year, the development of Samsung's (inevitable) "Galaxy S26" mobile series was linked to alleged 6000+ mAh silicon-carbon battery units. The South Korean's smartphone engineering team is reportedly trying to play catch up with more advanced solutions, as devised by competitors in China. The status of Samsung's proprietary silicon-carbon prototype is the subject of much online debate, but certain insiders believe that employees are still working hard on the perfection of an ideal "battery formula."

Digital Chat Station (DCS)—a tenured leaker of Qualcomm pre-release information—has shared new "Snapdragon 8 Elite Gen 2" chipset details. Earlier today, their Weibo feed was updated with a couple of technological predictions. The announced smartphone chip's "SM8850" identifier was disclosed once again, along with the repeated claim that Qualcomm has selected a 3 nm "N3P" node process. Industry watchdogs expect to see the San Diego-headquartered fabless semiconductor designer introduce its next-generation flagship smartphone SoC in October. The current-gen Snapdragon 8 Elite platform was unveiled last Fall; sporting cutting-edge "Oryon" (aka Phoenix) processor cores and an integrated Adreno 830 graphics solution. DCS reckons that the natural successor will reuse a familiar "2 + 6" core configuration; comprised of two prime "big performance" units, and six "normal" performance-tuned units. An Adreno 840 iGPU was listed as DCS's final point of conjecture.

The incoming "Snapdragon 8 Elite Gen 2" chipset was mentioned in the same sentence as rumored "Pegasus" cores (Phoenix's sequel)—slightly far-fetched rumors from 2024 suggested Qualcomm's upgraded processor architecture being tested at maximum frequencies of 5.0 GHz (on performance cores). As pointed out by Wccftech, Gen 1's performance cores run at 4.47 GHz (by default). In today's follow-up post, DCS claimed that Qualcomm's: "self-developed CPU architecture is now in the second generation, with a performance setting of over 380 W+." Industry watchdogs reckon that the "Snapdragon 8 Elite 2" chip will be capable of recording 3.8+ million point tallies in AnTuTu V10 gauntlets, thanks to the alleged utilization of ArmV9 architecture. DCS theorized that the speculated "SM8850" SoC will support ARM's Scalable Matrix Extension 1 (SME 1) and Scalable Vector Extension 2 (SVE2) instruction sets.

Last week, South Korean semiconductor industry moles let slip about the development of an "Exynos 2600" mobile chipset at Samsung Electronics. This speculative flagship processor was linked to the manufacturer's (inevitable) launch of Galaxy S26 smartphone models in early 2026. Despite rumors of the firm's Foundry service making decent progress with their preparation of a cutting-edge 2 nm Gate-All-Around (GAA) node, certain critics reckon that Samsung will be forced into signing another (less than ideal) chip supply deal with Qualcomm. According to The Bell SK's latest news report, Samsung's LSI Division is working with plenty of determination—an alleged main goal being the next wave of top-end Galaxy smartphones deployed next year with in-house tech onboard.

Inside sources propose that Samsung's Exynos 2600 SoC needs to be "finished by the middle of the third quarter of this year," thus ensuring the release of in-house chip-powered Galaxy S26 devices. It is not clear whether this forecast refers to a finalized design or the start of mass production. The latest whispers regarding another proprietary next-gen mobile processor—Exynos 2500—paint a murky picture. Past leaks indicated possible avenues heading towards forthcoming Galaxy Z Flip 7 and Fold 7 smartphone models. The latest reports have linked this design to a mature 4 nm process and eventual fitting inside affordable "Galaxy Z Flip FE" Enterprise Edition SKUs. The Bell contacted one of its trusted sources—the unnamed informant observed that everything is in flux: "Exynos 2500 production plan is constantly changing...I thought it was certain, but I heard that the possibility has recently decreased slightly." Reportedly, Samsung employees have their plates full with plenty of simultaneous projects in 2025.

Earlier in the week, Apple specialist press outlets picked up on a noted industry analyst's technological forecast for a future iPhone processor design. Jeff Pu—of GF Industries, Hong Kong—predicted that the next-generation A20 SoC would be produced via a TSMC 3 nm (N3P) nodes process. Despite rumors of Apple gaining front row seats at the "2 nm ballgame," the partnership between fabless chip designer and foundry could potentially revisit already covered ground. The A19 chipset was previously linked to N3P (by insiders), with Pu expressing the belief that A20 would utilize the same fundamental lithographic underpinnings; albeit enhanced with TSMC's Chip on Wafer on Substrate (CoWoS) packaging technology (for AI improvements).

This morning, MacRumors followed up on their initial news article—they reported that "wires were crossed" at GF Industries, regarding projections for the (2026) iPhone 18 generation. The publication received direct feedback from the man of the hour: "Jeff Pu (lead Apple analyst) has since clarified that he believes the A20 chip will be manufactured with the N2 process, so the information about the chip using the N3P process should be disregarded. Earlier reports had said the A20 chip would be 2 nm, so rumors align again. This is ultimately good news, as it means the A20 chip should have more substantial performance and power efficiency improvements over the A19 chip." Cutting-edge smartphone processor enthusiasts expressed much disappointment when A20 was (regressively) linked to N3P; the latest revisement should instill some joy. According to industry moles, TSMC is making good progress with its cutting-edge 2 nm node process—mass production is expected to start at some point within the second half of 2025.

We're stepping up our multiplatform gaming offering with exciting news dropping at this year's Game Developers Conference (GDC). We're bringing users more games, more ways to play your games across devices, and improved gameplay. You can read all about the updates for users from The Keyword. At GDC, we'll be diving into all of the latest games coming to Play, plus new developer tools that'll help improve gameplay across the Android ecosystem.

We're sharing a closer look at what's new from Android. We're making Vulkan the official graphics API on Android, enabling you to build immersive visuals, and we're enhancing the Android Dynamic Performance Framework (ADPF) to help you deliver longer, more stable gameplays. Check out our video, or keep reading below.

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

According to Digital Chat Station—a repeat leaker of unannounced Qualcomm hardware—unnamed Android smartphone manufacturers are considering an eSIM-only operating model for future flagship devices. Starting with the iPhone 14 generation (2022), Apple has continued to deliver gadgets that are not reliant on "slotted-in" physical SIM cards. According to industry insiders, competitors could copy the market leader's homework—Digital Chat Station's latest Weibo blog post discusses the space-saving benefits of eSIM operation; being "conducive to lightweight and integrated design." Forthcoming top-tier slimline Android mobile devices are tipped to utilize Qualcomm's rumored second-generation "Snapdragon 8 Elite Gen 2" (SM8850) chipset.

Digital Chat Station reckons that: "SM8850 series phones at the end of the year are testing eSIM. Whether they can be implemented in China is still a question mark. Let's wait and see the iPhone 17 Air. In order to have an ultra-thin body, this phone directly cancels the physical SIM card slot. Either it will be a special phone for the domestic market, or it will get eSIM." The phasing out of physical SIM cards within the Chinese mobile market could be a tricky prospect for local OEMs, but reports suggest that "traditionally-dimensioned" flagship offerings will continue to support the familiar subscriber identity module standard. Physical SIM card purists often point out that the format still provides superior network support range.

On Monday (March 3), Qualcomm introduced its Dragonwing FWA Gen 4 Elite model—advertised as the world's first 5G Advanced-capable FWA platform. Inevitably, the company's brand-new Snapdragon X85 5G modem will be compared to a rival design—Apple's proprietary C1 chip launched last month; as featured in the A18 SoC-powered iPhone 16e series. The two companies were closely intertwined for a number of years; with a longer than anticipated co-development of 5G solutions for multiple iPhone product generations. Cristiano Amon—the CEO of Qualcomm—believes that his team's X85 5G design will end up as the victor, when pitched against Apple's C1. In a CNBC-conducted interview, he boasted: "it's the first modem that has so much AI, it actually increases the range of performance of the modem—so the modem can deal with weaker signals. What that will do will set a huge delta between the performance of premium Android devices, and iOS devices, when you compare what Qualcomm can do versus what Apple is doing."

Smartphone industry watchdogs reckon that Apple's C1 model will leverage superior power efficiency; courtesy of the contained modem and receiver being based on TSMC 4 nm and 7 nm processes (respectively). Qualcomm has not revealed the fundamental aspects of its new Snapdragon X85, so it is difficult to project its power consumption habits. Official press material concentrates on two big selling points: downlink speeds up to 12.5 Gbps, and 40 TOPS of NPU processing power. Insiders have posited that the in-house designed C1 modem will make its way into next-gen iPads and Apple wearables—additionally, the development of a successor is rumored. Despite doing less business with Apple, Amon thinks that the future is peachy: "if modem is relevant there's always a place for Qualcomm technology. In the age of AI, modems are going to be more important than they have ever been. And I think that's going to drive consumer preference about do they want the best possible modem in the computer that's in their hand all the time." Qualcomm's chief expects that the supply of Snapdragon 5G Modem‑RF Systems—to Apple—will end in 2027.

Lenovo Group Limited (HKSE: 992) (ADR: LNVGY), together with its subsidiaries ('the Group'), today announced Q3 results for fiscal year 2024/25, reporting significant increases in overall group revenue and profit. Revenue grew 20% year-on-year to US$18.8 billion, marking the third consecutive quarter of double-digit growth. Net income more than doubled year-on-year to US$693 million (including a non-recurring income tax credit of US$282 million) on a Hong Kong Financial Reporting Standards (HKFRS) basis. The Group's diversified growth engines continue to accelerate, with non-PC revenue mix up more than four points year-on-year to 46%. The quarter's results were driven by the Group's focused hybrid-AI strategy, the turnaround of the Infrastructure Solutions Group, as well as double-digit growth for both the Intelligent Devices Group and Solutions and Services Group.

Lenovo continues to invest in R&D, with R&D expenses up nearly 14% year-on-year to US$621 million. At the recent global technology event CES 2025, Lenovo launched a series of innovative products, including the world's first rollable AI laptop, the world's first handheld gaming device that allows gamers free choice of Windows OS or Steam OS, as well as Moto AI - winning 185 industry awards for its portfolio of innovation.

Yesterday's news cycle pointed to Samsung's alleged development of 7000 mAh capacity batteries for the next-gen "Galaxy S26" smartphone series. Additionally, reports suggest that the South Korean megacorporation's Electronics division is experimenting with silicon-carbon battery technology. Industry watchdogs reckon that Chinese manufacturers are market leaders in terms of silicon-carbon battery tech breakthrough, with Apple and Samsung trailing far behind. PandaFlashPro took issue with the latest reports, and dismissed the notion of a so-called "Galaxy S26 Ultra" model featuring a 7000 mAh capacity battery. According to their network of insider sources, Samsung engineers are struggling with their planned improvements.

Typically, flagship Galaxy S phones have utilized 5000 mAh lithium-polymer batteries. PandaFlashPro envisions an underwhelming next-gen upgrade in this department: "I'll delete my X/Twitter account if Samsung gives the 'Galaxy S26 Ultra' a 7000 mAh or even a 6000 mAh battery I bet...based on my five sources, the internal Samsung Test Lab only seem to have a maximum capacity of 5500mAh; not more." The self-proclaimed science and tech enthusiast did not clarify whether the new generation of Galaxy S models will utilize silicon-carbon tech. Industry whispers allege that Samsung is perfecting its "battery formula," thus ensuring that it meets internal standards and expectations.