At Computex 2025, ASRock deliberated over the problems that have plagued certain AMD 800-series motherboard models. Fatal combinations—usually affecting popular Ryzen 7 9800X3D gaming CPUs—have been highlighted by sections of the PC hardware community, and (subsequently) press outlets. Months ago, the Taiwanese mainboard manufacturer's Japanese branch took a combative stance (in response to widespread criticism). Following continued failures of Team Red "Granite Ridge" desktop processors on "mid-to-high-end" ASRock mainboards—even in non-3D V-Cache guises—company representatives have interacted with key media conduits, including Tech YES City's Bryan Bilowol. Coinciding with the release of fresh BIOS fixes, long-form video coverage of Q&A sessions have turned up on YouTube.

Company reps have alluded to a warranty replacement scheme, but full details were not disclosed during May-time Computex proceedings. Many critics are still waiting for an official company statement; hopefully addressed to a global audience. In the meantime, one regional office has weighed in with some much-needed outreach: "ASRock Korea takes the recent AMD 800 series motherboard issues experienced by some users very seriously and will follow up with you to protect your trust. ASRock is continuously monitoring the performance and stability of the platform and will provide a firmware update as soon as possible if any issues are identified. In addition, if the system you are using is damaged due to this issue, we will take responsible measures for both the CPU and the motherboard distributed through the official domestic importer, and please submit the case through ASRock Korea's official distributor for diagnosis and processing. ASRock Korea will continue to listen to the voices of our customers and do our best to remain a trusted brand." This message was posted on Quasar Zone; a high-traffic PC hardware forum. A good number of manufacturers have responded to cases raised by members of this South Korean community.

Earlier this month, Bryan Bilowol—of Tech YES City fame—was taken aback by the unexpected "death" of his Ryzen 9 9950X processor, at the alleged hands of an ASRock X870 Steel Legend motherboard. Throughout early 2025, widespread news reports and community tracking efforts have largely implicated ASRock boards. AMD's highly popular Ryzen 7 9800X3D gaming CPU has "fallen victim" on numerous occasions, but a smaller number of incidents have affected non-3D V-Cache equipped Ryzen 9000 "Granite Ridge" models. The Taiwanese manufacturer and Team Red have investigated these problems, and have released fixes via BIOS updates. Despite these efforts, unhappy owners have experienced CPU failures in Q2'25. Following the uploading of initial findings and theories, Bilowol promised further reports. Fortunately, a sit-down—with ASRock's motherboard team—happened late last week, at Computex 2025. At the time of writing, the company has not published an official statement regarding their latest findings or fixes. Tech YES City shared a couple of compelling details in a May 26 YouTube upload (viewable below).

Commenting on the Ryzen 9000 CPU failure situation, Bilowol relayed important ASRock material: (the motherboard team) told me it had to do with the EDC and TDC, which is the electric design current as well as the thermal design current. Essentially, they're saying it's an ampage problem that exists with the precision boost overdrive (PBO) settings. In particular, these mid-range and high-end motherboards—say for instance a B650E or an X670E Taichi or even a B850 Steel Legend—have the ability to run Ryzen 9000 series CPUs at their maximum PBO settings out of the box. What's happening here is ASRock told me they were implementing these settings to what they believe was too aggressive for what the CPUs were able to handle, at least for earlier samples. However, they do promise me that these issues have been fixed with their latest BIOS updates that they're rolling out for these mid-range and high-end motherboards. They also told me that the lower-end boards, say for instance, an A620 HDV or something like that, shouldn't be affected by this issue simply because those PBO settings have been deliberately tuned down, due to the motherboard in question not being a high-end model." Three months back, ASRock's Japanese branch accused the PC hardware community of spreading "misinformation." Hopefully, the latest batch of fixes will bring an end to all Ryzen 9000 CPU + high-end/mid-range ASRock mainboard controversies.

GIGABYTE has on display at Computex 2025 its latest motherboards from the AORUS series, built around AMD X870E and X870 chipsets. Starting with the X870E AORUS Master X3D Ice motherboard, winner of the TechPowerUp Best of Computex 2025 Award for product innovation and design, GIGABYTE also showcases the X870M AORUS ELITE WIFI7, X870E AORUS ELITE X3D ICE, X870E AORUS PRO X3D ICE, and finishing with the X870 AORUS STEALTH ICE. These motherboards feature GIGABYTE's second generation of X3D Turbo Mode implemented at the BIOS level. GIGABYTE declares that with a single click in the UEFI setup interface, these motherboards can deliver up to 15% better gaming performance from AMD's Ryzen 9000X3D series processors (9800X3D, 9900X3D, and 9950X3D).

Going quickly over these motherboards' features, the X870M AORUS ELITE WIFI7 sports a digital twin 14+2+2 phase VRM, while the X870 AORUS STEALTH ICE boasts white reverse connectors and a robust 18+2+2 (SPS 80 A) VRM. Worth mentioning that GIGABYTE has partnered with over ten case manufacturers, including Corsair, Cooler Master, Fractal Design, Phanteks, and more, to provide reverse-connector-ready cases across more than 25 models. As for the X870E-based AORUS series, it adds the M.2 EZ-Match (a magnetic alignment feature to help users with the installation of large heatsinks).More pictures follow.

In addition to new graphics cards, ASRock also showcased a couple of new motherboards at the Computex 2025 show in Taipei, including the new X870E Taichi OCF, X870 Taichi Creator, as well as the new Phantom Gaming X870 Nova Wi-Fi motherboard.

The star of the show is the new X870E Taichi OCF, which is also the first OC Formula motherboard based on AMD platform. This feature packed motherboard will support AMD Ryzen 9000, 8000, and 7000 series processors on AM5 socket. It features a 25-power phase VRM with 110A SPS, has two DDR5 DIMM slots, two PCIe 5.0 x16 and single PCIe 4.0 x4 slot, a total of six M.2 ports (two of which are PCIe Gen 5 x4), plenty of USB ports, 5 Gbps Ethernet, integrated Wi-Fi 7 and Bluetooth, and most importantly, "Professional Overclocking Toolkit", which means that this one is aimed at some high overclocking. ASRock also showcased the new X870 Taichi Creator, a more standard motherboard that has 21-phase VRM design, but comes with Marvell's 5 Gbps and 10 Gbps Ethernet ports.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, is excited to announce the participation in Computex Taipei 2025. Under the theme Gaming Beyond Limits, AI Beyond Imagination, ASRock will showcase the dual focus on next-level gaming and AI applications. From immersive gaming setups to AI solutions, the exhibit highlights ASRock's commitment to innovation across both fields. Visitors are invited to explore the latest products and technologies, and to experience the Phantom Gaming Zone at booth L0818.

ASRock Unveils Flagship Taichi OCF and Taichi Creator AM5 Motherboards
To expand its success on AMD AM5 motherboards, ASRock will be adding more exciting products into its product portfolio. New product such as X870E Taichi OCF, the very first OC formula motherboard based on AMD platform, Phantom Gaming X870 Nova WiFi, the new high end gaming motherboard based on X870 chipset, a functional yet elegantly designed X870 Taichi Creator and also a lot more products that are based on X870 / B850 / B840 / A620A chipset.

GIGABYTE TECHNOLOGY Co. Ltd, the world's leading computer brand, continues to redefine DIY PC building with its innovative Project STEALTH, first introduced in 2022. The Project STEALTH concept was the industry's pioneer in adopting reverse-connector motherboards for a cleaner, more streamlined assembly. Now, responding to the growing demand for all-white and cableless PC builds, GIGABYTE launches the STEALTH ICE Series, featuring the AMD X870 and B850 chipset motherboards.

Beyond aesthetics and easier assembly, GIGABYTE ensures that the Project STEALTH build is highly compatible. In addition to supporting its own chassis lineup (GIGABYTE C500P STEALTH Series), GIGABYTE has partnered with over 10 renowned case manufacturers, including Corsair, Cooler Master, Fractal Design, Phanteks, and more, to provide reverse-connector-ready cases across more than 25 models. This makes the GIGABYTE Project STEALTH Series the most compatible, the most widely supported and flexible solution in the market for cableless PC builds.

Unlucky owners of AMD Ryzen 7 9800X3D processors have encountered major problems that largely involve ASRock motherboards. Throughout early 2025, user feedback provided insight into numerous cases of "catastrophic CPU failures." Members of the official ASRock subreddit have kept track of these unfortunate incidents; now closing in on 200 documented "murdered" specimens. Industry watchdogs reckon that even more disagreements—involving the Zen 5-based 9000X3D series and ASRock B- and X- (AM5) boards—exist outside of this community-aggregated log. At the end of February, ASRock pushed out an important BIOS update—this fix did not resolve all problems. Over a month later, AMD weighed in with their findings—in response, ASRock released another update.

Evidently, Ryzen 7 9800X3D products continue to perish—Tech YES City's Bryan Bilowol has added Team Red's Ryzen 9 9950X model to the mix. The tech YouTuber was surprised by the death of his example; apparently caused by an ASRock X870 Steel Legend mainboard. Standard "Granite Ridge" processors—that lack 3D V-Cache—have received less attention, but observers believe that these non-X3D options are still vulnerable. Bilowol did not personally experience the moment of catastrophe—instead, a friend was borrowing an affected PC build. As demonstrated in a new Tech YES City video post-mortem, the completely dead CPU sported some worrying gray marks. Tech YES City has a fairly large audience, so ASRock leadership will likely be cursing after noticing another uptick in public scrutiny. Past reports have pointed out the manufacturer's belief that too much "misinformation" is being spread. Bilowol surmised that the company is keeping this issue: "under the radar—they seem to be hoping that the issue will just go away." Despite collaborating with ASRock for over a decade, Tech YES City will not pull any punches—await for more gory details in upcoming follow-up investigations.

Minisforum is working on a new MoDT (Mobile on Desktop) motherboard lineup featuring mobile versions of AMD Ryzen processors, one of them being the F1FGM model. The motherboard came in a compact microATX form factor built around the AMD X870M chipset and is equipped with the latest AMD Ryzen 9 9955HX processor rather than traditional socket-type processors. This CPU has a boost clock of up to 5.4 GHz and is based on the Zen 5 architecture offering 16 cores, 32 threads, and 64 MB of L3 cache. Interestingly, even if this processor is rated at 55 W by default, in this particular Minisforum implementation it can be pushed up to a whopping 160 W. To efficiently dissipate the substantial 160 W thermal output and considering that mobile CPUs don't have an IHS, the motherboard comes equipped with a pre-installed vapor chamber heat spreader. The VRM features a solid design with 13-phase 60 A SPS DrMOS. Minisforum has also included large heatsinks across the VRMs, M.2 Slots and PCH.

For expansion, the Minisforum F1FGM motherboard offers one PCIe 5.0 x16 slot and one PCIe 4.0 x16 slot. Storage interfaces include one PCIe 5.0 compatible M.2 slot, three additional M.2 slots (one is rated at Gen 5 x4), two SATA 6 Gbps connections and two BIOS Debug LEDs. On the connectivity side it features two USB4 ports, one HDMI, one DisplayPort, five Gigabit Ethernet, and Wi-Fi 7 compatibility. The four 5 V ARGB LED control pin headers is a clear step towards DIY users and according to company representatives, the main competition for this motherboard will be ASUS ROG products. PCWatch reports that Minisforum intends to offer the F1FGM motherboard at a price point comparable to a standalone desktop CPU in the second half of this year.

ASUS today introduced the X870 MAX Gaming WiFi7 motherboard. This Socket AM5 motherboard comes in two color-based variants—its default black, and the white X870 MAX Gaming WiFi7 W, which features a white PCB, besides white/silver heatsinks. The X870 MAX Gaming is positioned below even the TUF Gaming X870 Plus, and separate from the company's Prime series. It is designed to lure gaming PC builders away from the likes of the GIGABYTE Gaming X and MSI Gaming Plus series. The board is built in the ATX form-factor and draws power from a combination of 24-pin ATX and two 8-pin EPS connectors. It features a 12+2+1 phase CPU VRM that uses 80 A-rated power stages.

The Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16 slot, and just the one M.2 Gen 5 x4 NVMe slot. The second CPU-attached NVMe interface is wired out as M.2 Gen 4 x4. The third M.2 slot is Gen 4 x4 and wired to the X870 FCH. The board also puts out four SATA 6 Gbps ports. Besides the main Gen 5 x16 PEG slot, the board has three other physical x16 slots, two of these are Gen 4 x1, and the last one Gen 3 x1. Display connectivity includes an HDMI, and a DisplayPort that's wired to the board's two 40 Gbps USB4 type-C ports. Other USB ports include a 10 Gbps USB 3.2 Gen 2; three 5 Gbps USB 3.1 Gen 1, and four USB 2.0, there is a 20 Gbps USB-C header, besides two additional 5 Gbps ports through a standard header.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, is thrilled to announce the CVN X870 ARK FROZEN motherboard for the AMD Ryzen 9000 Series processors - COLORFUL's first AMD X870 motherboard. The CVN X870 ARK FROZEN adopts the CVN's signature military-inspired aesthetics.

The CVN X870 ARK FROZEN's design is inspired by aircraft carriers. The motherboard features large frost gray heatsinks and a titanium gray-colored PCB - COLORFUL's first AM5 motherboard to feature the color. Its bright orange accents evoke power and sophistication. The M.2 heatsinks sport lines similar to the runway of the aircraft carrier.

Colorful recently teased its new CVN motherboards series based on the AMD X870 chipset, and now the first model, CVN X870 ARK FROZEN V14, has been listed on the Colorful website. This motherboard marks the debut of Colorful's first-generation graphics card quick-release mechanism, featuring an "ON or OFF" switch placed just below the memory slots. Colorful advertises this proprietary design as being "really safe". The CVN X870 ARK FROZEN V14 motherboard features a standard ATX form factor with a striking white PCB and frost-themed heat dissipation armor. It boasts a 14+2+1 phase power supply design with 80 A DrMOS components and dual 8-pin EPS connectors for CPU power. In terms of memory, it has four DDR5 memory slots supporting up to 192 GB (single slot up to 48 GB) and allows up to 8000 MHz overclocked memory modules.

The PCIe configuration includes a PCIe 5.0 x16 slot directly connected to the CPU with metal reinforcement and quick-release support, a full-length PCIe 4.0 x4 slot (which shares lanes with the third M.2 slot), and a PCIe 4.0 x1 slot. For storage, users get two PCIe 5.0 x4 M.2 slots directly connected to the CPU and one PCIe 4.0 x4 M.2 slot via the chipset, which is mutually exclusive with the second PCIe slot. Additionally, the board includes four SATA III 6 Gbps ports. Networking options include a Realtek RTL8126-CG chip offering 5GbE wired connectivity and a MediaTek MT7925 module supporting Wi-Fi 7 and Bluetooth 5.4. The Realtek ALC1220 CODEC powers audio. The rear I/O provides HDMI 2.0, DisplayPort 1.2, multiple USB-A ports, a USB-C port with 40 Gbps bandwidth and DP Alt Mode support, a 5GbE RJ45 port, dual Wi-Fi antenna connectors, an S/PDIF out, and five standard audio jacks. According to ITHome, Colorful previously announced that the CVN X870 ARK FROZEN V14 will begin shipping around mid-April, pricing is yet to be revealed.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce a new high-speed memory overclock DDR5 specification with an ultra-high kit capacity - DDR5-8000 CL44 with 128 GB (64 GB x2) kit capacity. This is the world's first DDR5 memory kit with 64 GB high-capacity modules to reach the extreme overclock level of DDR5-8000, setting a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

New Era of Overclocking High-Capacity DDR5 64 GB Modules
Engineered for high-capacity overclocked performance, the DDR5-8000 128 GB (64 GB x2) combines ultra-high memory speed with massive memory kit capacity, surpassing the previous module capacity maximum at 48 GB per module. At last, power users and content creators who seek overclock performance memory for capacity-hungry applications will have the ideal DDR5 memory solution. Refer to the validation screenshot below to see DDR5-8000 CL44-58-58 128 GB (64 GB x2) tested on the ASUS ROG CROSSHAIR X870E APEX motherboard with the AMD Ryzen 9 9950X desktop processor.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today unveiled its new 2025 pre-configured MG-1 gaming systems, equipped with NVIDIA's cutting-edge GeForce RTX 50-Series GPUs and powered by the latest AMD Ryzen 9000 Series CPUs and Intel Core Ultra Series 2 processors. This exciting lineup offers gamers a significant leap in power, performance, and value, reinforcing MAINGEAR's commitment to redefining the gaming experience across all levels of play.

"2025 is bound to be the best year yet for PC gamers, and the introduction of our newest MG-1 systems continues to drive MAINGEAR's mission to deliver the ultimate gaming experience," said Wallace Santos, CEO of MAINGEAR. "With NVIDIA's RTX 50-Series GPUs, and the latest AMD Ryzen and Intel Core Ultra processors, we've got more options than ever before, ensuring the perfect fit for gamers of all skill levels and budgets."

Over a week ago, ASUS "quietly" unveiled a revamped Q-Release Slim mechanism—eagle-eyed hardware media outlet—Uniko's Hardware—spotted this revised quick release PCIe system on a freshly detailed premium ROG CROSSHAIR X870E APEX motherboard model. Wider press reportage jumped on the manufacturer's mixed bag of official responses; regarding reported damage inflicted by a "problematic" design. The ASUS North American office downplayed the severity of this matter, while colleagues in China launched a fairly comprehensive compensation program. According to VideoCardz, the latter organization has confirmed—as of last week—that a problem-free/improved Q-Release Slim system is on the way.

On Monday, Tweakers divulged its direct communication with ASUS—a spokesperson answered the Dutch site's query: "yes, a change has been made to the Q-Release Slim system for new X870 motherboards. Based on user feedback, we have modified the PCIe slot for the Q-Release Slim system, including removing a metal component to reduce the possibility of damage to the video card." The company representative noted that newly introduced/attached stickers will inform users about "correct system usage." Based on the aforementioned ASUS statement, Tweakers reported: "that both the original and revised versions of the system have been extensively tested and that users should study the included documentation to use the Q-Release Slim system properly. According to the manufacturer, both versions of the technology meet 'industry standards for wear resistance'." That last point suggests that ASUS will not be issuing a wide recall of currently released boards that feature original Q-Release Slim mechanisms.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96 GB (48 GB x2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5
G.Skill continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96 GB (48 GB x2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

Large language models (LLMs) love large quantities of memory—so much so, in fact, that AI enthusiasts are turning to multi-GPU setups to make even more VRAM available for their AI apps. But since many current LLMs are extremely large, even this approach has its limits. At times, the GPU will decide to make use of CPU processing power for this data, and when it does, the performance of your CPU cache and DRAM comes into play. All this means that when it comes to the performance of AI applications, it's not just the GPU that matters, but the entire pathway that connects the GPU to the CPU to the I/O die to the DRAM modules. It stands to reason, then, that there are opportunities to boost AI performance by optimizing these elements.

That's exactly what we've found as we've spent time in our R&D labs with the latest AMD Ryzen CPUs. AMD just launched two new Ryzen CPUs with AMD 3D V-Cache Technology, the AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D, pushing the series into new performance territory. After testing a wide range of optimizations in a variety of workloads, we uncovered a range of settings that offer tangible benefits for AI enthusiasts. Now, we're ready to share these optimizations with you through a new BIOS feature: AI Cache Boost. Available through an ASUS AMD 800 Series motherboard and our most recent firmware update, AI Cache Boost can accelerate performance up to 12.75% when you're working with massive LLMs.

ASUS has discreetly modified its controversial Q-Release Slim mechanism in the newly launched ROG Crosshair X870E Apex motherboard, removing a metal bracket linked to GPU PCIe connector scratches. The unannounced revision, spotted by Uniko's Hardware, follows months of backlash from enthusiasts who reported cosmetic damage to high-end GPUs after repeated use of the quick-release feature. While ASUS has not formally addressed the redesign, it acknowledges the issue—a stark contrast to its earlier dismissal of concerns as "typical wear-and-tear" after 60+ removal cycles. The controversy, first spotted in January 2025, escalated when users shared evidence of scratched PCIe pins on platforms like Reddit and Bilibili.

ASUS's global responses varied sharply: its US division downplayed functional risks, while ASUS China rolled out compensation, including motherboard replacements and store credits, and confirmed a redesign was underway. This regional split shows differing consumer protection norms, with China's aggressive compensation contrasting Western markets' reliance on warranty assurances. Competitors seized the moment. GIGABYTE's AORUS Japan publicly mocked ASUS with a 100-cycle stress test of its EZ Latch Plus, showcasing zero GPU damage—a direct jab at Q-Release Slim's durability. The campaign, echoed by GIGABYTE's Western accounts, emphasized rivalries in the premium motherboard segment. ASUS's quiet hardware fix avoids a formal recall, likely due to the niche impact—frequent GPU swaps are rare among mainstream users.

Biwin, a world-renowned innovator in cutting-edge memory and storage solutions, proudly introduces the Biwin Black Opal OC Lab Gold Edition DW100 RGB DDR5 192 GB Memory Kit (48 GB x 4), available in DDR5-6400 CL30-39-39-108 1.4 V and DDR5-6000 CL28-36-36-102 1.4 V specifications. Breaking the capacity limits of traditional consumer memory, this ultra-large 192 GB kit offers the performance boost needed for AI computing, large-scale data processing, and next-gen computing.

Push Memory Performance with Revolutionary 192 GB Memory Kit
Biwin Black Opal DW100, delivering an ultra-high-capacity 192 GB (48 GB x4) configuration, redefines what's possible with desktop memory and exceptional memory bandwidth, stability, and efficiency. This breakthrough enables users to take full advantage of DDR5's enhanced data throughput to power fast, out-of-the-box speeds for AI computing, large language models (LLMs), generative AI, and edge computing, and other data-rich workloads.

GIGABYTE introduced its STEALTH series motherboard design at last summer's Computex event; where TechPowerUp staffers inspected a B650E AORUS STEALTH ICE sample model. The Taiwanese manufacturer was readying new board SKUs with backside connectors (power and I/O); destined to take on similar products from rival companies. GIGABYTE's debut wave of STEALTH did not include any AMD X670 chipset-based options, but a recent ECC filing points to possible forthcoming X870-based models. A weekend sleuthing session—performed by harukaze5719—unearthed multiple registrations of X870 and B850 boards. Two unannounced STEALTH ICE models were highlighted in the regional registry.

The X870 and B850 AORUS STEALTH ICE models are expected to arrive within the coming months, reportedly sporting familiar white designs—as seen on GIGABYTE's current-gen option. Insiders believe that a high-end X870E-based offering will not emerge, due to STEALTH occupying a very niche market segment. According to a Chinese leaker, B850 models could arrive in ATX and microATX form factors. Further up in product hierarchies, they reckon that the X870 AORUS STEALTH series: "comes standard with PCIe 5.0 and DDR5 overclocking support. The flagship model comes with dual Thunderbolt 4 interfaces." GIGABYTE's back-connected X870 and B850 board designs could demand high asking prices; their current B650E AORUS STEALTH ICE is not readily available, but in some regions it is selling for $320+.

A new case of catastrophic CPU failure has emerged involving AMD's Ryzen 7 9800X3D processor, marking the latest in a series of reported incidents within the last few days involving high-performance GPUs and CPUs. The failure occurred during routine use when a system equipped with the 9800X3D and an ASRock Nova X870E motherboard suddenly shut down, resulting in visible thermal damage to both components. The incident is particularly noteworthy as the system operated under stock settings, with only AMD EXPO memory optimization enabled. The affected user, who has two decades of PC building experience, reported that the system had been operational for approximately 20 days before the failure, with no temperature anomalies recorded through HWMonitor during its operation.

The hardware was running the ASRock BIOS version 3.16. This case differs significantly from the previous AMD Ryzen 7 9800X3D failure, where user error during installation was identified as the primary cause, with the user force-installing the CPU in the socket. The timing of the failure—during a low-intensity workload of streaming video content—further complicates the investigation into root causes. While isolated cases of hardware failure are not uncommon in the PC component market, this case may be the first one caused entirely by the CPU/motherboard combination, not user error. The user also faces uncertainty regarding warranty coverage, as the CPU and motherboard were purchased separately from different retailers. We hope the warranty case goes well, and the user gets a replacement!

Late last week, Colorful Technology revealed a brand-new series of "CVN" motherboards—the manufacturer's Bilibili account hinted at an upcoming launch and uploaded three highly-stylized promotional images. As reported by ITHome, Colorful's debut AMD X870 chipset-based board will be: "equipped with Colorful's first-generation graphics card quick-release device." Western press outlets have covered the functional validity of similar systems in recent times, but Colorful's teaser seems to be poking fun at a rival's current predicament. The incoming CVN X870 series will sport a unique selling point; its GPU removal system features an "ON or OFF" switch. Colorful advertises this proprietary design as being "really safe."

CVN X870 or X870E product pages have not appeared online, but ITHome reckons that this new range will sit in-between Colorful's familiar iGame and Tomahawk motherboard lines. The intended target audience appears to be "mainstream DIY" builders. According to one of the teaser images, Colorful reckons that its silver/white-tinted CVN X870 boards will "live up to expectations." The Chinese manufacturer has devised a new "Frost Armor" structure that covers a board's VRM sections—sporting "composite heat dissipation grooves and heat pipes." Lower-end CVN B840 and B850 models could be in the pipeline, but Colorful is likely testing the waters with its initial launch of X870-equipped fare.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, proudly announces that its entire lineup of AM5 motherboards fully supports the AMD Ryzen 9 9950X3D and 9900X3D processors. With this seamless compatibility, gamers can harness the full potential of these flagship processors for an unparalleled gaming experience.

The AMD Ryzen 9 9950X3D and 9900X3D processors are the flagship models of the Ryzen 9000X3D series, designed for hardcore gaming enthusiasts who demand the ultimate in gaming performance. ASRock AM5 motherboards offer seamless compatibility with the Ryzen 9000X3D series, making them the ideal choice for gamers worldwide to experience the power of the AMD Ryzen 9 9950X3D and 9900X3D processors firsthand.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.