At the tail end of Q1'25, industry whispers suggested that TSMC's premier facilities had completed cutting/leading-edge 2 nm (N2) trial production runs. By early April, company insiders alluded to a confident push into preparations for a futuristic 1.4 nm node at the "P2" Baoshan Plant. This is a very distant prospect; watchdogs envision a 2028 release window. According to expert predictions, cross-facility 2 nm wafer mass production phases are expected to start by the end of this year. Foundry staff seem to be actively pursuing an improvement in yields; earlier guesstimates indicated the crossing of a 70% milestone—good enough for full-blown manufacturing runs.

Fresher musings point to staffers and advanced equipment achieving and stepping just beyond an impressive 90% mark, albeit with silicon intended for "memory products." As of mid-May, Samsung's competing "SF2" product—allegedly—remains in testing phases. South Korean insider news reports posit 2 nm GAA trial yields passing 40%—a significant development for the megacorp's foundry business. Roughly a month ago, (in public) TSMC leadership spoke about an unprecedented demand for 2 nm wafers. Due to rumors of greater than anticipated charges for important TSMC clients, Samsung Semi's top brass is supposedly trying to woo the likes of NVIDIA and Qualcomm.

D-Link Corporation, a global leader in networking solutions, is pleased to announce the launch of its latest DBR Series, which includes the DBR-600-P and DBR-700 business routers, as well as the DBR-X3000-AP smart access point. This new series delivers powerful, secure, and easy-to-manage networking tailored specifically for small business environments such as startups, retail shops, satellite offices, and educational facilities with fewer than 100 users.

With the growing demands of hybrid work and decentralized operations, many small businesses face challenges in establishing a stable and secure network without dedicated IT resources. The DBR Series addresses these challenges by offering streamlined deployment, reliable performance, and centralized management. Each product in the series embodies D-Link's unwavering commitment to high-quality, Made-in-Taiwan craftsmanship, which stands for trusted engineering, meticulous manufacturing, and product reliability. This quality standard reflects Taiwan's globally respected technology ecosystem and reinforces the durability and integrity of the DBR series.

As robots increasingly make their way to the largest enterprises' manufacturing plants and warehouses, the need for access to critical business and operational data has never been more crucial. At its Sapphire conference, SAP announced it is collaborating with NEURA Robotics and NVIDIA to enable its SAP Joule agents to connect enterprise data and processes with NEURA's advanced cognitive robots. The integration will enable robots to support tasks including adaptive manufacturing, autonomous replenishment, compliance monitoring and predictive maintenance. Using the Mega NVIDIA Omniverse Blueprint, SAP customers will be able to simulate and validate large robotic fleets in digital twins before deploying them in real-world facilities.

Virtual Assistants Become Physical Helpers
AI agents are traditionally confined to the digital world, which means they're unable to take actionable steps for physical tasks and do real-world work in warehouses, factories and other industrial workplaces. SAP's collaboration with NVIDIA and NEURA Robotics shows how enterprises will be able to use Joule to plan and simulate complex and dynamic scenarios that include physical AI and autonomous humanoid robots to address critical planning, safety and project requirements, streamline operations and embody business intelligence in the physical world.

Prepare for humanity's next giant leap in Horizon Journey, an ambitious open-world survival game set on a stunningly authentic recreation of Mars, launching on Steam on June 27, 2025. Developed using real NASA imagery, Horizon Journey challenges players to colonise the infamous Red Planet. Future pioneers can get an early taste of Martian life during the upcoming Steam Next Fest in June, with a playable demo available shortly before the event kicks off!

In Horizon Journey, players step into the boots of a member of the 17th Endeavor Mission in the year 2053. Your mission: survive the hostile Martian environment, establish a foothold for humanity, and begin the monumental task of terraforming. This is not just another sci-fi backdrop; Horizon Journey offers a vast, explorable Mars rendered with unparalleled realism, presenting unique survival challenges drawn from the planet's actual conditions.

China is pushing forward with its HBM (High Bandwidth Memory) progress as part of its plan to be self-sufficient in the semiconductor industry. JCET Group, China's top semiconductor packaging firm, has bought advanced TC (thermal compression) bonders that are usually used for 12-high stacks of HBM3E chips, according to Money Today Korea (MTN). This state-of-the-art equipment comes from Korean companies where export rules are less strict. This lets China jump from its current HBM2 technology to more advanced memory solutions. However, even if China isn't yet going to produce HBM3E chips soon, having this equipment is useful to boost manufacturing yields even for lower-spec HBM products.

China's desire to make HBM chips at home is a reaction to U.S. rules and taxes meant to hold back its chip abilities. These steps haven't slowed progress; instead, they have made China more determined to stand on its own in chip-making. The AI chip design market hit $18.4 billion last year and is set to grow 28% each year until 2032. The plan aims to supply Chinese-made HBM chips to big tech firms like Huawei, Tencent, and DeepSeek. This helps China get around U.S. export limits while moving its chip industry up in value. Choi Jae-hyeok, Professor of Electrical and Information Engineering, Seoul National University says, "In China's case, it is government-led... In the case of DDR, they are making up to DDR4 and DDR5. China has always wanted to move from low-value-added products to high-value-added products. The next direction is HBM..."

The global semiconductor industry is experiencing notable shifts, largely influenced by the rapid expansion of the Mainland China market. From 2010 to 2024, China's share of global semiconductor equipment sales rose significantly, from just 6% in 2010 to 38% in 2024. On the other side McKinsey reports that market shares in Taiwan, Korea and Japan are declining. Taiwan has started to build semiconductor fabs in the US and Europe, while Japan has seen few new fab projects despite TSMC's upcoming Kumamoto plant. At the same time, the US and Europe, the Middle East, and Africa have kept their market shares steady.

Globalization helped the semiconductor industry grow from 2010 to 2019, during this time Chinese semiconductor companies expanded, with local firms growing by about 21% each year. But growth slowed from 2019 to 2023 because of US sanctions on Huawei which affected its chip division HiSilicon. Even without HiSilicon, China's semiconductor industry still grew by 9-10% in that period. Experts think this growth will continue in the future, a trend that the current US tariffs are only accentuating. China's growing importance in industries like electric vehicles (EVs) and commercial drones is pushing its semiconductor goals even further. In 2023, China accounted for 60% of all new EV registrations around the world. At the same time, political tensions between countries have made China more eager to build a self-reliant domestic semiconductor ecosystem. China is testing a domestic extreme ultraviolet (EUV) lithography system at Huawei's Dongguan facility. The system uses laser-induced discharge plasma technology and is scheduled for trial production in Q3 2025, with mass manufacturing planned for 2026.

Rugged embedded computing brand—Cincoze, recently launched 60 new industrial panel PCs based on the Meteor Lake PS platform, expanding the lineup of the Display Computing-CRYSTAL product line to meet increasing performance requirements for edge AI applications. These latest models support Intel Core Ultra i7/i5/i3 processors, include rich native I/O interfaces, and support various expansion sockets, such as M.2 Key E, Key B, and PCI/PCIe expansion slots (P2302E only) to maximize flexibility and help customers meet rapidly-changing application requirements. The new models include industrial panel PCs, sunlight readable panel PCs, and open frame panel PCs for comprehensive coverage of every display computing need.

Improved performance x Power-Saving x AI Boost
Enhanced performance comes courtesy of the latest Intel 4 Core Ultra i7/i5/i3 U series (Meteor Lake-PS) processors, with up to 12 cores and only 15 W low power consumption, providing 1.8x the performance of the previous models. The new built-in Intel NPU delivers faster and more efficient AI boost capabilities for high-volume image processing and AI recognition. There is a dynamic thermal mechanism that automatically adjusts tolerances in all directions to ensure the closest fit between the upper cover and the CPU heat sink. These adjustments solve the heat dissipation challenges of high-performance computing and allow the CPU to operate at full performance.

OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs. OTC is seeking to establish mass production technology by October 2025 at its Joetsu Plant in Joetsu City, Niigata Prefecture, which has a proven track record and advanced development and production capabilities in the field of high multilayer, high-precision, large-format PCBs for semiconductor inspection equipment.

AI processing requires the transmission of vast data volumes between graphics processing unit (GPU) semiconductors and memory. As semiconductor performance increases, the memory installed is also required to have high-speed, high-frequency, and high-density data transfer capabilities. HBM features a stacked DRAM structure, requiring technology capable of fabricating wafers even more thinly and precisely. This configuration also requires that the PCBs used in inspection equipment meet even higher levels of performance and quality.

Fanatec, a brand of Corsair and the global leader in sim racing hardware, proudly announces the launch of the CSL Elite Steering Wheel Porsche Vision GT. This officially licensed steering wheel, inspired by the Porsche Vision Gran Turismo concept car in Gran Turismo 7, brings Porsche's visionary design to sim racers worldwide. The CSL Elite Steering Wheel Porsche Vision GT features a 310 mm diameter and a robust cast aluminium frame that balances strength and lightness, making it suitable for the full range of Fanatec bases—from the 5 Nm CSL DD to the 25 Nm Podium DD2. To retain the signature shape and spoke cutouts, our engineers developed an innovative shifter mechanism, delivering a uniquely tactile response.

This is the first wheel to use Fanatec's new Tactaris material. This premium microfiber fabric enhances durability, comfort, and handling during intense racing sessions. Ergonomically optimized for sim racing, the CSL Elite Steering Wheel Porsche Vision GT features a versatile input layout, including two buttons built into the rim—another first for a Fanatec wheel. It features seven rotary encoders, including two multi-position switches and a 7-way FunkySwitch. The four primary encoders are automatically assigned to Gran Turismo 7's MFD system, allowing quick access to traction control, brake balance, torque split, and fuel mapping. The Tuning Menu button is seamlessly integrated into the Porsche crest, allowing for real-time force feedback adjustments via the OLED display.

The Taiwan media is reporting that Foxconn has been busy moving more and more of its production from China to India, with the main focus being on Apple's iPhone and iPad products for now. Foxconn has been producing iPhones for the Indian market in India since 2019, but the story here is that China has banned Foxconn from sending Chinese staff to India to train the local staff and oversee the production. This has resulted in Foxconn having to send staff from Taiwan to India instead, but they might not be as familiar with the entire production process as the ones that are based in the factories in China.

This is only part of the issue though, as the news reports are also mentioning that China is preventing Foxconn from sending machines and equipment needed for the production to India. The same issue is said to be affecting other Taiwanese companies that are moving some of their production out of China to India, but they've had no issues when it comes to sending equipment to other nations in South East Asia. The equipment is apparently not possible to produce locally in India either, which means that these companies are more or less being forced to keep their production in China. To work around this issue, Foxconn is said to be sending half-finished phones and components to India, to do the final assembly there, to keep up production in India. So far, this is just rumours out of Taiwan, but it looks like China is intent on keeping the production on its shores for as long as it can.

As the US works to bring more semiconductor manufacturing back home, the machines needed to turn silicon into the world's most advanced processors are becoming pricier and harder to get, thanks to tariffs. Foundries building new fabs report that the specialized equipment they rely on, everything from extreme ultraviolet (EUV) lithography steppers to chemical vapor deposition chambers, carries a roughly 15% premium compared with similar gear sold overseas. Several forces are at play. The raw materials, high‑grade quartz for vacuum enclosures, and exotic metal alloys for precision optics have climbed in price. At the same time, key components like ultra‑accurate motion stages and alignment sensors are in short supply, sometimes stretching lead times for critical subsystems well beyond 18 months. For a fab racing to move from a 7 nm to a 5 nm process, those delays can mean missing tight ramp‑up targets and pushing out product launches.

Smaller chipmakers feel the squeeze the hardest. With fewer orders to negotiate volume discounts, second‑tier foundries may see their capital budgets balloon by 20 percent or more. In response, some are taking a mixed approach, sourcing commoditized tools such as oxidation furnaces and rapid thermal processors from multiple suppliers while reserving single‑vendor deals for high‑stakes systems like EUV scanners. Government support through the CHIPS Act offers a partial safety net, helping to subsidize capital expenditures. Yet even with grants and tax credits, the challenges will remain. Success will hinge on tight coordination between fabs, equipment makers, and policymakers to tame rising costs, shorten delivery schedules, and keep America's chip renaissance on track.

Samsung's foundry business seems to be busying itself with the rumored refinement of a 2 nm GAA (SF2) manufacturing node process—for possible mass production by the end of 2025, but company leadership will very likely be considering longer term goals. Mid-way through last month, industry moles posited that the megacorporation's semiconductor branch was questioning the future of a further out 1.4 nm (SF1.4) production line. Officially published roadmaps have this advanced technology rolling out by 2027. Despite present day "turmoil," insiders believe that a new team has been established—tasked with the creation of a so-called "dream semiconductor process." According to a fresh Sedaily news article, this fledgling department has started development of a 1 nm foundry process.

Anonymous sources claim that Samsung executives are keeping a watchful eye on a main competitor—as stated in the latest South Korean report: "there is a realistic gap with Taiwan's TSMC in technologies that are close to mass production, such as the 2 nm process, the company plans to speed up the development of the 1 nm process, a future technology, to create an opportunity for a turnaround." A portion of the alleged "1 nm development chip team" reportedly consists of veteran researchers from prior-gen projects. Semiconductor industry watchdogs theorize that a canceled SF1.4 line could be replaced by an even more advanced process. Sedaily outlined necessary hardware upgrades: "the 1.0 nanometer process requires a new technology concept that breaks the mold of existing designs as well as the introduction of next-generation equipment such as high-NA EUV exposure equipment. The company is targeting mass production after 2029." Samsung's current Advanced Technology Roadmap does not extend beyond 2027—inside sources claim that the decision to roll with 1.0 nm was made at some point last month.

According to a report produced by semiconductor industry analysts at Kiwoom Securities—a South Korean financial services firm—Semiconductor Manufacturing International Corporation (SMIC) is expected to complete the development of a 5 nm process at some point in 2025. Jukanlosreve summarized this projection in a recent social media post. SMIC is often considered to be China's flagship foundry business; the partially state-owned organization seems to heavily involved in the production of (rumored) next-gen Huawei Ascend 910 AI accelerators. SMIC foundry employees have reportedly struggled to break beyond a 7 nm manufacturing barrier, due to lack of readily accessible cutting-edge EUV equipment. As covered on TechPowerUp last month, leading lights within China's semiconductor industry are (allegedly) developing lithography solutions for cutting-edge 5 nm and 3 nm wafer production.

Huawei is reportedly evaluating an in-house developed laser-induced discharge plasma (LDP)-based machine, but finalized equipment will not be ready until 2026—at least for mass production purposes. Jukanlosreve's short interpretation of Kiwoom's report reads as follows: (SMIC) achieved mass production of the 7 nm (N+2) process without EUV and completed the development of the 5 nm process to support the mass production of the Huawei Ascend 910C. The cost of SMIC's 5 nm process is 40-50% higher than TSMC's, and its yield is roughly one-third." The nation's foundries are reliant on older ASML equipment, thus are unable to produce products that can compete with the advanced (volume and quality) output of "global" TSMC and Samsung chip manufacturing facilities. The fresh unveiling of SiCarrier's Color Mountain series has signalled a promising new era for China's foundry industry.

ASUS Republic of Gamers (ROG) and Team Vitality are delighted to announce the extension of their partnership. As of today, Team Vitality's Counter-Strike 2 and VALORANT teams will also benefit from a full range of ROG laptops, desktops and handheld consoles, providing them with even better hardware on their road toward excellence.

Thanks to this new phase of collaboration, Team Vitality players will benefit from cutting-edge gaming equipment, adapted to the demands of the highest competitive level. These computers will offer unrivalled processing power, ultra-high refresh rates and minimal latency, guaranteeing maximum precision and responsiveness in both training and competition. This partnership with Team Vitality marks a further step in ROG's drive to innovate and offer professional and amateur gamers alike an increasingly immersive and high-performance gaming experience.

In industrial environments, equipment runs 24/7, handling frequent and intensive write operations. To support these demanding workloads, storage solutions must offer high endurance to extend lifespan, minimize downtime, and lower Total Cost of Ownership (TCO). Designed to meet these demands, the Cervoz T455 Series, M.2 2280 NVMe SSD delivers 35% greater endurance through a refined firmware architecture and proven storage technologies. Ideal for industrial automation, edge computing, and high-performance computing (HPC), it ensures reliable performance under heavy workloads.

Enhanced Endurance for Demanding Industrial Applications—Over-Provisioning Technology: Endurance SSD Performance and Longevity
Cervoz's Over-Provisioning technology optimizes SSD performance by reserving extra storage space, boosting efficiency, and extending lifespan. How SSD Over-Provisioning Delivers Benefits:

• Extended Lifespan: Efficiently reserves additional storage space, enhancing NAND durability at least 35%.
• Consistent Performance: Maintains steady performance levels even under high-intensity workloads.
• Optimized Resource Management: Reserved space allocation for optimal write efficiency.

SiCarrier, a Huawei-backed Chinese semiconductor tool manufacturer, has launched a comprehensive suite of semiconductor manufacturing tools at this year's Semicon China. These tools are strategically essential to China's semiconductor self-sufficiency and a major step towards competitive nodes from the mainland. The new lineup spans multiple categories: optical inspection, deposition, etch, metrology, and electrical performance testing. Until now, Chinese chipmakers often depended on older-generation foreign equipment, but SiCarrier's new lineup promises domestic alternatives tailored to modern manufacturing processes. The tools address every stage of semiconductor fabrication, from inspecting microscopic defects to etching intricate circuits.

For quality control, SiCarrier's Color Mountain series functions like a high-powered microscope, using intense lighting and advanced imaging algorithms to examine both sides of silicon wafers for flaws as small as dust particles. Complementing this, the Sky Mountain series ensures the perfect alignment of circuit layers, which need perfect stacking, using diffraction-based measurements (analyzing light patterns) and direct image comparisons. The New Mountain suite combines specialized tools to analyze materials at the atomic level. One standout is the atomic force microscope (AFM), which maps surface topography with a nanoscale "finger," while X-ray techniques (XPS, XRD, XRF) act like forensic tools, revealing the chemical composition, crystal structure, and elemental makeup.

Global fab equipment spending for front-end facilities in 2025 is anticipated to increase by 2% year-over-year (YoY) to $110 billion, marking the sixth consecutive year of growth since 2020, SEMI announced today in its latest quarterly World Fab Forecast report.

Fab equipment spending is projected to rise by 18% in the following year, reaching $130 billion. This growth in investment is driven not only by demand in the high-performance computing (HPC) and memory sectors to support data center expansions, but also by the increasing integration of artificial intelligence (AI), which is driving up the silicon content required for edge devices.

It's been nearly one month since the release of Monster Hunter Wilds on PC and modern consoles! Thank you to all hunters around the world for your incredible support. Whether you're a series veteran with many hunts under your belt, or started your hunting journey with Wilds, we hope you've been enjoying making your way through the game and putting in many hours of hunts in High Rank, long after the credits have rolled. Today, we're excited to share what's next for Monster Hunter Wilds by taking the wraps off of the game's first Free Title Update.

The graceful Leviathan Mizutsune makes its way to the Wilds
Equal parts dazzling and dangerous, Mizutsune moves almost as if it's dancing, and skillfully attacks foes with debilitating bubbles. Get your gear ready to take on this returning monster for the first time in Monster Hunter Wilds. Mizutsune also comes with stylish new armor sets to forge for your hunter and Palico. An eight-star Tempered Mizutsune will also appear. To start the Mizutsune hunt, talk to Kanya in the Scarlet Forest Base Camp at Hunter Rank (HR)21 or above.

2K announces that PGA TOUR 2K25, the newest entry in the golf simulation franchise from HB Studios, is now available worldwide on Xbox Series X|S, PlayStation 5, and PC via Steam. Players can step onto the tee box and take their best shot at golf glory with several franchise advancements, including upgraded graphics and the addition of new EvoSwing mechanics, which offer a host of new shot types, ball flights, roll physics, and visual improvements. The new Perfect Swing difficulty setting offers beginner players a more forgiving intuitive experience and veteran players a more relaxing round. The most immersive and customizable PGA TOUR 2K MyPLAYER and MyCAREER experience to date offers a diverse suite of customization options, while the franchise's signature Course Designer offers new tools to allow players more freedom to create their dream courses and share them with the global community.

"We've reached a major milestone in the evolution of the franchise with PGA TOUR 2K25," said Dennis Ceccarelli, Senior Vice President and General Manager, Sports at 2K. "From the moment players step onto the digital tee box, they'll feel the difference—whether it's the precision of EvoSwing, the ease of Perfect Swing or the depth of our all-new progression systems. With enhanced realism, refined gameplay and three Major Championships, PGA TOUR 2K25 delivers the most immersive and rewarding golf experience ever made."

pureLiFi, the global leader in LiFi technology, has announced the launch of its ground-breaking LINXC Bridge system, at Mobile World Congress Barcelona. Developed with Solace Power, this innovative solution empowers Fixed Wireless Access (FWA) broadband providers to deliver self-installable, higher quality and more reliable connectivity to consumers using outdoor Customer Premises Equipment (CPE). With this solution broadband customers will experience much faster installation times, more reliable speeds and an improved user experience.

The LINXC Bridge streamlines broadband deployment, eliminating complex installations, significantly reducing subscriber acquisition cost, shortening time to revenue and increasing customer satisfaction. The LINXC Bridge system will be showcased live at the pureLiFi booth (7B27) alongside the latest cutting-edge CPE equipment from demonstration collaborators, Sonim Technologies.

SoftBank Corp., ZutaCore and Hon Hai Technology Group ("Foxconn") today announced they implemented ZutaCore's two-phase DLC (Direct Liquid Cooling) technology in an AI server using NVIDIA accelerated computing, making it the world's first implementation of ZutaCore's two-phase DLC (Direct Liquid Cooling) technology using NVIDIA H200 GPUs. In addition, SoftBank designed and developed a rack-integrated solution that integrates each component of the server, including cooling equipment with two-phase DLC technology, on a rack scale, and conducted an operational demonstration and performance evaluation at its data center in February 2025. The demonstration results indicated the solution passed NVIDIA's temperature test (NVQual), thereby confirming the compatibility, stability and reliability of this rack-integrated solution. The solution also achieved pPUE (partial Power Usage Effectiveness) of 1.03 (actual measured value) per rack for cooling efficiency

With the spread and increased adoption of AI, demand for AI servers and other computing resources is expected to expand significantly, further increasing power consumption at data centers. At the same time, reducing power consumption from the perspective of reducing carbon dioxide (CO2) emissions has become a pressing issue worldwide, requiring data centers to become more efficient, consume less power, and introduce innovative heat removal solutions. Since May 2024, SoftBank has been collaborating with ZutaCore, a global leader in the development and business deployment of two-phase DLC technology, to develop solutions optimized for low power consumption at AI data centers.

ENDORFY is expanding its product portfolio with two low-profile microphone arms: ENDORFY Broadcast Low Profile Boom Arm and ENDORFY Broadcast Low Profile RGB Boom Arm. Designed with professionals and tech enthusiasts in mind, they combine functional design, aesthetic looks and solid workmanship making it a perfect combo for content creators, gamers, streamers, podcasters and remote employees.

Comfort and Broad Compatibility
Both microphone arms provide functionality and comfort of use. Their simple, yet solid construction saves valuable space when placed on a desk or table, ensuring the stability of mounted equipment. To simplify content creation and framing, the ENDORFY Broadcast Low Profile Boom Arm and the ENDORFY Broadcast Low Profile RGB Boom Arm can be locked in almost any position - including the space right below a monitor.

China's dominance in semiconductor equipment procurement is expected to face its first setback since 2021, with spending projected to decrease from $41 billion to $38 billion in 2025, according to semiconductor research firm TechInsights. This 6% decline marks a significant shift for the world's largest buyer of wafer fabrication equipment, whose purchases represented 40% of global sales in 2024. The downturn reflects mounting pressures from both market dynamics and geopolitical constraints. US export controls targeting advanced semiconductor capabilities have intensified while domestic chipmakers grapple with overcapacity in mature node segments. SMIC, China's leading foundry, has already signaled concerns about oversupply risks in this sector, where Chinese manufacturers have rapidly expanded their market share against Taiwanese competitors.

Despite these headwinds, Chinese equipment manufacturers have notably advanced domestic capability development. Naura Technology Group has emerged as the seventh-largest global equipment manufacturer, while AMEC continues to expand its international presence. However, critical gaps persist in China's semiconductor equipment ecosystem, particularly in lithography systems, where dependence on foreign suppliers like ASML remains high. TechInsights data reveals that Chinese companies supplied only 17% of testing tools and 10% of domestic assembly equipment in 2023. The spending reduction comes after a period of aggressive stockpiling prompted by US sanctions to limit Beijing's access to advanced chipmaking capabilities, especially those applicable to artificial intelligence and military applications. However, Chinese manufacturers have demonstrated resilience, with SMIC and Huawei successfully producing advanced chips through alternative, albeit more costly, manufacturing methods.

TSMC has unveiled today its board meeting decisions, the chip giant has greenlit a massive US$17 billion investment to boost production capacity. According to TSMC, to meet long-term capacity plans based on market demand forecasts and TSMC's technology development roadmap, the board approved capital appropriations of approximately US$17.14 billion for installation and upgrade of advanced technology capacity, installation and upgrade of advanced packaging, mature and/or specialty technology capacity, fab construction, and installation of fab facility systems.

Previous reports by MoneyDJ suggested that TSMC might unveil plans for a third Arizona fab, a potential fourth fab, or its first advanced packaging plant after the board meeting. However, no updates have been confirmed yet. Industry sources suggested that TSMC's second Arizona fab, featuring 3 nm, will likely go ahead of schedule, providing a temporary response to U.S. pressures. According to the same report, TSMC's second Arizona fab is expected to begin equipment installation in mid-2026, with mass production expected by 2027. Notably, this progress would exceed TSMC's projections which expected the second plant to start 3 nm and 2 nm production in 2028, with a third plant potentially for the 2 nm process by the late 2030s. The MoneyDJ report further notes that initially, TSMC's second Arizona plant will offer 25K-30K 3 nm wafers per month. TSMC's first Arizona plant, initially slated for 2025, started 4 nm production ahead of schedule in Q4 2024.

TechInsights has identified CXMT's new 16 nm DRAM chips in Gloway DDR-6000 UDIMM modules, confirming advancement in the Chinese memory industry. The CXMT 16 Gb DDR5 chip measures 67 square millimeters with a density of 0.239 Gb per square millimeter. The G4 DRAM cells are 20 percent smaller than CXMT's previous G3 generation. This follows the company's progression from 23 nm (G1) and 18 nm (G2) nodes. Despite this advancement, CXMT remains approximately three years behind Samsung, SK Hynix, and Micron in manufacturing capabilities. The Hefei-based company achieved this production milestone under US sanctions restricting access to certain manufacturing equipment and materials, setting it back years in gaining production of advanced memory nodes.

TechInsights found these chips in commercially available memory modules, confirming CXMT's entry into DDR5 production. DDR5 technology is projected to be the primary DRAM standard through 2027. The three major DRAM manufacturers have been producing DDR5 through multiple generations, with DDR5 now reaching 10,000 MT/s speeds. This represents CXMT's first DDR5 DRAM product to reach the consumer market. The chips meet basic compatibility requirements for current DDR5 specifications, meaning that the Chinese memory manufacturing has achieved "1z" memory manufacturing on its soil. This marks the second major news for the Chinese semiconductor industry, right after TechInsights also confirmed that YMTC has started shipping 292-layer NAND Flash. With domestic demand for memory and storage projected to remain strong, we wonder if the supply will exceed demand and allow some left-over chips for worldwide usage.